DISCO CORPORATION
Patent Applications and Registrations
Patent applications and USPTO patent grants for DISCO CORPORATION.The latest application filed is for "laser processing apparatus".
Company Profile
200.200.200
Trademarks
- DISCO CORPORATION - Tokyo JP
- DISCO CORPORATION - Toyo JP
- DISCO CORPORATION - Ota-ku, Tokyo JP
Trademarks
Patent Activity
| Patent | Date |
|---|---|
| Processing Apparatus App 20220308549 - OMORI; Takafumi | 2022-09-29 |
| Protective Sheet Sticking Apparatus App 20220310421 - KAKINUMA; Yoshinori | 2022-09-29 |
| Wafer Laminating Method App 20220310557 - NAKAMURA; Masaru | 2022-09-29 |
| Laser Processing Apparatus App 20220310419 - Tsukiji; Shuichiro | 2022-09-29 |
| Cutting Apparatus App 20220305608 - AIKAWA; Hiroki | 2022-09-29 |
| Polishing Apparatus App 20220305612 - MORIYA; Toshiyuki ; et al. | 2022-09-29 |
| Method of processing workpiece Grant 11,456,214 - Saito September 27, 2 | 2022-09-27 |
| Processing method of wafer Grant 11,456,213 - Nishida , et al. September 27, 2 | 2022-09-27 |
| Blade replacing apparatus and adjusting method of blade replacing apparatus Grant 11,453,092 - Terada September 27, 2 | 2022-09-27 |
| Dressing tool Grant 11,453,100 - Hoshikawa September 27, 2 | 2022-09-27 |
| Wafer processing method Grant 11,456,260 - Teranishi , et al. September 27, 2 | 2022-09-27 |
| Method Of Processing Stacked Wafer App 20220301934 - NAKAMURA; Masaru ; et al. | 2022-09-22 |
| Processing Apparatus App 20220299970 - OMORI; Takafumi | 2022-09-22 |
| Processing Apparatus And Workpiece Processing Method App 20220301918 - Masuda; Yukiyasu ; et al. | 2022-09-22 |
| Wafer processing method Grant 11,450,548 - Kiuchi , et al. September 20, 2 | 2022-09-20 |
| Method for producing wafers using ultrasound Grant 11,446,771 - Yamamoto September 20, 2 | 2022-09-20 |
| Laser Processing Method App 20220288719 - KIRIHARA; Naotoshi ; et al. | 2022-09-15 |
| Processing Apparatus App 20220288738 - TAKAGI; Atsushi ; et al. | 2022-09-15 |
| Manufacturing Methods Of Wafer And Chips And Position Adjustment Method Of Laser Beam App 20220288722 - HASHIMOTO; Kazuki | 2022-09-15 |
| Method Of Manufacturing Wafer And Method Of Manufacturing Stacked Device Chip App 20220293424 - SEKIYA; Kazuma | 2022-09-15 |
| Processing Apparatus And Processing Method App 20220293438 - NARITA; Yoshitomo | 2022-09-15 |
| Resin protection member forming apparatus Grant 11,443,951 - Saito September 13, 2 | 2022-09-13 |
| Grinding Apparatus App 20220281063 - GENOZONO; Jiro | 2022-09-08 |
| Conveying Apparatus And Conveying Method Of Substrate App 20220281121 - MAEDA; Yuto ; et al. | 2022-09-08 |
| Method of processing workpiece Grant 11,433,487 - Genda , et al. September 6, 2 | 2022-09-06 |
| Method of processing wafer and protective sheeting for use in this method Grant 11,437,275 - Priewasser September 6, 2 | 2022-09-06 |
| Workpiece unit including adhesive tape with color change layer Grant 11,437,267 - Saito , et al. September 6, 2 | 2022-09-06 |
| Grinding Method For Workpiece App 20220274224 - SUZUKI; Yoshikazu | 2022-09-01 |
| Grinding Apparatus App 20220274222 - WAKABAYASHI; Yohei ; et al. | 2022-09-01 |
| Wafer processing method Grant 11,430,696 - Nakamura August 30, 2 | 2022-08-30 |
| Processing Apparatus App 20220270910 - KAKINUMA; Yoshinori ; et al. | 2022-08-25 |
| Method Of Grinding Plate-shaped Workpiece App 20220266406 - YAMANAKA; Satoshi ; et al. | 2022-08-25 |
| Laser Processing Apparatus And Laser Processing Method App 20220266393 - MORI; Kazuki ; et al. | 2022-08-25 |
| Detecting Apparatus App 20220268700 - MORI; Kazuki ; et al. | 2022-08-25 |
| Processing Apparatus App 20220270911 - KAKINUMA; Yoshinori ; et al. | 2022-08-25 |
| Wafer processing method Grant 11,420,294 - Chi August 23, 2 | 2022-08-23 |
| Substrate processing method Grant 11,424,161 - Priewasser , et al. August 23, 2 | 2022-08-23 |
| Peeling Apparatus App 20220262659 - TSURUTA; Gentaro | 2022-08-18 |
| Cutting Apparatus App 20220258294 - IZUMI; Kuniharu ; et al. | 2022-08-18 |
| Method Of Processing Workpiece App 20220258369 - KOJIMA; Yoshimasa ; et al. | 2022-08-18 |
| Grinding Apparatus App 20220262641 - HATTORI; Mato ; et al. | 2022-08-18 |
| Wafer processing method Grant 11,417,570 - Teranishi , et al. August 16, 2 | 2022-08-16 |
| Expanding apparatus Grant 11,417,544 - Fujisawa August 16, 2 | 2022-08-16 |
| Peeling apparatus Grant 11,417,547 - Tsuruta August 16, 2 | 2022-08-16 |
| Sheet Attaching Apparatus App 20220254664 - KAKINUMA; Yoshinori | 2022-08-11 |
| Protective Member Attaching Apparatus And Protective Member Attaching Method App 20220254663 - KAKINUMA; Yoshinori | 2022-08-11 |
| Apparatus For Affixing Sheet App 20220254674 - KAKINUMA; Yoshinori | 2022-08-11 |
| Laser Processing Apparatus App 20220250192 - IIZUKA; Kentaro | 2022-08-11 |
| Manufacturing Method Of Chips And Tape Sticking Apparatus App 20220246461 - MITANI; Shuzo | 2022-08-04 |
| Severing Machine App 20220241900 - KANEZAKI; Taizo ; et al. | 2022-08-04 |
| Processing method for disk-shaped workpiece Grant 11,400,563 - Inoue August 2, 2 | 2022-08-02 |
| Cutting apparatus for cutting workpiece with cutting blade Grant 11,404,303 - Fukuoka August 2, 2 | 2022-08-02 |
