DIMAANO, JR.; Antonio B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for DIMAANO, JR.; Antonio B..The latest application filed is for "semiconductor packages and methods of packaging semiconductor devices".

Company Profile

0.29.13

DIMAANO, JR.; Antonio B. - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20170148722 - WANG; Chuen Khiang ; et al.	2017-05-25
Integrated circuit package system with multi-surface die attach pad Grant 8,536,689 - Dimaano, Jr. , et al. September 17, 2	2013-09-17
Integrated circuit package system employing a support structure with a recess Grant 8,422,243 - Chow , et al. April 16, 2	2013-04-16
Integrated circuit package system with warp-free chip Grant 8,421,197 - Do , et al. April 16, 2	2013-04-16
Semiconductor package system with patterned mask over thermal relief Grant 8,274,145 - Alabin , et al. September 25, 2	2012-09-25
Stackable integrated circuit package system with multiple interconnect interface Grant 8,232,658 - Chow , et al. July 31, 2	2012-07-31
Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof Grant 8,178,394 - Merilo , et al. May 15, 2	2012-05-15
Integrated circuit package system employing device stacking Grant 8,174,127 - Dahilig , et al. May 8, 2	2012-05-08
Integrated circuit package system employing device stacking and method of manufacture thereof Grant 8,120,187 - Dahilig , et al. February 21, 2	2012-02-21
Stackable integrated circuit package system Grant 8,106,500 - Chow , et al. January 31, 2	2012-01-31
Integrated Circuit Package In Package System App 20110248411 - Ho; Tsz Yin ; et al.	2011-10-13
Integrated circuit package on package system Grant 7,986,043 - Merilo , et al. July 26, 2	2011-07-26
Integrated circuit package in package system Grant 7,981,702 - Ho , et al. July 19, 2	2011-07-19
Integrated Circuit Package System Employing Device Stacking App 20110147899 - Dahilig; Frederick Rodriguez ; et al.	2011-06-23
Integrated Circuit Package System With Warp-free Chip App 20110121466 - Do; Byung Tai ; et al.	2011-05-26
Integrated circuit package system with interlock Grant 7,936,055 - Dimaano, Jr. , et al. May 3, 2	2011-05-03
Integrated circuit package system Grant 7,928,540 - Shim , et al. April 19, 2	2011-04-19
Method of manufacturing integrated circuit package system with warp-free chip Grant 7,892,894 - Do , et al. February 22, 2	2011-02-22
Integrated Circuit Package System Employing Device Stacking And Method Of Manufacture Thereof App 20110012270 - Dahilig; Frederick Rodriguez ; et al.	2011-01-20
Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof Grant 7,863,108 - Dimaano, Jr. , et al. January 4, 2	2011-01-04
Integrated circuit package system employing device stacking Grant 7,830,020 - Dahilig , et al. November 9, 2	2010-11-09
Quad Flat Pack In Quad Flat Pack Integrated Circuit Package System And Method For Manufacturing Thereof App 20100264528 - Merilo; Dioscoro A. ; et al.	2010-10-21
Stackable Integrated Circuit Package System App 20100219523 - Chow; Seng Guan ; et al.	2010-09-02
Quad flat pack in quad flat pack integrated circuit package system Grant 7,777,320 - Merilo , et al. August 17, 2	2010-08-17
Stackable integrated circuit package system Grant 7,741,707 - Chow , et al. June 22, 2	2010-06-22
Quad Flat Pack In Quad Flat Pack Integrated Circuit Package System App 20100072586 - Merilo; Dioscoro A. ; et al.	2010-03-25
Integrated Circuit Packaging System With Etched Ring And Die Paddle And Method Of Manufacture Thereof App 20090230529 - Dimaano, JR.; Antonio B. ; et al.	2009-09-17
Method of fabricating an integrated circuit with etched ring and die paddle Grant 7,556,987 - Dimaano, Jr. , et al. July 7, 2	2009-07-07
Integrated circuit package system with stiffener Grant 7,545,032 - Bathan , et al. June 9, 2	2009-06-09
Wire sweep resistant semiconductor package and manufacturing method therefor Grant 7,541,222 - Magno , et al. June 2, 2	2009-06-02
Integrated Circuit Package System With Warp-free Chip App 20090079049 - Do; Byung Tai ; et al.	2009-03-26
Integrated circuit encapsulation system with vent Grant 7,482,683 - Dimaano, Jr. , et al. January 27, 2	2009-01-27
Integrated circuit package system with heat sink Grant 7,479,692 - Dimaano, Jr. , et al. January 20, 2	2009-01-20
Semiconductor Package System With Patterned Mask Over Thermal Relief App 20090008768 - Alabin; Leocadio M. ; et al.	2009-01-08
Integrated Circuit Package System Employing Device Stacking App 20080315411 - Dahilig; Frederick Rodriguez ; et al.	2008-12-25
Integrated Circuit Package System With Perimeter Paddle App 20080284038 - Dimaano, JR.; Antonio B. ; et al.	2008-11-20
Stackable integrated circuit package system with multiple interconnect interface Grant 7,385,299 - Chow , et al. June 10, 2	2008-06-10
Air pocket resistant semiconductor package Grant 7,141,886 - Dimaano, Jr. , et al. November 28, 2	2006-11-28
Air pocket resistant semiconductor package system Grant 6,969,640 - Dimaano Jr. , et al. November 29, 2	2005-11-29

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