Dittler; Roy
Patent Applications and Registrations
Patent applications and USPTO patent grants for Dittler; Roy.The latest application filed is for "electronic substrates having embedded inductors".
- Dittler; Roy - Chandler AZ
| Patent | Date |
|---|---|
| Apparatus with a substrate provided with plasma treatment Grant 11,291,122 - Grujicic , et al. March 29, 2 | 2022-03-29 |
| Electronic Substrates Having Embedded Inductors App 20220093535 - Duong; Benjamin ; et al. | 2022-03-24 |
| Electroless Plating Process App 20220010452 - NAIR; Chandrasekharan ; et al. | 2022-01-13 |
| Multiple Layer Copper Seeding App 20210090946 - GRUJICIC; Darko ; et al. | 2021-03-25 |
| Method For Forming Embedded Grounding Planes On Interconnect Layers App 20200328131 - MARIN; Brandon C. ; et al. | 2020-10-15 |
| Method for making a flexible wearable circuit Grant 10,798,817 - Aleksov , et al. October 6, 2 | 2020-10-06 |
| Selective Metal Deposition By Patterning Direct Electroless Metal Plating App 20200251332 - Kind Code | 2020-08-06 |
| Apparatus With A Substrate Provided With Plasma Treatment App 20200245472 - Kind Code | 2020-07-30 |
| Multi-layer Flexible/stretchable Electronic Package For Advanced Wearable Electronics App 20180376585 - Aleksov; Aleksandar ; et al. | 2018-12-27 |
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