| Measuring apparatus for measuring a flexural strength of a test piece Grant 11,402,310 - Saito , et al. August 2, 2 | 2022-08-02 |
| Cutting Apparatus App 20220234156 - SU; Zhibo ; et al. | 2022-07-28 |
| Wafer Dividing Method And Dividing Apparatus App 20220238379 - FURUTA; Kenji | 2022-07-28 |
| Measuring Apparatus App 20220236049 - KAWASUMI; Takehito ; et al. | 2022-07-28 |
| Method And Apparatus For Detecting Facet Region, Wafer Producing Method, And Laser Processing Apparatus App 20220236185 - ITO; Yusaku ; et al. | 2022-07-28 |
| Chip Manufacturing Method App 20220238377 - HASHIMOTO; Kazuki | 2022-07-28 |
| Processing apparatus Grant 11,398,400 - Asai July 26, 2 | 2022-07-26 |
| Processing apparatus Grant 11,396,109 - Omori , et al. July 26, 2 | 2022-07-26 |
| Electrode Welding Method And Electrode Welding Apparatus App 20220226934 - IKKU; Yuki ; et al. | 2022-07-21 |
| Processing apparatus and workpiece processing method Grant 11,393,709 - Masuda , et al. July 19, 2 | 2022-07-19 |
| Wafer processing method Grant 11,393,721 - Harada , et al. July 19, 2 | 2022-07-19 |
| Processing apparatus Grant 11,389,927 - Fukushi , et al. July 19, 2 | 2022-07-19 |
| Waste liquid treating apparatus Grant 11,390,536 - Matsumoto , et al. July 19, 2 | 2022-07-19 |
| Cutting apparatus Grant 11,389,920 - Sekiya July 19, 2 | 2022-07-19 |
| Laser Processing Machine App 20220219263 - HADANO; Yuji | 2022-07-14 |
| Grinding apparatus Grant 11,383,351 - Takenouchi , et al. July 12, 2 | 2022-07-12 |
| Wafer processing method Grant 11,387,133 - Nakamura July 12, 2 | 2022-07-12 |
| Wafer processing method Grant 11,380,550 - Nakamura July 5, 2 | 2022-07-05 |
| Grinding method Grant 11,376,707 - Suzuki July 5, 2 | 2022-07-05 |
| Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer Grant 11,380,588 - Harada , et al. July 5, 2 | 2022-07-05 |
| Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer Grant 11,380,587 - Harada , et al. July 5, 2 | 2022-07-05 |
| Blade Replacing Device App 20220203487 - TERADA; Kazuki | 2022-06-30 |
| Wafer Transfer Apparatus App 20220208588 - Kakinuma; Yoshinori | 2022-06-30 |
| Tape Mounter App 20220208573 - RIKIISHI; Toshiyasu ; et al. | 2022-06-30 |
| Protective member forming method and protective member forming apparatus Grant 11,373,888 - Kakinuma June 28, 2 | 2022-06-28 |
| Cutting blade shaping method Grant 11,370,084 - Nakamura June 28, 2 | 2022-06-28 |
| Method of manufacturing device chip Grant 11,373,907 - Kumazawa June 28, 2 | 2022-06-28 |
| Wafer Manufacturing Apparatus App 20220193826 - YAMAMOTO; Setsuo | 2022-06-23 |
| Grinding Apparatus And Method Of Driving Grinding Apparatus App 20220193861 - SEKIYA; Kazuma | 2022-06-23 |
| Grinding Apparatus App 20220199407 - FUJIMURA; Satoru ; et al. | 2022-06-23 |
| Grinding Wheel App 20220193855 - MAJI; Ryogo | 2022-06-23 |
| Laser Processing Apparatus App 20220193830 - FURUTA; Kenji | 2022-06-23 |
| Conveyance system Grant 11,365,062 - Ohkawara June 21, 2 | 2022-06-21 |
| Laser processing apparatus including imager of mark of processed workpiece Grant 11,364,573 - Nakamura June 21, 2 | 2022-06-21 |
| Wafer processing method Grant 11,367,656 - Nakamura June 21, 2 | 2022-06-21 |
| Joining method for optical part Grant 11,365,146 - Tanno June 21, 2 | 2022-06-21 |
| Processing Apparatus App 20220189800 - UCHIHO; Takashi ; et al. | 2022-06-16 |
| Edge Trimming Method App 20220184768 - OKAMURA; Takashi ; et al. | 2022-06-16 |
| Grinding Method Of Workpiece App 20220184774 - FUJIMURA; Satoru | 2022-06-16 |
| Holding Table Manufacturing Method App 20220184754 - NAKAMURA; Masaru | 2022-06-16 |
| Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layer Grant 11,361,997 - Harada , et al. June 14, 2 | 2022-06-14 |
| Height detecting apparatus and laser processing apparatus Grant 11,361,996 - Nomaru , et al. June 14, 2 | 2022-06-14 |
| Peeling apparatus Grant 11,358,306 - Hinohara , et al. June 14, 2 | 2022-06-14 |
| Wafer Manufacturing Apparatus App 20220181174 - YAMAMOTO; Ryohei ; et al. | 2022-06-09 |
| Sludge drying apparatus Grant 11,352,285 - Sugiyama June 7, 2 | 2022-06-07 |
| Cutting apparatus Grant 11,351,651 - Sekiya June 7, 2 | 2022-06-07 |
| Laser processing apparatus with calculating section Grant 11,351,631 - Ueki , et al. June 7, 2 | 2022-06-07 |
| Workpiece processing method Grant 11,355,359 - Iizuka June 7, 2 | 2022-06-07 |
| Processing Apparatus App 20220168918 - OMORI; Takafumi | 2022-06-02 |
| Processing Method Of Wafer App 20220172952 - NAKAMURA; Masaru | 2022-06-02 |
| Stacked wafer processing method Grant 11,348,797 - Harada , et al. May 31, 2 | 2022-05-31 |
| Laser processing apparatus and laser processing method Grant 11,348,793 - Yoshida May 31, 2 | 2022-05-31 |
| Measuring Apparatus That Measures Height Position Or Thickness Of Measurement-target Object App 20220163449 - KIMURA; Nobuyuki ; et al. | 2022-05-26 |
| Wafer Producing Method And Laser Processing Apparatus App 20220161367 - YAMAMOTO; Ryohei ; et al. | 2022-05-26 |
| Wafer Processing Method App 20220161384 - NAKAMURA; Masaru | 2022-05-26 |
| Method and apparatus for detecting facet region, wafer producing method, and laser processing apparatus Grant 11,340,163 - Ito , et al. May 24, 2 | 2022-05-24 |
