Ding; Frank Lei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ding; Frank Lei.The latest application filed is for "horizontal flex circuit with resistance weldable cover".
- Ding; Frank Lei - Milpitas CA
| Patent | Date |
|---|---|
| Chip on carrier Grant 11,418,003 - Mu , et al. August 16, 2 | 2022-08-16 |
| Horizontal flex circuit with resistance weldable cover Grant 10,816,739 - Ding , et al. October 27, 2 | 2020-10-27 |
| Horizontal Flex Circuit With Resistance Weldable Cover App 20200116961 - Ding; Frank Lei ; et al. | 2020-04-16 |
| Chip On Carrier App 20190379176 - Mu; Jianwei ; et al. | 2019-12-12 |
| Chip on carrier Grant 10,374,386 - Mu , et al. | 2019-08-06 |
| Connector assemblies for optoelectronic modules Grant 10,036,861 - Ding , et al. July 31, 2 | 2018-07-31 |
| Small Packaged Tunable Laser Transmitter App 20160142147 - Daiber; Andrew John ; et al. | 2016-05-19 |
| Small packaged tunable laser transmitter Grant 9,246,595 - Daiber , et al. January 26, 2 | 2016-01-26 |
| Small Packaged Tunable Laser Transmitter App 20150162990 - Daiber; Andrew John ; et al. | 2015-06-11 |
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