| Patent | Date |
|---|
Semiconductor package device
Grant 11,399,429 - Lin , et al. July 26, 2 | 2022-07-26 |
Semiconductor device package
Grant 11,362,049 - Liao , et al. June 14, 2 | 2022-06-14 |
Semiconductor device package and method of manufacturing the same
Grant 11,296,001 - Liao , et al. April 5, 2 | 2022-04-05 |
Substrate structure and semiconductor package structure including the same
Grant 11,107,777 - Liao , et al. August 31, 2 | 2021-08-31 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210226317 - LIAO; Guo-Cheng ; et al. | 2021-07-22 |
Semiconductor Device Package
App 20210202410 - LIAO; Guo-Cheng ; et al. | 2021-07-01 |
Semiconductor device package and method of manufacturing the same
Grant 10,971,798 - Liao , et al. April 6, 2 | 2021-04-06 |
Semiconductor package structure and method for manufacturing the same
Grant 10,847,470 - Liao , et al. November 24, 2 | 2020-11-24 |
Semiconductor Package Device And Method Of Manufacturing The Same
App 20200296827 - LIN; Ming-Ze ; et al. | 2020-09-17 |
Semiconductor package device and method of manufacturing the same
Grant 10,687,419 - Lin , et al. | 2020-06-16 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20200127366 - LIAO; Guo-Cheng ; et al. | 2020-04-23 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20200126881 - LIAO; Guo-Cheng ; et al. | 2020-04-23 |
Substrate Structure And Semiconductor Package Structure Including The Same
App 20190363056 - LIAO; Guo-Cheng ; et al. | 2019-11-28 |
Semiconductor Package Structure And Method For Manufacturing The Same
App 20190244907 - LIAO; Guo-Cheng ; et al. | 2019-08-08 |
Semiconductor Package Device And Method Of Manufacturing The Same
App 20180359853 - LIN; Ming-Ze ; et al. | 2018-12-13 |
Semiconductor substrate and semiconductor package structure having the same
Grant 9,978,705 - Liao , et al. May 22, 2 | 2018-05-22 |
Semiconductor device having conductive via and manufacturing process for same
Grant 9,960,121 - Chen , et al. May 1, 2 | 2018-05-01 |
Semiconductor Substrate And Semiconductor Package Structure Having The Same
App 20160336287 - LIAO; Guo-Cheng ; et al. | 2016-11-17 |
Semiconductor Device Having Conductive Via And Manufacturing Process For Same
App 20160315052 - Chen; Yung-Jen ; et al. | 2016-10-27 |
Semiconductor substrate and semiconductor package structure having the same
Grant 9,437,565 - Liao , et al. September 6, 2 | 2016-09-06 |
Semiconductor device having conductive via and manufacturing process
Grant 9,406,552 - Chen , et al. August 2, 2 | 2016-08-02 |
Semiconductor Substrate And Semiconductor Package Structure Having The Same
App 20160190079 - LIAO; Guo-Cheng ; et al. | 2016-06-30 |
Stackable semiconductor package and manufacturing method thereof
Grant 9,349,611 - Chen , et al. May 24, 2 | 2016-05-24 |
Substrate having pillar group and semiconductor package having pillar group
Grant 9,219,048 - Tien , et al. December 22, 2 | 2015-12-22 |
Semiconductor substrate and method for making the same
Grant 9,117,697 - Lee , et al. August 25, 2 | 2015-08-25 |
Semiconductor Substrate And Method For Making The Same
App 20140367837 - LEE; Chun-Che ; et al. | 2014-12-18 |
Substrate Having Pillar Group And Semiconductor Package Having Pillar Group
App 20140367852 - TIEN; Yun-Hsiang ; et al. | 2014-12-18 |
Semiconductor Device Having Conductive Via And Manuacturing Process
App 20140175663 - Chen; Yung-Jen ; et al. | 2014-06-26 |
Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof
Grant 8,624,374 - Ding , et al. January 7, 2 | 2014-01-07 |
Stackable Semiconductor Package And Manufacturing Method Thereof
App 20130171774 - Chen; Chia-Ching ; et al. | 2013-07-04 |
Semiconductor package including a stacking element
Grant 8,405,213 - Chen , et al. March 26, 2 | 2013-03-26 |
Semiconductor device packages including connecting elements
Grant 8,278,746 - Ding , et al. October 2, 2 | 2012-10-02 |
Semiconductor Device Packages with Fan-Out and with Connecting Elements for Stacking and Manufacturing Methods Thereof
