Do; Won Chul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Do; Won Chul.The latest application filed is for "semiconductor device and method of manufacturing a semiconductor device".

Company Profile

25.59.52

Do; Won Chul - Bucheon-si KR
Do; Won Chul - Seoul KR
Do; Won Chul - Gyeonggi-do KR
Do; Won Chul - Kyunggi-do KR
Do; Won Chul - Incheon KR
- Seoul KR
Do; Won Chul - Kwanggin-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device package and manufacturing method thereof Grant 11,424,155 - Kelly , et al. August 23, 2	2022-08-23
Semiconductor device and method of manufacturing a semiconductor device App 20220238441 - Kim; Tae Ki ; et al.	2022-07-28
Semiconductor Device And Manufacturing Method Thereof App 20220165582 - Kim; Dong Jin ; et al.	2022-05-26
Semiconductor Device And Method Of Manufacturing Thereof App 20220068889 - Lee; Won Geol ; et al.	2022-03-03
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices App 20220005787 - Han; Yi Seul ; et al.	2022-01-06
Semiconductor Device And Manufacturing Method Thereof App 20210398930 - Bae; Jae Hun ; et al.	2021-12-23
Semiconductor device and manufacturing method thereof Grant 11,195,726 - Kim , et al. December 7, 2	2021-12-07
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices App 20210296249 - Khim; Jin Young ; et al.	2021-09-23
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices App 20210296248 - Khim; Jin Young ; et al.	2021-09-23
Semiconductor Device And Manufacturing Method Thereof App 20210265174 - Do; Won Chul ; et al.	2021-08-26
Semiconductor device and method of manufacturing thereof Grant 11,081,470 - Lee , et al. August 3, 2	2021-08-03
Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrode Grant 11,043,458 - Do , et al. June 22, 2	2021-06-22
Semiconductor device Grant 11,018,107 - Bae , et al. May 25, 2	2021-05-25
Semiconductor device and manufacturing method thereof Grant 10,985,031 - Do , et al. April 20, 2	2021-04-20
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices App 20210066093 - Kim; Jae Yoon ; et al.	2021-03-04
Semiconductor Device And Manufacturing Method Thereof App 20210020591 - Paek; Jong Sik ; et al.	2021-01-21
Semiconductor Package And Fabricating Method Thereof App 20210020605 - Hiner; David ; et al.	2021-01-21
Method of manufacturing a semiconductor device Grant 10,867,956 - Do , et al. December 15, 2	2020-12-15
Semiconductor Device Package And Manufacturing Method Thereof App 20200343129 - Kelly; Michael G. ; et al.	2020-10-29
Semiconductor Device And Method Of Manufacturing A Semiconductor Device App 20200335441 - Kim; Tae Ki ; et al.	2020-10-22
Semiconductor Device And Manufacturing Method Thereof App 20200321222 - Kim; Dong Jin ; et al.	2020-10-08
Semiconductor device package and manufacturing method thereof Grant 10,714,378 - Kelly , et al.	2020-07-14
Semiconductor Device And Method Of Manufacturing Thereof App 20200219849 - Lee; Won Geol ; et al.	2020-07-09
Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof Grant 10,679,952 - Paek , et al.	2020-06-09
Conductive Pad On Protruding Through Electrode Semiconductor Device And Method Of Manufacturing App 20200126918 - Do; Won Chul ; et al.	2020-04-23
Semiconductor Device And Manufacturing Method Thereof App 20200051944 - Bae; Jae Hun ; et al.	2020-02-13
Semiconductor device and manufacturing method thereof Grant 10,553,451 - Kim , et al. Fe	2020-02-04
Semiconductor device and manufacturing method thereof Grant 10,483,222 - Paek , et al. Nov	2019-11-19
Semiconductor device having stacked dies and stacked pillars and method of manufacturing thereof Grant 10,475,770 - Lee , et al. Nov	2019-11-12
Semiconductor Device Package And Manufacturing Method Thereof App 20190326161 - Kelly; Michael G. ; et al.	2019-10-24