| Wafer polishing method Grant 11,342,233 - Takeishi May 24, 2 | 2022-05-24 |
| Processing method and resin applying machine Grant 11,342,208 - Migiyama , et al. May 24, 2 | 2022-05-24 |
| Wafer Manufacturing Method And Laminated Device Chip Manufacturing Method App 20220157660 - KIM; Youngsuk ; et al. | 2022-05-19 |
| Chuck Table And Laser Processing Apparatus App 20220157638 - MASUDA; Yukiyasu ; et al. | 2022-05-19 |
| Wafer Manufacturing Method And Laminated Device Chip Manufacturing Method App 20220157658 - KIM; Youngsuk ; et al. | 2022-05-19 |
| Processing Apparatus App 20220152768 - OMORI; Takafumi | 2022-05-19 |
| Processing Apparatus App 20220152787 - MORIYA; Toshiyuki | 2022-05-19 |
| Wafer Manufacturing Method And Laminated Device Chip Manufacturing Method App 20220157669 - KIM; Youngsuk ; et al. | 2022-05-19 |
| Wafer Manufacturing Method And Laminated Device Chip Manufacturing Method App 20220157667 - KIM; Youngsuk ; et al. | 2022-05-19 |
| Wafer Manufacturing Method And Laminated Device Chip Manufacturing Method App 20220157668 - KIM; Youngsuk ; et al. | 2022-05-19 |
| Wafer Manufacturing Method And Laminated Device Chip Manufacturing Method App 20220157659 - KIM; Youngsuk ; et al. | 2022-05-19 |
| Back Grinding Adhesive Sheet, And Method For Manufacturing Semiconductor Wafer App 20220148905 - Priewasser; Karl Heinz ; et al. | 2022-05-12 |
| Laser Processing Apparatus App 20220143747 - NOMARU; Keiji | 2022-05-12 |
| Grinding Apparatus App 20220143781 - HOSHIKAWA; Hirotoshi | 2022-05-12 |
| Processing Machine App 20220143772 - MORIYA; Toshiyuki ; et al. | 2022-05-12 |
| Wafer Producing Method App 20220148881 - HIRATA; Kazuya | 2022-05-12 |
| Wafer processing method Grant 11,328,956 - Nakamura , et al. May 10, 2 | 2022-05-10 |
| Protective member forming method Grant 11,325,284 - Saito May 10, 2 | 2022-05-10 |
| Tape attaching method Grant 11,325,804 - Zhao , et al. May 10, 2 | 2022-05-10 |
| Processing apparatus Grant 11,325,204 - Nomaru May 10, 2 | 2022-05-10 |
| Wafer forming apparatus Grant 11,328,945 - Iizuka , et al. May 10, 2 | 2022-05-10 |
| Laser processing method Grant 11,325,205 - Ueki May 10, 2 | 2022-05-10 |
| Wafer Grinding Method App 20220134504 - KUBO; Tetsuo ; et al. | 2022-05-05 |
| Grinding Method Of Workpiece App 20220134509 - AKITA; Daisuke ; et al. | 2022-05-05 |
| Protective Film Agent For Laser Dicing App 20220139754 - Ryo; Senichi ; et al. | 2022-05-05 |
| Notch Detecting Method App 20220138922 - NOMURA; Yasukuni ; et al. | 2022-05-05 |
| Adhesive Sheet For Backgrinding And Production Method For Semiconductor Wafer App 20220135848 - Priewasser; Karl Heinz ; et al. | 2022-05-05 |
| Wafer processing method including applying a polyester sheet to a wafer Grant 11,322,407 - Harada , et al. May 3, 2 | 2022-05-03 |
| Protective film agent for laser dicing Grant 11,322,383 - Ryo , et al. May 3, 2 | 2022-05-03 |
| Ring frame holding mechanism Grant 11,318,625 - Wada , et al. May 3, 2 | 2022-05-03 |
| Waste liquid treating apparatus Grant 11,319,214 - Matsumoto , et al. May 3, 2 | 2022-05-03 |
| Peeling apparatus Grant 11,322,376 - Ito May 3, 2 | 2022-05-03 |
| Wafer processing method Grant 11,322,404 - Nakamura May 3, 2 | 2022-05-03 |
| Manufacturing method of producing shielded individual semiconductor packages Grant 11,322,476 - Jang , et al. May 3, 2 | 2022-05-03 |
| Wafer processing method Grant 11,322,406 - Harada , et al. May 3, 2 | 2022-05-03 |
| Transfer jig and cutting blade changing method Grant 11,318,573 - Terada May 3, 2 | 2022-05-03 |
| Processing apparatus and chuck table Grant 11,321,550 - Hanajima May 3, 2 | 2022-05-03 |
| Transfer apparatus Grant 11,322,386 - Go May 3, 2 | 2022-05-03 |
| Wafer processing method Grant 11,322,403 - Nakamura May 3, 2 | 2022-05-03 |
| Cleaning Apparatus App 20220126331 - MASUDA; Yukiyasu ; et al. | 2022-04-28 |
| Processed Wafer And Method Of Manufacturing Chip Formation Wafer App 20220130675 - NAGAYA; Masatake ; et al. | 2022-04-28 |
| Structure for Producing Diamond and Method for Manufacturing Same App 20220127719 - Aida; Hideo ; et al. | 2022-04-28 |
| Porous chuck table Grant 11,315,822 - Yamamoto April 26, 2 | 2022-04-26 |
| Wafer processing method including a test element group (TEG) cutting step Grant 11,315,833 - Zhao April 26, 2 | 2022-04-26 |
| Cutting apparatus Grant 11,311,976 - Terada April 26, 2 | 2022-04-26 |
| Tilt adjusting mechanism for chuck table Grant 11,311,975 - Yamanaka April 26, 2 | 2022-04-26 |
| Processing method for wafer Grant 11,315,821 - Zhao April 26, 2 | 2022-04-26 |
| Laser Processing Method App 20220122886 - HADANO; Yuji ; et al. | 2022-04-21 |
| Linear Gauge App 20220122862 - CHISHIMA; Kazufumi ; et al. | 2022-04-21 |
| Laser Processing Apparatus App 20220118547 - OHKUBO; Hironari ; et al. | 2022-04-21 |
| Processing Apparatus App 20220115250 - SAITO; Yoshinobu | 2022-04-14 |
| Wafer Processing Method And Grinding Apparatus App 20220115237 - MATSUOKA; Yuya | 2022-04-14 |
| Protective sheet disposing method Grant 11,298,928 - Mori , et al. April 12, 2 | 2022-04-12 |
| Wafer processing method Grant 11,302,578 - Harada , et al. April 12, 2 | 2022-04-12 |
