Dietz; James J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Dietz; James J..The latest application filed is for "frame saver".
- Dietz; James J. - Medford NY
- Dietz; James J. - Durham NC
| Patent | Date |
|---|---|
| Frame saver App 20100218409 - Dietz; James J. | 2010-09-02 |
| System and method for testing one or more dies on a semiconductor wafer Grant 7,449,909 - Ma , et al. November 11, 2 | 2008-11-11 |
| Integrated circuit in a maximum input/output configuration Grant 7,305,594 - Dietz , et al. December 4, 2 | 2007-12-04 |
| System and method for testing one or more dies on a semiconductor wafer Grant 7,242,208 - Ma , et al. July 10, 2 | 2007-07-10 |
| System and method for testing one or more dies on a semiconductor wafer App 20070152700 - Ma; David SuitWai ; et al. | 2007-07-05 |
| System and method for testing one or more dies on a semiconductor wafer Grant 7,119,567 - Ma , et al. October 10, 2 | 2006-10-10 |
| System and method for testing one or more dies on a semiconductor wafer App 20060158209 - Ma; David SuitWai ; et al. | 2006-07-20 |
| Semiconductor wafer testing system Grant 6,888,365 - Ma , et al. May 3, 2 | 2005-05-03 |
| Integrated circuit in a maximum input/output configuration App 20040103346 - Dietz, James J. ; et al. | 2004-05-27 |
| Semiconductor wafer testing system App 20040051547 - Ma, Daivid Suitwai ; et al. | 2004-03-18 |
| Semiconductor die isolation system App 20040051550 - Ma, David Suitwai ; et al. | 2004-03-18 |
| System and method for testing one or more dies on a semiconductor wafer App 20040054951 - Ma, David SuitWai ; et al. | 2004-03-18 |
| Leadless socket for decapped semiconductor device Grant 6,702,589 - Ma , et al. March 9, 2 | 2004-03-09 |
| Leadless Socket For Decapped Semiconductor Device App 20040033707 - Ma, David SuitWai ; et al. | 2004-02-19 |
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