Semiconductor Device And Manufacturing Method Thereof App 20190279881 - Do; Won Chul ; et al.	2019-09-12
Electronic device comprising a conductive pad on a protruding-through electrode Grant 10,410,967 - Do , et al. Sept	2019-09-10
Semiconductor device and manufacturing method thereof Grant 10,388,582 - Kim , et al. A	2019-08-20
Semiconductor device and manufacturing method thereof Grant 10,340,244 - Bae , et al.	2019-07-02
Semiconductor device and manufacturing method thereof Grant 10,297,466 - Do , et al.	2019-05-21
Semiconductor device package and manufacturing method thereof Grant 10,283,400 - Kelly , et al.	2019-05-07
Semiconductor device package and manufacturing method thereof Grant 10,090,234 - Kelly , et al. October 2, 2	2018-10-02
Semiconductor Device And Manufacturing Method Thereof App 20180261468 - Do; Won Chul ; et al.	2018-09-13
Semiconductor Device And Method Of Manufacturing Thereof App 20180247916 - Lee; Won Geol ; et al.	2018-08-30
Semiconductor Device And Manufacturing Method Thereof App 20180226312 - Kim; Young Rae ; et al.	2018-08-09
Semiconductor Device And Manufacturing Method Thereof App 20180211929 - Bae; Jae Hun ; et al.	2018-07-26
Semiconductor device package and manufacturing method thereof Grant 9,966,300 - Kelly , et al. May 8, 2	2018-05-08
Semiconductor device and manufacturing method thereof Grant 9,966,276 - Do , et al. May 8, 2	2018-05-08
Semiconductor device comprising a conductive pad on a protruding-through electrode Grant 9,947,623 - Do , et al. April 17, 2	2018-04-17
Semiconductor device and manufacturing method thereof Grant 9,941,180 - Kim , et al. April 10, 2	2018-04-10
Semiconductor device and manufacturing method thereof Grant 9,793,180 - Ahn , et al. October 17, 2	2017-10-17
Semiconductor device and manufacturing method thereof Grant 9,728,514 - Paek , et al. August 8, 2	2017-08-08
Semiconductor Device Package and Manufacturing Method Thereof App 20170186679 - Kelly; Michael G. ; et al.	2017-06-29
Semiconductor Device And Manufacturing Method Thereof App 20170154861 - Paek; Jong Sik ; et al.	2017-06-01
Semiconductor Device And Manufacturing Method Thereof App 20170125264 - Do; Won Chul ; et al.	2017-05-04
Semiconductor Device And Manufacturing Method Thereof App 20170117200 - Kim; Young Rae ; et al.	2017-04-27
Method of manufacturing a semiconductor package Grant 9,627,353 - Kelly , et al. April 18, 2	2017-04-18
Semiconductor device package and manufacturing method thereof Grant 9,553,041 - Kelly , et al. January 24, 2	2017-01-24
Method of manufacturing a semiconductor package App 20170005070 - Kelly; Michael G. ; et al.	2017-01-05
Semiconductor device and manufacturing method thereof Grant 9,536,858 - Do , et al. January 3, 2	2017-01-03
Semiconductor device and manufacturing method thereof Grant 9,524,906 - Paek , et al. December 20, 2	2016-12-20
Semiconductor Device And Manufacturing Method Thereof App 20160322317 - Paek; Jong Sik ; et al.	2016-11-03
Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives Grant 9,437,575 - Kelly , et al. September 6, 2	2016-09-06
Conductive pad on protruding through electrode Grant 9,431,323 - Do , et al. August 30, 2	2016-08-30
Semiconductor device and manufacturing method thereof Grant 9,391,043 - Paek , et al. July 12, 2	2016-07-12
Leadframe and semiconductor package made using the leadframe Grant 9,362,210 - Ahn , et al. June 7, 2	2016-06-07
Semiconductor device package and manufacturing method thereof Grant 9,349,681 - Kelly , et al. May 24, 2	2016-05-24
Method Of Manufacturing A Semiconductor Device App 20160079201 - Do; Won Chul ; et al.	2016-03-17
Semiconductor device utilizing redistribution layers to couple stacked die Grant 9,190,370 - Paek , et al. November 17, 2	2015-11-17
Semiconductor Device Utilizing Redistribution Layers To Couple Stacked Die App 20150262945 - Paek; Jong Sik ; et al.	2015-09-17
