Dimelli; Sandra

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dimelli; Sandra.The latest application filed is for "device for assembling a chip on a substrate by providing a solder-forming mass".

Company Profile

0.10.7

Dimelli; Sandra - Bois D'arcy FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device for assembling a chip on a substrate by providing a solder-forming mass Grant 9,706,665 - Vivet , et al. July 11, 2	2017-07-11
Method for assembling a chip on a substrate Grant 9,167,703 - Vivet , et al. October 20, 2	2015-10-20
Electronic power module, and method for manufacturing said module Grant 8,958,209 - Morelle , et al. February 17, 2	2015-02-17
Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other Grant 8,952,288 - Morelle , et al. February 10, 2	2015-02-10
Power module for an automobile Grant 8,916,963 - Morelle , et al. December 23, 2	2014-12-23
Device For Assembling A Chip On A Substrate By Providing A Solder-forming Mass App 20140304984 - VIVET; Laurent ; et al.	2014-10-16
Method of assembling a member on a support by sintering a mass of conductive powder Grant 8,444,913 - Morelle , et al. May 21, 2	2013-05-21
Method Of Bonding A Member To A Support By Addition Of Material, And Device For Arranging Two Elements, One On The Other App 20130062326 - MORELLE; Jean-Michel ; et al.	2013-03-14
Electronic Power Module, And Method For Manufacturing Said Module App 20120268895 - Morelle; Jean-Michel ; et al.	2012-10-25
Power Module For An Automobile App 20120235290 - Morelle; Jean-Michel ; et al.	2012-09-20
Method of Assembling a Member on a Support by Sintering a Mass of Conductive Powder App 20100176098 - Morelle; Jean-Michel ; et al.	2010-07-15
Method And A Device For Assembling A Chip On A Substrate By Providing A Solder-forming Mass App 20100139089 - VIVET; Laurent ; et al.	2010-06-10
Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other App 20100089879 - Morelle; Jean-Michel ; et al.	2010-04-15

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