App 20110241193 - Ding; Yi-Chuan ; et al. | 2011-10-06 |
Wafer-Level Semiconductor Device Packages with Stacking Functionality
App 20110241192 - Ding; Yi-Chuan ; et al. | 2011-10-06 |
Stackable Semiconductor Package And Manufacturing Method Thereof
App 20110227220 - Chen; Chia-Ching ; et al. | 2011-09-22 |
Substrate Structure
App 20090114436 - CHEN; Chia Ching ; et al. | 2009-05-07 |
Staggered wirebonding configuration
Grant 7,411,287 - Ding August 12, 2 | 2008-08-12 |
Chip package and producing method thereof
Grant 7,388,272 - Ding June 17, 2 | 2008-06-17 |
System-in-package device
App 20070284715 - Li; Wen Feng ; et al. | 2007-12-13 |
Circuit substrate
Grant 7,291,788 - Chen , et al. November 6, 2 | 2007-11-06 |
Multi-chip package substrate for flip-chip and wire bonding
Grant 7,125,745 - Chen , et al. October 24, 2 | 2006-10-24 |
Chip package and producing method thereof
App 20060180906 - Ding; Yi-Chuan | 2006-08-17 |
Method and structure for prevention leakage of substrate strip
Grant 7,091,583 - Chen , et al. August 15, 2 | 2006-08-15 |
Chip package and producing method thereof
App 20060163704 - Ding; Yi-Chuan | 2006-07-27 |
Staggered wirebonding configuration
App 20060097387 - Ding; Yi-Chuan | 2006-05-11 |
Circuit Substrate
App 20060054348 - Chen; Jia-Cheng ; et al. | 2006-03-16 |
Process for manufacturing a substrate with embedded capacitor
Grant 6,967,138 - Ding November 22, 2 | 2005-11-22 |
Solder mask and structure of a substrate
Grant 6,960,822 - Ding , et al. November 1, 2 | 2005-11-01 |
Method for forming ball pads of BGA substrate
App 20050054187 - Ding, Yi-Chuan ; et al. | 2005-03-10 |
Method and structure for prevention leakage of substrate strip
App 20050051881 - Chen, Ying-Chih ; et al. | 2005-03-10 |
Ball grid array package substrate and method for manufacturing the same
App 20050017375 - Ko, Shun-Fu ; et al. | 2005-01-27 |
Process for manufacturing a substrate with embedded capacitor
App 20040259317 - Ding, Yi-Chuan | 2004-12-23 |
Cavity down ball grid array package structure and carrier thereof
Grant 6,828,687 - Ding December 7, 2 | 2004-12-07 |
Multi-chip package substrate for flip-chip and wire bonding
App 20040212088 - Chen, Kun-Ching ; et al. | 2004-10-28 |
Cavity down MCM package
App 20040150099 - Ding, Yi-Chuan ; et al. | 2004-08-05 |
[method Of Fabricating A Solder Mask And Structure Of A Substrate]
App 20040137659 - Ding, Yi-Chuan ; et al. | 2004-07-15 |
Thermally enhanced semiconductor build-up package
Grant 6,750,397 - Ou , et al. June 15, 2 | 2004-06-15 |
Chip scale package and manufacturing method
Grant 6,737,300 - Ding , et al. May 18, 2 | 2004-05-18 |
Method for making a build-up package of a semiconductor
Grant 6,701,614 - Ding , et al. March 9, 2 | 2004-03-09 |
[cavity Down Ball Grid Array Package]
App 20040032022 - Ding, Yi-Chuan | 2004-02-19 |
Semiconductor build-up package
Grant 6,680,529 - Chen , et al. January 20, 2 | 2004-01-20 |
Thermally enhanced semiconductor build-up package
App 20030155145 - Ou, In-De ; et al. | 2003-08-21 |
Method for making a build-up package of a semiconductor die and structure formed from the same
App 20030156402 - Ding, Yi-Chuan ; et al. | 2003-08-21 |
Semiconductor build-up package
App 20030157747 - Chen, Kun-Ching ; et al. | 2003-08-21 |
Thermal enhanced ball grid array package
Grant 6,528,882 - Ding , et al. March 4, 2 | 2003-03-04 |
Method of making printed circuit board
App 20020189091 - Ding, Yi Chuan ; et al. | 2002-12-19 |
Chip scale package and manufacturing method
App 20020142518 - Ding, Yi-Chuan ; et al. | 2002-10-03 |
Chip scale package and manufacturing method thereof
App 20020098620 - Ding, Yi-Chuan ; et al. | 2002-07-25 |
Chip scale package
App 20020084535 - Lee, Xin Hui ; et al. | 2002-07-04 |
Flip chip process
App 20020081771 - Ding, Yi-Chuan ; et al. | 2002-06-27 |
Thermal enhanced ball grid array package
App 20020038908 - Ding, Yi-Chuan ; et al. | 2002-04-04 |
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