Dickson; Joseph F.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Dickson; Joseph F..The latest application filed is for "method for bonding a ceramic to a metal with a copper-containing shim".
- Dickson; Joseph F. - Cazenovia NY
- Dickson; Joseph F. - Boylston MA
- Dickson; Joseph F. - Camden NY
- Dickson; Joseph F. - Oxford MA
| Patent | Date |
|---|---|
| Method for bonding a ceramic to a metal with a copper-containing shim Grant 6,056,186 - Dickson , et al. May 2, 2 | 2000-05-02 |
| Semiconductor package having a eutectic bonding layer Grant 5,760,473 - Dickson , et al. June 2, 1 | 1998-06-02 |
| Cut-off style, roll thread flat dies Grant 4,563,890 - Dickson January 14, 1 | 1986-01-14 |
| Direct bond copper ceramic substrate for electronic applications Grant 4,563,383 - Kuneman , et al. January 7, 1 | 1986-01-07 |
| Double Angle Cutoff Die And Method For Rolling Screws Grant 3,789,643 - Dickson February 5, 1 | 1974-02-05 |
| SEC | 0001487996 | DICKSON JOSEPH F. |
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