DO; Hoang Dinh
Patent Applications and Registrations
Patent applications and USPTO patent grants for DO; Hoang Dinh.The latest application filed is for "thermally-conductive electromagnetic interference (emi) absorbers with silicon carbide".
- DO; Hoang Dinh - Canton MA
| Patent | Date |
|---|---|
| Thermally-Conductive Electromagnetic Interference (EMI) Absorbers With Silicon Carbide App 20220142020 - DO; Hoang Dinh ; et al. | 2022-05-05 |
| Low Dielectric, Low Loss Radomes App 20220029282 - DO; Hoang Dinh ; et al. | 2022-01-27 |
| Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide Grant 11,229,147 - Do , et al. January 18, 2 | 2022-01-18 |
| Patterned Electromagnetic Interference (emi) Mitigation Materials Including Carbon Nanotubes App 20200253096 - Kind Code | 2020-08-06 |
| Thermally-conductive Electromagnetic Interference (emi) Absorbers With Silicon Carbide App 20160233173 - Do; Hoang Dinh ; et al. | 2016-08-11 |
| Thermally-conductive Electromagnetic Interference (emi) Absorbers With Silicon Carbide App 20160234981 - Do; Hoang Dinh ; et al. | 2016-08-11 |
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