Ding; Hui-Ying
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ding; Hui-Ying.The latest application filed is for "lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting".
- Ding; Hui-Ying - Tianjin CN
| Patent | Date |
|---|---|
| Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting Grant 10,163,762 - Ding , et al. Dec | 2018-12-25 |
| Lead Frame With Conductive Clip For Mounting A Semiconductor Die With Reduced Clip Shifting App 20160365305 - Ding; Hui-Ying ; et al. | 2016-12-15 |
| Axial semiconductor package Grant 9,041,188 - Chiang , et al. May 26, 2 | 2015-05-26 |
| Axial Semiconductor Package App 20140131842 - Chiang; Wan-Lan ; et al. | 2014-05-15 |
| Apparatus and method for series connection of two die or chips in single electronics package Grant 7,768,104 - Chou , et al. August 3, 2 | 2010-08-03 |
| Apparatus And Method For Series Connection Of Two Die Or Chips In Single Electronics Package App 20090236705 - CHOU; TA-TE ; et al. | 2009-09-24 |
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