Dietz; Frank
Patent Applications and Registrations
Patent applications and USPTO patent grants for Dietz; Frank.The latest application filed is for "etching solution and method for structuring a ubm layer system".
- Dietz; Frank - Itzehoe DE
- Dietz; Frank - Ranstadt DE
| Patent | Date |
|---|---|
| Etching Solution And Method For Structuring A UBM Layer System App 20090221152 - Dietz; Frank ; et al. | 2009-09-03 |
| Assembly unit comprising detent elements Grant 6,846,011 - Schutz , et al. January 25, 2 | 2005-01-25 |
| Assembly unit comprising detent elements App 20030178825 - Schutz, Dominik ; et al. | 2003-09-25 |
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