| Fine Adjustment Device App 20220105603 - YAMANAKA; Satoshi | 2022-04-07 |
| Processing Apparatus App 20220108903 - SAITO; Yoshinobu ; et al. | 2022-04-07 |
| Processing Method Of Workpiece App 20220108882 - TSUCHIYA; Toshio ; et al. | 2022-04-07 |
| Holding Mechanism App 20220108910 - SAITO; Yoshinobu ; et al. | 2022-04-07 |
| Blade changer unit Grant 11,292,145 - Terada April 5, 2 | 2022-04-05 |
| Manufacturing Method Of Device Chip App 20220102214 - SHIGEMATSU; Koichi ; et al. | 2022-03-31 |
| Wafer Processing Method App 20220102216 - FURUTA; Kenji | 2022-03-31 |
| Separation Method Of Wafer App 20220102213 - NOMOTO; Asahi ; et al. | 2022-03-31 |
| Wafer Processing Method App 20220102215 - YOKOO; Susumu ; et al. | 2022-03-31 |
| Conveying mechanism Grant 11,289,354 - Kakinuma , et al. March 29, 2 | 2022-03-29 |
| Workpiece processing method Grant 11,289,348 - Jang , et al. March 29, 2 | 2022-03-29 |
| Laser processing method Grant 11,285,565 - Nakamura March 29, 2 | 2022-03-29 |
| Grinding apparatus Grant 11,285,578 - Genozono March 29, 2 | 2022-03-29 |
| Wafer processing method Grant 11,289,379 - Harada , et al. March 29, 2 | 2022-03-29 |
| Wafer Manufacturing Method App 20220088717 - HIRATA; Kazuya | 2022-03-24 |
| Grinding Method For Workpiece And Grinding Apparatus App 20220088742 - YAMAMOTO; Keisuke | 2022-03-24 |
| Device Chip Manufacturing Method App 20220093464 - HIGASHIYAMA; Kazuki | 2022-03-24 |
| Polishing apparatus Grant 11,279,000 - Kawana , et al. March 22, 2 | 2022-03-22 |
| Polishing Liquid Supply Device App 20220080552 - HORITA; Hideji ; et al. | 2022-03-17 |
| Wafer Processing Method App 20220084886 - SUZUKI; Minoru | 2022-03-17 |
| Wafer producing method and laser processing apparatus Grant 11,273,522 - Yamamoto , et al. March 15, 2 | 2022-03-15 |
| Method of processing wafer Grant 11,276,588 - Sekiya March 15, 2 | 2022-03-15 |
| Grinding wheel and grinding apparatus Grant 11,273,534 - Pekija March 15, 2 | 2022-03-15 |
| As-sliced Wafer Processing Method App 20220072680 - YAMANAKA; Satoshi | 2022-03-10 |
| Method Of Processing Wafer App 20220076999 - TERANISHI; Shunsuke | 2022-03-10 |
| Apparatus Utilizing High-pressure Air App 20220074552 - KASAI; Tsuyoshi ; et al. | 2022-03-10 |
| Cutting apparatus Grant 11,267,155 - Su , et al. March 8, 2 | 2022-03-08 |
| Wafer processing method Grant 11,270,916 - Harada , et al. March 8, 2 | 2022-03-08 |
| Manufacturing Method Of Plate-shaped Object App 20220064049 - KAWANO; Fumiya ; et al. | 2022-03-03 |
| Inspection Substrate App 20220063134 - SOEJIMA; Yoshikatsu | 2022-03-03 |
| Grinding Apparatus App 20220063051 - GENOZONO; Jiro | 2022-03-03 |
| Processing Apparatus App 20220066625 - NAKAYAMA; Hidekazu | 2022-03-03 |
| Laser Processing Apparatus And Method Of Correcting Converged Spot Position App 20220068729 - ODANAKA; Kentaro | 2022-03-03 |
| Grinding Wheel And Wafer Grinding Method App 20220063059 - SAITO; Yoshinobu | 2022-03-03 |
| Processing Apparatus App 20220068679 - MATSUDA; Shogo ; et al. | 2022-03-03 |
| Wafer Processing Method App 20220068694 - SAKAI; Toshiyuki ; et al. | 2022-03-03 |
| Processing Apparatus App 20220068685 - KIGAWA; Akiko ; et al. | 2022-03-03 |
| Processing Machine App 20220063053 - GENOZONO; Jiro | 2022-03-03 |
| Processing apparatus Grant 11,261,911 - Oshida , et al. March 1, 2 | 2022-03-01 |
| Protective Member Forming Apparatus App 20220059390 - KAKINUMA; Yoshinori ; et al. | 2022-02-24 |
| Cutting Method App 20220055242 - OKAMURA; Takashi ; et al. | 2022-02-24 |
| Processing Apparatus App 20220055173 - FUKUSHI; Nobuyuki ; et al. | 2022-02-24 |
| Thermocompression Bonding Method For Workpiece App 20220059392 - YAMAMOTO; Naoko ; et al. | 2022-02-24 |
| Wafer dividing apparatus Grant 11,254,029 - Masada , et al. February 22, 2 | 2022-02-22 |
| Image capturing apparatus with optical fiber located inside minute hole in objective lens Grant 11,255,657 - Nomaru February 22, 2 | 2022-02-22 |
| Processing apparatus Grant 11,256,406 - Omori February 22, 2 | 2022-02-22 |
| Method Of Processing Wafer App 20220051943 - BANG; Hyeonjin ; et al. | 2022-02-17 |
| Wafer Processing Method App 20220051897 - CHANG; Karen | 2022-02-17 |
| Processing Apparatus App 20220048152 - HATTORI; Mato | 2022-02-17 |
| Flocculant, Filter, And Waste Liquid Treating Method App 20220048796 - YOSHIDA; Miki ; et al. | 2022-02-17 |
| Workpiece processing method and device chip manufacturing method Grant 11,251,083 - Nakano , et al. February 15, 2 | 2022-02-15 |
| Wafer processing method Grant 11,251,082 - Harada , et al. February 15, 2 | 2022-02-15 |
| Cutting Apparatus App 20220040878 - TERADA; Kazuki | 2022-02-10 |
| Method Of Processing A Substrate App 20220044970 - NAGAOKA; Kensuke ; et al. | 2022-02-10 |
| Diagnosis system for ball screw unit and motor control system Grant 11,242,919 - Honjo , et al. February 8, 2 | 2022-02-08 |
| Support base Grant 11,241,770 - Matsuzaki February 8, 2 | 2022-02-08 |
| Si SUBSTRATE MANUFACTURING METHOD App 20220032503 - HIRATA; Kazuya ; et al. | 2022-02-03 |
| Wafer, Wafer Manufacturing Method, And Device Chip Manufacturing Method App 20220032404 - SEKIYA; Kazuma | 2022-02-03 |
