Dispenza; John A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dispenza; John A..The latest application filed is for "initial strike-face layer for armor, a method of constructing an armor plate and armor".

Company Profile

0.9.4

Dispenza; John A. - Long Valley NJ US
Dispenza; John A. - Montville NJ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Protective layering process for circuit board EMI sheilding and thermal management Grant 9,900,988 - Chao , et al. February 20, 2	2018-02-20
Protective layering process for circuit boards Grant 9,860,992 - Chao , et al. January 2, 2	2018-01-02
Protective layering process for circuit boards Grant 9,254,588 - Chao , et al. February 9, 2	2016-02-09
Initial strike-face layer for armor, a method of constructing an armor plate and armor Grant 8,141,471 - DeCristofaro , et al. March 27, 2	2012-03-27
Initial Strike-face Layer For Armor, A Method Of Constructing An Armor Plate And Armor App 20090084256 - DeCristofaro; John L. ; et al.	2009-04-02
Device and method of forming a unitary electrically shielded panel Grant 6,865,805 - Dispenza , et al. March 15, 2	2005-03-15
Device and method of forming a unitary electrically shielded panel App 20040035599 - Dispenza, John A. ; et al.	2004-02-26
Heat exchanging apparatus and method of manufacture App 20030116309 - Dispenza, John A. ; et al.	2003-06-26
Device and method of forming a unitary electrically shielded panel App 20010018979 - Dispenza, John A. ; et al.	2001-09-06
Support bracket Grant 5,002,247 - Dispenza , et al. March 26, 1	1991-03-26
Wall-mounted microphone Grant D295,169 - Cho , et al. April 12, 1	1988-04-12

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