Diep; Jacquana
Patent Applications and Registrations
Patent applications and USPTO patent grants for Diep; Jacquana.The latest application filed is for "thin film composite membranes embedded with molecular cage compounds".
- Diep; Jacquana - San Jose CA US
| Patent | Date |
|---|---|
| Thin film composite membranes embedded with molecular cage compounds Grant 8,895,104 - Na , et al. November 25, 2 | 2014-11-25 |
| Thin Film Composite Membranes Embedded With Molecular Cage Compounds App 20130001153 - Na; Young-Hye ; et al. | 2013-01-03 |
| Integrated circuit socket Grant 8,297,986 - Too , et al. October 30, 2 | 2012-10-30 |
| Integrated circuit package lid with a wetting film Grant 7,633,151 - Too , et al. December 15, 2 | 2009-12-15 |
| Reduction of damage to thermal interface material due to asymmetrical load Grant 7,544,542 - Too , et al. June 9, 2 | 2009-06-09 |
| Method of integrated circuit packaging Grant 7,513,035 - Too , et al. April 7, 2 | 2009-04-07 |
| Integrated Circuit with Package Lid App 20080230893 - Too; Seah Sun ; et al. | 2008-09-25 |
| Integrated Circuit Socket App 20080227310 - Too; Seah Sun ; et al. | 2008-09-18 |
| Reduction of Damage to Thermal Interface Material Due to Asymmetrical Load App 20080124841 - Too; Seah Sun ; et al. | 2008-05-29 |
| Integrated Circuit Packaging App 20070284144 - Too; Seah Sun ; et al. | 2007-12-13 |
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