| Processing Method Of Wafer, Protective Sheet, And Protective Sheet Laying Method App 20220037160 - SEKIYA; Kazuma | 2022-02-03 |
| Polishing Liquid App 20220033684 - SAKAI; Ayumu ; et al. | 2022-02-03 |
| Laser Processing Apparatus App 20220023972 - YOSHII; Shungo ; et al. | 2022-01-27 |
| Carrier Plate Removing Method App 20220028723 - SAKURAI; Takatoshi ; et al. | 2022-01-27 |
| Protective Member Forming Apparatus App 20220024085 - KAKINUMA; Yoshinori | 2022-01-27 |
| Method Of Processing Wafer App 20220028742 - PRIEWASSER; Karl Heinz ; et al. | 2022-01-27 |
| Wafer inspecting apparatus Grant 11,232,551 - Yoshida , et al. January 25, 2 | 2022-01-25 |
| Annular grindstone Grant 11,229,986 - Aikawa January 25, 2 | 2022-01-25 |
| Laser Processing Method App 20220016731 - Nomaru; Keiji | 2022-01-20 |
| Workpiece Grinding Method App 20220016741 - SUZUKI; Yoshikazu | 2022-01-20 |
| Polishing Apparatus And Polishing Method App 20220016740 - MORIYA; Toshiyuki ; et al. | 2022-01-20 |
| Protective Component Forming Apparatus App 20220020607 - KAKINUMA; Yoshinori ; et al. | 2022-01-20 |
| Processing Apparatus App 20220020614 - MASUDA; Yukiyasu ; et al. | 2022-01-20 |
| Sheet And Protective Member Forming Method App 20220020603 - KAKINUMA; Yoshinori ; et al. | 2022-01-20 |
| Laser processing apparatus Grant 11,224,941 - Nomaru , et al. January 18, 2 | 2022-01-18 |
| Cutting apparatus and method of changing consumable parts Grant 11,224,986 - Terada January 18, 2 | 2022-01-18 |
| Processing Apparatus App 20220005725 - ASAI; Kohei | 2022-01-06 |
| Wafer Cleaning Apparatus App 20220005710 - TAKEDA; Shohei ; et al. | 2022-01-06 |
| Processing Apparatus App 20210402635 - KOJIMA; Yoshimasa ; et al. | 2021-12-30 |
| Cutting Machine App 20210402560 - Takeda; Shun | 2021-12-30 |
| Processing Apparatus App 20210402511 - KOJIMA; Yoshimasa | 2021-12-30 |
| Workpiece Processing Method App 20210402514 - YAU; Asuka | 2021-12-30 |
| Method Of Processing Wafer App 20210398795 - LATINA; Steve | 2021-12-23 |
| Cutting Apparatus App 20210394384 - FUJITA; Tomoya ; et al. | 2021-12-23 |
| Lift-off Method And Laser Processing Apparatus App 20210399163 - KOYANAGI; Tasuku ; et al. | 2021-12-23 |
| Processing Method Of Wafer App 20210391217 - OKAMURA; Takashi ; et al. | 2021-12-16 |
| Edge Position Detecting Apparatus App 20210379703 - KOMATSU; Atsushi | 2021-12-09 |
| Production Process Of Polishing Stone And Polishing Stone App 20210380843 - MAJI; Ryogo | 2021-12-09 |
| Wafer Processing Method And Machine App 20210384076 - SAITO; Yoshinobu | 2021-12-09 |
| Processing Water Supply System App 20210381783 - MATSUMOTO; Tadaomi ; et al. | 2021-12-09 |
| Grinding Method Of Bonded Workpiece Obtained By Bonding Transparent Components Or Semitransparent Components To Each Other App 20210370465 - FUKUSHI; Nobuyuki | 2021-12-02 |
| Wafer Processing Method App 20210370460 - SAKAI; Toshiyuki ; et al. | 2021-12-02 |
| Dressing Member App 20210362295 - SEKIYA; Kazuma | 2021-11-25 |
| Pure Water Production System And Ultraviolet Light Irradiation Unit App 20210363045 - SAITO; Jun ; et al. | 2021-11-25 |
| Laser Processing Method App 20210354238 - KOBAYASHI; Masakazu ; et al. | 2021-11-18 |
| Blade Replacing Apparatus And Adjusting Method Of Blade Replacing Apparatus App 20210354257 - TERADA; Kazuki | 2021-11-18 |
| Laser Processing Apparatus App 20210354239 - TSUCHIYA; Toshio ; et al. | 2021-11-18 |
| Method Of Producing A Substrate And System For Producing A Substrate App 20210358736 - PRIEWASSER; Karl Heinz | 2021-11-18 |
| Holding Mechanism Including Bernoulli Pad App 20210358796 - KAKINUMA; Yoshinori ; et al. | 2021-11-18 |
| Grinding Apparatus App 20210347009 - HIRAIWA; Suguru ; et al. | 2021-11-11 |
| Workpiece Processing Method App 20210346990 - ZHAO; Jinyan ; et al. | 2021-11-11 |
| Management Method Of Machining System App 20210339358 - SEKIYA; Kazuma | 2021-11-04 |
| Production Method Of Wafer App 20210339428 - QIU; Xiaoming | 2021-11-04 |
| Wet Etching Method And Wet Etching System App 20210335620 - SEKIYA; Kazuma ; et al. | 2021-10-28 |
| Processing Method Of Wafer App 20210335667 - NAKAMURA; Masaru | 2021-10-28 |
| Wafer Processing Method App 20210327744 - NAKAMURA; Masaru | 2021-10-21 |
| Wafer Production Method App 20210323098 - NOMOTO; Asahi | 2021-10-21 |
| Wafer Forming Apparatus App 20210327733 - IIZUKA; Kentaro ; et al. | 2021-10-21 |
| Blade Holding Jig App 20210316477 - SU; Zhibo ; et al. | 2021-10-14 |
| Cutting Apparatus, Tray, And Transport System App 20210316411 - SEKIYA; Kazuma | 2021-10-14 |
| Wafer Forming Method App 20210316476 - NOMARU; Keiji | 2021-10-14 |
| Cutting Apparatus, Cutting Blade Replacement Method, And Board Replacement Method App 20210316468 - TERADA; Kazuki ; et al. | 2021-10-14 |
| Cleaning Nozzle And Cleaning Method App 20210307577 - ITO; Fumiaki | 2021-10-07 |
| Detection Device App 20210308789 - NOMARU; Keiji | 2021-10-07 |
| Cutting Apparatus App 20210313208 - KOJIMA; Yoshimasa ; et al. | 2021-10-07 |
| Processing Apparatus App 20210313747 - NAKAMURA; Masaru | 2021-10-07 |
| Laser Processing Apparatus App 20210299790 - MORIKAZU; Hiroshi ; et al. | 2021-09-30 |
