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name:-0.0051059722900391
name:-0.0068349838256836
name:-0.0027379989624023
Dixon; Forest Patent Filings

Dixon; Forest

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dixon; Forest.The latest application filed is for "semiconductor structure with strain reduction".

Company Profile
2.5.4
  • Dixon; Forest - Timnath CO
  • Dixon; Forest - Cedar Rapids IA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor structure with strain reduction
Grant 10,332,805 - Dungan , et al.
2019-06-25
Semiconductor Structure With Strain Reduction
App 20190131175 - Dungan; Thomas Edward ;   et al.
2019-05-02
Amplifier device comprising enhanced thermal transfer and structural features
Grant 9,653,586 - Dungan , et al. May 16, 2
2017-05-16
Amplifier Device Comprising Enhanced Thermal Transfer And Structural Features
App 20170062595 - Dungan; Thomas ;   et al.
2017-03-02
Moisture barrier for semiconductor structures with stress relief
Grant 9,576,920 - Abrokwah , et al. February 21, 2
2017-02-21
Moisture barrier for semiconductor structures with stress relief
Grant 9,508,661 - Abrokwah , et al. November 29, 2
2016-11-29
Moisture Barrier For Semiconductor Structures With Stress Relief
App 20160336284 - Abrokwah; Jonathan ;   et al.
2016-11-17
Moisture Barrier For Semiconductor Structures With Stress Relief
App 20160020179 - Abrokwah; Jonathan ;   et al.
2016-01-21
Tapered-impedance distributed switching power amplifiers
Grant 8,310,305 - Cripe , et al. November 13, 2
2012-11-13

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