Do; Huong T.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Do; Huong T..The latest application filed is for "package substrate inductor having thermal interconnect structures".
- Do; Huong T. - Chandler AZ
- Do; Huong T. - Scottsdale AZ
| Patent | Date |
|---|---|
| Package Substrate Inductor Having Thermal Interconnect Structures App 20220240370 - Hill; Michael J. ; et al. | 2022-07-28 |
| Package substrate inductor having thermal interconnect structures Grant 11,357,096 - Hill , et al. June 7, 2 | 2022-06-07 |
| Package Substrate Inductor Having Thermal Interconnect Structures App 20200015348 - Hill; Michael J. ; et al. | 2020-01-09 |
| Hybrid capacitor, circuit, and system Grant 6,920,051 - Figueroa , et al. July 19, 2 | 2005-07-19 |
| Multiple tier array capacitor Grant 6,532,143 - Figueroa , et al. March 11, 2 | 2003-03-11 |
| Capacitor with extended surface lands and method of fabrication therefor Grant 6,483,692 - Figueroa , et al. November 19, 2 | 2002-11-19 |
| Dual-socket interposer and method of fabrication therefor Grant 6,469,908 - Patel , et al. October 22, 2 | 2002-10-22 |
| Hybrid capacitor, circuit, and system App 20020134581 - Figueroa, David G. ; et al. | 2002-09-26 |
| Hybrid capacitor and method of fabrication therefor Grant 6,446,317 - Figueroa , et al. September 10, 2 | 2002-09-10 |
| Dual-socket interposer and method of fabrication therefor App 20020089833 - Patel, P.R. ; et al. | 2002-07-11 |
| Multiple tier array capacitor and methods of fabrication therefor App 20020085334 - Figueroa, David G. ; et al. | 2002-07-04 |
| Capacitor with extended surface lands and method of fabrication therefor App 20020075630 - Figueroa, David G. ; et al. | 2002-06-20 |
| Dual-socket interposer and method of fabrication therefor Grant 6,366,467 - Patel , et al. April 2, 2 | 2002-04-02 |
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