| Conveying Mechanism App 20210305065 - KAKINUMA; Yoshinori ; et al. | 2021-09-30 |
| Inspection Apparatus And Inspection Method App 20210291295 - MORIKAZU; Hiroshi | 2021-09-23 |
| Edge Alignment Method App 20210291404 - KOMATSU; Atsushi ; et al. | 2021-09-23 |
| Grinding Method App 20210291316 - SUZUKI; Yoshikazu | 2021-09-23 |
| Processing Apparatus App 20210294491 - OHTAKA; Sayuki ; et al. | 2021-09-23 |
| Waste Liquid Treating Device And Swarf Powder Recovery Device App 20210292197 - SUGIYAMA; Satoshi | 2021-09-23 |
| Laser Processing Apparatus And Adjustment Method For Laser Processing Apparatus App 20210276123 - UEKI; Atsushi ; et al. | 2021-09-09 |
| Method Of Grinding Workpiece App 20210276145 - NAGASHIMA; Masaaki ; et al. | 2021-09-09 |
| Fine Adjustment Thread Assembly And Processing Apapratus App 20210268621 - RIKIISHI; Toshiyasu ; et al. | 2021-09-02 |
| Crack Detection Method App 20210270749 - NAKAMURA; Masaru | 2021-09-02 |
| Processing Method Of Wafer App 20210265210 - IKKU; Yuki ; et al. | 2021-08-26 |
| Wafer Processing Method App 20210265212 - TERANISHI; Shunsuke ; et al. | 2021-08-26 |
| Processing Apparatus App 20210260711 - SAITO; Yoshinobu ; et al. | 2021-08-26 |
| Carrier Tray App 20210265186 - IIZUKA; Kentaro | 2021-08-26 |
| Processing Apparatus App 20210260721 - FUKUSHI; Nobuyuki | 2021-08-26 |
| Wafer Processing Method App 20210265279 - TERANISHI; Shunsuke ; et al. | 2021-08-26 |
| Wafer Processing Method App 20210265209 - NAKAMURA; Masaru | 2021-08-26 |
| Processing Method Of Device Wafer App 20210265211 - SUZUKI; Minoru | 2021-08-26 |
| Processing Apparatus App 20210252661 - FUKUSHI; Nobuyuki | 2021-08-19 |
| Wafer Processing Method App 20210257256 - NAKAMURA; Masaru | 2021-08-19 |
| Workpiece Processing Method App 20210252742 - YAMAMOTO; Naoko | 2021-08-19 |
| Tape Attaching Apparatus App 20210257232 - SAITO; Yoshinobu | 2021-08-19 |
| Manufacturing method of device chip Grant 11024542 - | 2021-06-01 |
| Wafer processing method including applying a polyester sheet to a wafer Grant 11024543 - | 2021-06-01 |
| Cutting Apparatus App 20210154874A1 - | 2021-05-27 |
| Wafer Processing Method App 20210159080A1 - | 2021-05-27 |
| Wafer Processing Apparatus App 20210154794A1 - | 2021-05-27 |
| Thickness measuring apparatus Grant 11015919 - | 2021-05-25 |
| Cutting apparatus Grant 11018031 - | 2021-05-25 |
| Wafer processing method for dividing a wafer along predefined division lines using polyester sheet Grant 11018058 - | 2021-05-25 |
| Wafer expanding method and wafer expanding apparatus Grant 11018044 - | 2021-05-25 |
| Wafer processing method using a ring frame and a polyester sheet Grant 11018043 - | 2021-05-25 |
| SiC substrate processing method Grant 11018059 - | 2021-05-25 |
| Setting Method Of Protective Component And Manufacturing Method Of Protective Component App 20210151331A1 - | 2021-05-20 |
| Method Of Processing Wafer App 20210151390A1 - | 2021-05-20 |
| Laser Processing Apparatus And Method Of Adjusting Phase Pattern App 20210146482A1 - | 2021-05-20 |
| Wafer processing method using a ring frame and a polyolefin sheet Grant 11011407 - | 2021-05-18 |
| Laser processing apparatus Grant 11007605 - | 2021-05-18 |
| Optical device layer transferring method Grant 11011670 - | 2021-05-18 |
| Cutting apparatus Grant 11011393 - | 2021-05-18 |
| Method of processing a substrate Grant 11011406 - | 2021-05-18 |
| Wafer processing method for dividing a wafer along predefined division lines Grant 11004744 - | 2021-05-11 |
| Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheet Grant 10998232 - | 2021-05-04 |
| Wafer for examination and examination method of energy distribution Grant 10994368 - | 2021-05-04 |
| Touch panel with arrow keys associated with direction of movement of a moving mechanism Grant 10996852 - | 2021-05-04 |
| Peeling method for peeling off substrate from support plate Grant 10998196 - | 2021-05-04 |
| Method of processing wafer having protrusions on the back side Grant 10991612 - | 2021-04-27 |
| Wafer processing method including applying a polyolefin sheet to a wafer Grant 10991624 - | 2021-04-27 |
| Wafer processing method including applying a polyester sheet to a wafer Grant 10991587 - | 2021-04-27 |
| Wafer processing method Grant 10991622 - | 2021-04-27 |
| Wafer processing method Grant 10991623 - | 2021-04-27 |
| Method For Machining Workpiece App 20210118735A1 - | 2021-04-22 |
| Wafer Processing Method App 20210118736A1 - | 2021-04-22 |
| Processing Method Of Workpiece And Processing Apparatus App 20210118755A1 - | 2021-04-22 |
| Wafer Processing Method App 20210118737A1 - | 2021-04-22 |
| Wafer producing apparatus Grant 10981250 - | 2021-04-20 |
| Method of dicing a wafer by pre-sawing and subsequent laser cutting Grant 10985065 - | 2021-04-20 |
| Laser processing method using plasma light detection for forming a pore in a substrate Grant 10985060 - | 2021-04-20 |
| Wafer processing method for dividing a wafer along division lines Grant 10985066 - | 2021-04-20 |
| Wafer processing method using a laser beam dividing step Grant 10985067 - | 2021-04-20 |
| Tape Mounter And Merchandise Management Warehouse App 20210111061A1 - | 2021-04-15 |
