Ditzel; Eckhard

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ditzel; Eckhard.The latest application filed is for "connection carrier, optoelectronic component and method for producing a connection carrier or an optoelectronic component".

Company Profile

3.9.10

Ditzel; Eckhard - Linsengericht DE
Ditzel; Eckhard - Erzhausen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of producing a connection support, connection support and optoelectronic semiconductor component comprising a connection support Grant 10,468,569 - Sorg , et al. No	2019-11-05
Connection Carrier, Optoelectronic Component and Method for Producing a Connection Carrier or an Optoelectronic Component App 20190097106 - Ditzel; Eckhard ; et al.	2019-03-28
Strip-type substrate for producing chip card modules Grant 10,176,420 - Ditzel , et al. J	2019-01-08
Method Of Producing A Connection Support, Connection Support And Optoelectronic Semiconductor Component Comprising A Connection Support App 20180138379 - Sorg; Jorg Erich ; et al.	2018-05-17
Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate Grant 9,941,197 - Ditzel , et al. April 10, 2	2018-04-10
Strip-type Substrate For Producing Chip Card Modules App 20180039875 - DITZEL; Eckhard ; et al.	2018-02-08
Chip-integrated through-plating of multi-layer substrates Grant 9,756,730 - Klein , et al. September 5, 2	2017-09-05
Strip-shaped Substrate For Producing Chip Carriers, Electronic Module With A Chip Carrier Of This Type, Electronic Device With A Module Of This Type, And Method For Producing A Substrate App 20170133313 - DITZEL; Eckhard ; et al.	2017-05-11
Optoelectronic component Grant 9,048,393 - Zitzlsperger , et al. June 2, 2	2015-06-02
Chip-integrated Through-plating Of Multi-layer Substrates App 20130223032 - Klein; Andreas Steffen ; et al.	2013-08-29
Laminate With Integrated Electronic Component App 20130215584 - Klein; Andreas ; et al.	2013-08-22
Optoelectronic Component App 20120139003 - Zitzlsperger; Michael ; et al.	2012-06-07
Laminated substrates for mounting electronic parts and methods for making same Grant 8,153,232 - Ditzel , et al. April 10, 2	2012-04-10
Laminated Substrates For Mounting Electronic Parts And Methods For Making Same App 20080220202 - DITZEL; Eckhard ; et al.	2008-09-11
Blind rivets and method for its manufacture Grant 5,496,140 - Gossmann , et al. March 5, 1	1996-03-05

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