Method and system for a semiconductor for device package with a die-to-packaging substrate first bond Grant 9,136,159 - Kelly , et al. September 15, 2	2015-09-15
Semiconductor Device And Manufacturing Method Thereof App 20150255422 - Paek; Jong Sik ; et al.	2015-09-10
Semiconductor Device With Reduced Warpage App 20150255426 - Son; Seung Nam ; et al.	2015-09-10
Semiconductor Device And Manufacturing Method Thereof App 20150206807 - Ahn; Seo Yeon ; et al.	2015-07-23
Semiconductor Device And Manufacturing Method Thereof App 20150200179 - Do; Won Chul ; et al.	2015-07-16
Semiconductor device and manufacturing method thereof Grant 9,048,125 - Paek , et al. June 2, 2	2015-06-02
Semiconductor device utilzing redistribution layers to couple stacked die Grant 9,048,241 - Paek , et al. June 2, 2	2015-06-02
Method and system for a semiconductor device package with a die to interposer wafer first bond Grant 9,040,349 - Kelly , et al. May 26, 2	2015-05-26
Semiconductor device and manufacturing method thereof Grant 9,000,586 - Do , et al. April 7, 2	2015-04-07
Conductive pad on protruding through electrode semiconductor device Grant 8,981,572 - Do , et al. March 17, 2	2015-03-17
Semiconductor Device With Plated Conductive Pillar Coupling App 20150021767 - Park; Doo Hyun ; et al.	2015-01-22
Semiconductor Device Utilzing Redistribution Layers To Couple Stacked Die App 20150014830 - Paek; Jong Sik ; et al.	2015-01-15
Semiconductor device and manufacturing method thereof Grant 8,900,995 - Do , et al. December 2, 2	2014-12-02
Method and system for a semiconductor device package with a die-to-die first bond Grant 8,796,072 - Kelly , et al. August 5, 2	2014-08-05
Semiconductor Device And Manufacturing Method Thereof App 20140138817 - Paek; Jong Sik ; et al.	2014-05-22
Method And System For A Semiconductor Device Package With A Die To Interposer Wafer First Bond App 20140134796 - Kelly; Michael G. ; et al.	2014-05-15
Method And System For A Semiconductor For Device Package With A Die-To-Packaging Substrate First Bond App 20140134804 - Kelly; Michael G. ; et al.	2014-05-15
Method And System For A Semiconductor Device Package With A Die-To-Die First Bond App 20140134803 - Kelly; Michael G. ; et al.	2014-05-15
Semiconductor Device And Manufacturing Method Thereof App 20140131856 - Do; Won Chul ; et al.	2014-05-15
Semiconductor device and fabricating method thereof Grant 8,618,658 - Paek , et al. December 31, 2	2013-12-31
Semiconductor device and fabricating method thereof Grant 08618658 -	2013-12-31
Conductive pad on protruding through electrode semiconductor device Grant 8,552,548 - Do , et al. October 8, 2	2013-10-08
Leadframe And Semiconductor Package Made Using The Leadframe App 20130181335 - Ahn; Byung Hoon ; et al.	2013-07-18
Semiconductor device having through electrodes protruding from dielectric layer Grant 8,487,445 - Do , et al. July 16, 2	2013-07-16
Leadframe and semiconductor package made using the leadframe Grant 8,410,585 - Ahn , et al. April 2, 2	2013-04-02
Semiconductor device and manufacturing method thereof Grant 8,362,612 - Paek , et al. January 29, 2	2013-01-29
Wafer level package and its manufacturing method App 20070018322 - Park; In Bae ; et al.	2007-01-25
Semiconductor package including leads and conductive posts for providing increased functionality Grant 7,138,707 - Lee , et al. November 21, 2	2006-11-21
Leadframe and semiconductor package made using the leadframe App 20060151858 - Ahn; Byung Hoon ; et al.	2006-07-13
Leadframe and semiconductor package made using the leadframe Grant 7,042,068 - Ahn , et al. May 9, 2	2006-05-09
Leadframe and semiconductor package made using the leadframe App 20050029638 - Ahn, Byung Hoon ; et al.	2005-02-10

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