| Thickness Measuring Apparatus App 20210107112A1 - | 2021-04-15 |
| Wafer Processing Method App 20210111073A1 - | 2021-04-15 |
| Processing Apparatus App 20210107180A1 - | 2021-04-15 |
| Wafer Processing Method App 20210111074A1 - | 2021-04-15 |
| Wafer Processing Method App 20210111075A1 - | 2021-04-15 |
| Automated workpiece conveying vehicle Grant 10974359 - | 2021-04-13 |
| Cutting apparatus Grant 10974356 - | 2021-04-13 |
| Cutting blade mounting mechanism Grant 10974364 - | 2021-04-13 |
| Protective member forming apparatus Grant 10978320 - | 2021-04-13 |
| Laser processing apparatus Grant 10978318 - | 2021-04-13 |
| Device chip and method of manufacturing device chip Grant 10978347 - | 2021-04-13 |
| Processing Method Of Wafer App 20210104408A1 - | 2021-04-08 |
| Dust Collecting Treatment Apparatus App 20210101254A1 - | 2021-04-08 |
| Dressing Tool App 20210101253A1 - | 2021-04-08 |
| Method Of Grinding Substrate App 20210101252A1 - | 2021-04-08 |
| Wafer holding apparatus and wafer processing method using the same Grant 10971350 - | 2021-04-06 |
| Laser Processing Apparatus App 20210094128A1 - | 2021-04-01 |
| Wafer Processing Method And Wafer Processing Apparatus App 20210098298A1 - | 2021-04-01 |
| Wafer Polishing Method App 20210098316A1 - | 2021-04-01 |
| Water jet processing apparatus Grant 10964555 - | 2021-03-30 |
| Processing apparatus Grant 10964567 - | 2021-03-30 |
| Conveyance system Grant 10964572 - | 2021-03-30 |
| Conveyance system Grant 10964571 - | 2021-03-30 |
| Processing Method Of Workpiece App 20210090926A1 - | 2021-03-25 |
| Method Of Processing Wafer, And Chip Measuring Apparatus App 20210090954A1 - | 2021-03-25 |
| Thickness measuring apparatus Grant 10955233 - | 2021-03-23 |
| Grinding apparatus Grant 10953516 - | 2021-03-23 |
| Laser processing apparatus and output power checking method Grant 10955290 - | 2021-03-23 |
| Method of processing a wafer Grant 10957593 - | 2021-03-23 |
| Method of processing wafer Grant 10957542 - | 2021-03-23 |
| Cutting Blade And Manufacturing Method Of Cutting Blade App 20210078204A1 - | 2021-03-18 |
| Suction Holder And Holding Mechanism For Ring Frame App 20210082735A1 - | 2021-03-18 |
| Processing Method Of Wafer App 20210082763A1 - | 2021-03-18 |
| Device Chip And Method Of Manufacturing Device Chip App 20210082760A1 - | 2021-03-18 |
| Method Of Processing Workpiece App 20210082764A1 - | 2021-03-18 |
| Processing Apparatus For Processing Workpiece App 20210078101A1 - | 2021-03-18 |
| Cutting apparatus Grant 10950451 - | 2021-03-16 |
| Laser processing apparatus Grant 10946482 - | 2021-03-16 |
| Diamond substrate producing method Grant 10950462 - | 2021-03-16 |
| Wafer processing method Grant 10950504 - | 2021-03-16 |
| Wafer Processing Method App 20210074588A1 - | 2021-03-11 |
| Optical Axis Adjustment Jig And Method Of Confirming Optical Axis Of Laser Processing Apparatus App 20210069827A1 - | 2021-03-11 |
| Method Of Confirming Optical Axis Of Laser Processing Apparatus App 20210069826A1 - | 2021-03-11 |
| Wafer Processing Method App 20210074589A1 - | 2021-03-11 |
| Measuring Apparatus App 20210069848A1 - | 2021-03-11 |
| Processing Apparatus App 20210069859A1 - | 2021-03-11 |
| Chuck Table And Method Of Manufacturing Chuck Table App 20210074575A1 - | 2021-03-11 |
| Workpiece Cutting Method App 20210074559A1 - | 2021-03-11 |
| Wafer Grinding Method App 20210074537A1 - | 2021-03-11 |
| Laser processing method Grant 10943801 - | 2021-03-09 |
| Laser processing apparatus Grant 10940560 - | 2021-03-09 |
| Tape affixing apparatus Grant 10943811 - | 2021-03-09 |
| Removal Method Of Carrier Plate App 20210060921A1 - | 2021-03-04 |
| Method Of Determining Whether Or Not Result Of Processing Process Of Laser Processing Apparatus Is Acceptable App 20210060697A1 - | 2021-03-04 |
| Resin Coating Applying Apparatus And Method Of Applying Resin Coating App 20210066103A1 - | 2021-03-04 |
| Laser Processing Apparatus App 20210066101A1 - | 2021-03-04 |
| Processing Method For Wafer App 20210066111A1 - | 2021-03-04 |
| Recognition Method Of Kerf App 20210066129A1 - | 2021-03-04 |
| Method Of Removing Carrier Plate App 20210066110A1 - | 2021-03-04 |
| Carrier plate removing method Grant 10933618 - | 2021-03-02 |
| Workpiece grinding method Grant 10933503 - | 2021-03-02 |
| Blade mounting and dismounting jig, blade mounting and dismounting method, blade extracting method, and cutting apparatus Grant 10933500 - | 2021-03-02 |
| Processing apparatus Grant 10935957 - | 2021-03-02 |
| Installation method of solar panel and solar panel Grant 10938339 - | 2021-03-02 |
| LED wafer processing method Grant 10937658 - | 2021-03-02 |
| Method of processing a semiconductor wafer that involves cutting to form grooves along the dicing lines and grinding reverse side of the wafer Grant 10937697 - | 2021-03-02 |
| Semiconductor package manufacturing method Grant 10937668 - | 2021-03-02 |
| Wafer Processing Method App 20210057225A1 - | 2021-02-25 |
| Processing Method Of Wafer App 20210057261A1 - | 2021-02-25 |
| Processing Method For Wafer App 20210057260A1 - | 2021-02-25 |
| Removal method of carrier plate Grant 10926524 - | 2021-02-23 |
| Method of processing workpiece Grant 10930512 - | 2021-02-23 |
