loadpatents
name:-0.010236978530884
name:-0.004918098449707
name:-0.0051920413970947
Doan; Kenny Linh Patent Filings

Doan; Kenny Linh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Doan; Kenny Linh.The latest application filed is for "using bias rf pulsing to effectively clean electrostatic chuck (esc)".

Company Profile
3.7.12
  • Doan; Kenny Linh - Santa Clara CA
  • Doan; Kenny Linh - San Jose CA US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Using bias RF pulsing to effectively clean electrostatic chuck (ESC)
Grant 10,410,845 - Doan , et al. Sept
2019-09-10
Using Bias Rf Pulsing To Effectively Clean Electrostatic Chuck (esc)
App 20190157052 - DOAN; Kenny Linh ;   et al.
2019-05-23
Boron-doped carbon-based hardmask etch processing
Grant 9,129,911 - Doan , et al. September 8, 2
2015-09-08
Process Kit For Edge Critical Dimension Uniformity Control
App 20150001180 - DOAN; Kenny Linh ;   et al.
2015-01-01
Etch Process Having Adaptive Control With Etch Depth Of Pressure And Power
App 20140342570 - Doan; Kenny Linh ;   et al.
2014-11-20
Boron-doped Carbon-based Hardmask Etch Processing
App 20140213059 - Doan; Kenny Linh ;   et al.
2014-07-31
Plasma etch processes for boron-doped carbonaceous mask layers
Grant 8,778,207 - Kim , et al. July 15, 2
2014-07-15
Method for etching substrate
Grant 8,668,837 - Doan , et al. March 11, 2
2014-03-11
Method Of Etching High Aspect Ratio Features In A Dielectric Layer
App 20130122712 - KIM; Jong Mun ;   et al.
2013-05-16
Plasma Etch Processes For Boron-doped Carbonaceous Mask Layers
App 20130109188 - KIM; Jong Mun ;   et al.
2013-05-02
Method For Etching Substrate
App 20130092656 - Doan; Kenny Linh ;   et al.
2013-04-18
Methods For Forming High Aspect Ratio Features On A Substrate
App 20100330805 - DOAN; KENNY LINH ;   et al.
2010-12-30

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