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Patent applications and USPTO patent grants for Diep; Buu Quoc.The latest application filed is for "wlp baw device with through-wlp vias".
Patent | Date |
---|---|
WLP BAW device with through-WLP vias Grant 10,931,257 - Stokes , et al. February 23, 2 | 2021-02-23 |
Fluidic sensor device having UV-blocking cover Grant 10,659,000 - Diep | 2020-05-19 |
BAW devices having top electrode leads with reduced reflectance Grant 10,574,210 - Diep , et al. Feb | 2020-02-25 |
Wlp Baw Device With Through-wlp Vias App 20200007111 - Stokes; Paul ;   et al. | 2020-01-02 |
Wafer-level-packaged BAW devices with surface mount connection structures Grant 10,367,470 - Wasilik , et al. July 30, 2 | 2019-07-30 |
Wafer-level-packaged Baw Devices With Surface Mount Connection Structures App 20180109237 - Wasilik; Matthew L. ;   et al. | 2018-04-19 |
Fluidic Sensor Device Having Uv-blocking Cover App 20170294892 - DIEP; Buu Quoc | 2017-10-12 |
Baw Devices Having Top Electrode Leads With Reduced Reflectance App 20170288644 - Diep; Buu Quoc ;   et al. | 2017-10-05 |
Semiconductor device structures and their fabrication Grant 8,530,984 - Stevenson , et al. September 10, 2 | 2013-09-10 |
Semiconductor Device Structures And Their Fabrication App 20130105995 - Stevenson; Clayton Lee ;   et al. | 2013-05-02 |
Mems device and fabrication method Grant 8,343,805 - Stevenson , et al. January 1, 2 | 2013-01-01 |
Mems Device And Fabrication Method App 20120329180 - Stevenson; Clayton Lee ;   et al. | 2012-12-27 |
MEMS device and fabrication method Grant 8,257,985 - Stevenson , et al. September 4, 2 | 2012-09-04 |
MEMS Device and Fabrication Method App 20120038019 - Stevenson; Clayton Lee ;   et al. | 2012-02-16 |
MEMS fabrication method Grant 7,378,293 - Diep May 27, 2 | 2008-05-27 |
Substrate bonding process with integrated vents App 20080032484 - Diep; Buu Quoc ;   et al. | 2008-02-07 |
MEMS fabrication method App 20070224718 - Diep; Buu Quoc | 2007-09-27 |
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