loadpatents
name:-0.010829210281372
name:-0.0078718662261963
name:-0.0031089782714844
Diep; Buu Quoc Patent Filings

Diep; Buu Quoc

Patent Applications and Registrations

Patent applications and USPTO patent grants for Diep; Buu Quoc.The latest application filed is for "wlp baw device with through-wlp vias".

Company Profile
3.8.9
  • Diep; Buu Quoc - Murphy TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
WLP BAW device with through-WLP vias
Grant 10,931,257 - Stokes , et al. February 23, 2
2021-02-23
Fluidic sensor device having UV-blocking cover
Grant 10,659,000 - Diep
2020-05-19
BAW devices having top electrode leads with reduced reflectance
Grant 10,574,210 - Diep , et al. Feb
2020-02-25
Wlp Baw Device With Through-wlp Vias
App 20200007111 - Stokes; Paul ;   et al.
2020-01-02
Wafer-level-packaged BAW devices with surface mount connection structures
Grant 10,367,470 - Wasilik , et al. July 30, 2
2019-07-30
Wafer-level-packaged Baw Devices With Surface Mount Connection Structures
App 20180109237 - Wasilik; Matthew L. ;   et al.
2018-04-19
Fluidic Sensor Device Having Uv-blocking Cover
App 20170294892 - DIEP; Buu Quoc
2017-10-12
Baw Devices Having Top Electrode Leads With Reduced Reflectance
App 20170288644 - Diep; Buu Quoc ;   et al.
2017-10-05
Semiconductor device structures and their fabrication
Grant 8,530,984 - Stevenson , et al. September 10, 2
2013-09-10
Semiconductor Device Structures And Their Fabrication
App 20130105995 - Stevenson; Clayton Lee ;   et al.
2013-05-02
Mems device and fabrication method
Grant 8,343,805 - Stevenson , et al. January 1, 2
2013-01-01
Mems Device And Fabrication Method
App 20120329180 - Stevenson; Clayton Lee ;   et al.
2012-12-27
MEMS device and fabrication method
Grant 8,257,985 - Stevenson , et al. September 4, 2
2012-09-04
MEMS Device and Fabrication Method
App 20120038019 - Stevenson; Clayton Lee ;   et al.
2012-02-16
MEMS fabrication method
Grant 7,378,293 - Diep May 27, 2
2008-05-27
Substrate bonding process with integrated vents
App 20080032484 - Diep; Buu Quoc ;   et al.
2008-02-07
MEMS fabrication method
App 20070224718 - Diep; Buu Quoc
2007-09-27

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