| SiC substrate processing method Grant 10930561 - | 2021-02-23 |
| Processing apparatus Grant 10930558 - | 2021-02-23 |
| Processing Liquid Circulating Apparatus App 20210047219A1 - | 2021-02-18 |
| Wafer Processing Method And Cutting Apparatus App 20210050238A1 - | 2021-02-18 |
| Wafer Transfer Apparatus App 20210050244A1 - | 2021-02-18 |
| Manufacturing Method Of Packages App 20210050265A1 - | 2021-02-18 |
| Laser processing apparatus Grant 10923873 - | 2021-02-16 |
| Wafer processing method Grant 10923398 - | 2021-02-16 |
| Peeling Method Of Resin Sheet App 20210039377A1 - | 2021-02-11 |
| Protective Member Forming Apparatus App 20210039376A1 - | 2021-02-11 |
| Processing Performance Confirmation Method For Laser Processing Apparatus App 20210039197A1 - | 2021-02-11 |
| Protective Member Forming Method And Protective Member Forming Apparatus App 20210043469A1 - | 2021-02-11 |
| Spindle Unit App 20210039213A1 - | 2021-02-11 |
| Edge Trimming Apparatus App 20210043473A1 - | 2021-02-11 |
| Wafer Processing Method App 20210043514A1 - | 2021-02-11 |
| Wafer Processing Method App 20210043513A1 - | 2021-02-11 |
| Plasma Etching Apparatus App 20210043474A1 - | 2021-02-11 |
| Protective member forming apparatus Grant 10916459 - | 2021-02-09 |
| Wafer producing apparatus Grant 10916460 - | 2021-02-09 |
| Wafer uniting method Grant 10916466 - | 2021-02-09 |
| Optical device wafer processing method Grant 10916679 - | 2021-02-09 |
| Laser Processing Apparatus App 20210031307A1 - | 2021-02-04 |
| Processing Apparatus App 20210034228A1 - | 2021-02-04 |
| Laser Processing Apparatus App 20210035826A1 - | 2021-02-04 |
| Method Of Processing A Substrate App 20210035846A1 - | 2021-02-04 |
| Wafer producing apparatus and carrying tray Grant 10910241 - | 2021-02-02 |
| Hold checking method and unhold checking method for wafer Grant 10910246 - | 2021-02-02 |
| Manufacturing method of III-V compound crystal and manufacturing method of semiconductor device Grant 10910511 - | 2021-02-02 |
| Wafer processing method Grant 10910269 - | 2021-02-02 |
| Waste Liquid Treating Apparatus App 20210024374A1 - | 2021-01-28 |
| Waste Liquid Treating Apparatus App 20210024373A1 - | 2021-01-28 |
| Conveyance System App 20210024294A1 - | 2021-01-28 |
| Processing Method Of Wafer App 20210028022A1 - | 2021-01-28 |
| Grinding Apparatus App 20210023674A1 - | 2021-01-28 |
| Resin Applying Machine App 20210028026A1 - | 2021-01-28 |
| Comparing Method And Laser Processing Apparatus App 20210028071A1 - | 2021-01-28 |
| Expanding Method And Expanding Apparatus App 20210028063A1 - | 2021-01-28 |
| Processing Method And Resin Applying Machine App 20210028027A1 - | 2021-01-28 |
| Laser processing method Grant 10903087 - | 2021-01-26 |
| Dressing method of cutting blade Grant 10898983 - | 2021-01-26 |
| Grinding apparatus Grant 10896822 - | 2021-01-19 |
| Electrostatic chuck Grant 10896836 - | 2021-01-19 |
| Separating apparatus Grant 10896830 - | 2021-01-19 |
| Wafer processing method Grant 10896850 - | 2021-01-19 |
| Wafer Inspecting Apparatus App 20210012482A1 - | 2021-01-14 |
| Method Of Forming Insulating Layer App 20210011387A1 - | 2021-01-14 |
| Expanding Method And Expanding Apparatus App 20210013062A1 - | 2021-01-14 |
| Laser Processing Apparatus App 20210008661A1 - | 2021-01-14 |
| Workpiece Processing Method App 20210013102A1 - | 2021-01-14 |
| Wafer Processing Method App 20210013100A1 - | 2021-01-14 |
| Wafer Processing Method App 20210013101A1 - | 2021-01-14 |
| Constant temperature water supply apparatus Grant 10888965 - | 2021-01-12 |
| Interferometric thickness measuring apparatus using multiple light sources coupled with a selecting means Grant 10890433 - | 2021-01-12 |
| Processing Apparatus And Chuck Table App 20210004553A1 - | 2021-01-07 |
| Ultrasonic Water Jet Apparatus Including Piezoelectric Vibration Plate App 20210001381A1 - | 2021-01-07 |
| Method of producing wafer and apparatus for producing wafer Grant 10886127 - | 2021-01-05 |
| Method of processing wafer Grant 10886159 - | 2021-01-05 |
| Wafer processing method Grant 10879122 - | 2020-12-29 |
| Method Of Processing Workpiece App 20200398400A1 - | 2020-12-24 |
| Processing Apparatus App 20200398396A1 - | 2020-12-24 |
| Cutting Apparatus And Method Of Changing Consumable Parts App 20200398452A1 - | 2020-12-24 |
| Tape Attaching Method App 20200399090A1 - | 2020-12-24 |
| Anti-ejection Apparatus For Wafer Units App 20200402825A1 - | 2020-12-24 |
| Tape Attaching Method App 20200399089A1 - | 2020-12-24 |
| Laser Processing Apparatus App 20200398370A1 - | 2020-12-24 |
| Tape attaching method and tape attaching apparatus Grant 10872791 - | 2020-12-22 |
| Semiconductor substrate processing method Grant 10872757 - | 2020-12-22 |
| SiC wafer producing method Grant 10872758 - | 2020-12-22 |
| Workpiece processing method Grant 10872819 - | 2020-12-22 |
| Manufacturing method for wiring board Grant 10874021 - | 2020-12-22 |
Company Registrations
| NCAGE Code | SDAA7 | DISCO CORPORATION |
| CAGE Code | SDAA7 | DISCO CORPORATION |
| SEC | 0001671750 | Disco Corporation/ADR |
| SEC | 1671750 | Disco Corporation/ADR |
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