Do; Huong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Do; Huong.The latest application filed is for "package-integrated multi-turn coil embedded in a package magnetic core".

Company Profile

5.4.8

Do; Huong - Chandler AZ
Do; Huong - Scottsdale AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package-integrated Multi-turn Coil Embedded In A Package Magnetic Core App 20220310512 - Do; Huong ; et al.	2022-09-29
Multi-layer embedded magnetic inductor coil Grant 11,404,364 - Do , et al. August 2, 2	2022-08-02
Package-integrated multi-turn coil embedded in a package magnetic core Grant 11,393,751 - Do , et al. July 19, 2	2022-07-19
Package inductor having thermal solution structures Grant 11,335,620 - Hill , et al. May 17, 2	2022-05-17
Package Embedded Magnetic Power Transformers For Smps App 20220093314 - MODI; Anuj ; et al.	2022-03-24
Magnetic Wires And Their Applications App 20220085143 - CHOI; Beomseok ; et al.	2022-03-17
Via-in-via Structure For High Density Package Integrated Inductor App 20210098436 - Bharath; Krishna ; et al.	2021-04-01
Magnetic Core Inductors On Package Substrates App 20200066830 - Bharath; Krishna ; et al.	2020-02-27
Multi-layer Embedded Magnetic Inductor Coil App 20200066627 - Do; Huong ; et al.	2020-02-27
Package-integrated Multi-turn Coil Embedded In A Package Magnetic Core App 20200066634 - Do; Huong ; et al.	2020-02-27
Package Inductor Having Thermal Solution Structures App 20200020652 - Hill; Michael J. ; et al.	2020-01-16
Degassing hole design for olga trace impedance Grant 6,303,871 - Zu , et al. October 16, 2	2001-10-16

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