Diep; The Binh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Diep; The Binh.The latest application filed is for "hook device and hook assembly including the hook device".

Company Profile

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Diep; The Binh - Hong Kong HK

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Hook Device And Hook Assembly Including The Hook Device App 20180080603 - Ho; Hon Ching ; et al.	2018-03-22

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