Dicaprio; Vincent

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dicaprio; Vincent.The latest application filed is for "modular mainframe layout for supporting multiple semiconductor process modules or chambers".

Company Profile

9.34.26

Dicaprio; Vincent - Sunnyvale CA
Dicaprio; Vincent - Pleasanton CA
DICAPRIO; Vincent - Santa Clara CA
DiCaprio; Vincent - Mesa AZ
DiCaprio; Vincent - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Modular Mainframe Layout For Supporting Multiple Semiconductor Process Modules Or Chambers App 20220262653 - HARRIS; Randy A. ; et al.	2022-08-18
Modular Mainframe Layout For Supporting Multiple Semiconductor Process Modules Or Chambers App 20220262652 - HARRIS; Randy A. ; et al.	2022-08-18
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration Grant 11,398,433 - Chen , et al. July 26, 2	2022-07-26
Method For Via Formation By Micro-imprinting App 20220171281 - GOUK; Roman ; et al.	2022-06-02
Method of fine redistribution interconnect formation for advanced packaging applications Grant 11,342,256 - Chen , et al. May 24, 2	2022-05-24
Method for via formation by micro-imprinting Grant 11,281,094 - Gouk , et al. March 22, 2	2022-03-22
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration Grant 11,264,333 - Chen , et al. March 1, 2	2022-03-01
Package structure and fabrication methods Grant 11,264,331 - Chen , et al. March 1, 2	2022-03-01
Package Core Assembly And Fabrication Methods App 20210257289 - CHEN; Han-Wen ; et al.	2021-08-19
Reconstituted Substrate Structure And Fabrication Methods For Heterogeneous Packaging Integration App 20210257307 - CHEN; Han-Wen ; et al.	2021-08-19
Package Structure And Fabrication Methods App 20210257306 - CHEN; Han-Wen ; et al.	2021-08-19
Package Core Assembly And Fabrication Methods App 20210249345 - CHEN; Han-Wen ; et al.	2021-08-12
Package Core Assembly And Fabrication Methods App 20210159160 - CHEN; Han-Wen ; et al.	2021-05-27
Package Core Assembly And Fabrication Methods App 20210159158 - CHEN; Han-Wen ; et al.	2021-05-27
Package structure with embedded core Grant 10,937,726 - Chen , et al. March 2, 2	2021-03-02
Package structure and fabrication methods Grant 10,886,232 - Chen , et al. January 5, 2	2021-01-05
Reconstituted Substrate Structure And Fabrication Methods For Heterogeneous Packaging Integration App 20200395305 - CHEN; Han-Wen ; et al.	2020-12-17
Reconstituted Substrate Structure And Fabrication Methods For Heterogeneous Packaging Integration App 20200395304 - CHEN; Han-Wen ; et al.	2020-12-17
Reconstituted Substrate Structure And Fabrication Methods For Heterogeneous Packaging Integration App 20200395306 - CHEN; Han-Wen ; et al.	2020-12-17
Package Structure And Fabrication Methods App 20200357750 - CHEN; Han-Wen ; et al.	2020-11-12
Package Structure And Fabrication Methods App 20200357749 - CHEN; Han-Wen ; et al.	2020-11-12
Method Of Fine Redistribution Interconnect Formation For Advanced Packaging Applications App 20200243432 - CHEN; Han-Wen ; et al.	2020-07-30
Method for via formation in flowable epoxy materials by micro-imprint Grant 10,727,083 - Gouk , et al.	2020-07-28
Method For Via Formation By Micro-imprinting App 20200159113 - GOUK; Roman ; et al.	2020-05-21
Semiconductor memory card Grant 8,258,613 - DiCaprio , et al. September 4, 2	2012-09-04
Semiconductor package and method for fabricating the same Grant RE40,112 - Shin , et al. February 26, 2	2008-02-26
Thin semiconductor package including stacked dies Grant 7,211,900 - Shin , et al. May 1, 2	2007-05-01
Semiconductor package and method for fabricating the same Grant 7,190,071 - Shin , et al. March 13, 2	2007-03-13
Embedded heat spreader ball grid array Grant 7,126,218 - Darveaux , et al. October 24, 2	2006-10-24
Stackable semiconductor package having semiconductor chip within central through hole of substrate Grant 7,061,120 - Shin , et al. June 13, 2	2006-06-13
Semiconductor package and method for fabricating the same Grant 6,982,488 - Shin , et al. January 3, 2	2006-01-03
Semiconductor package and method for fabricating the same App 20050205979 - Shin, Won Sun ; et al.	2005-09-22
Semiconductor package and method for manufacturing the same Grant 6,830,955 - Shin , et al. December 14, 2	2004-12-14
Semiconductor package and method for fabricating the same Grant 6,798,049 - Shin , et al. September 28, 2	2004-09-28
Stackable semiconductor package having semiconductor chip within central through hole of substrate App 20040175916 - Shin, WonSun ; et al.	2004-09-09
Semiconductor package and method for fabricating the same App 20040164411 - Shin, Won Sun ; et al.	2004-08-26
Semiconductor package having semiconductor chip within central aperture of substrate Grant 6,762,078 - Shin , et al. July 13, 2	2004-07-13
Multi-stacked memory package Grant 6,683,377 - Shim , et al. January 27, 2	2004-01-27
Semiconductor package and method for fabricating the smae App 20040007771 - Shin, Won Sun ; et al.	2004-01-15
Fabricating very thin chip size semiconductor packages Grant 6,656,765 - DiCaprio December 2, 2	2003-12-02
Method of making a semiconductor package including stacked semiconductor dies Grant 6,650,019 - Glenn , et al. November 18, 2	2003-11-18
Semiconductor memory cards and method of making same Grant 6,624,005 - DiCaprio , et al. September 23, 2	2003-09-23
Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques Grant 6,589,801 - Yoon , et al. July 8, 2	2003-07-08
Chip size semiconductor packages with stacked dies Grant 6,577,013 - Glenn , et al. June 10, 2	2003-06-10
Semiconductor package and method for fabricating the same App 20030100142 - Shin, Won Sun ; et al.	2003-05-29
Package For Multiple Integrated Circuits And Method Of Making App 20030082845 - HOFFMAN , PAUL ; et al.	2003-05-01
Semiconductor package with spacer strips Grant 6,531,784 - Shim , et al. March 11, 2	2003-03-11
Semiconductor package and method for fabricating the same Grant 6,515,356 - Shin , et al. February 4, 2	2003-02-04
Semiconductor package and method for manufacturing the same App 20030001285 - Shin, WonSun ; et al.	2003-01-02
Semiconductor package and method for manufacturing the same Grant 6,501,184 - Shin , et al. December 31, 2	2002-12-31
Method of making a semiconductor package including stacked semiconductor dies App 20020195624 - Glenn, Thomas P. ; et al.	2002-12-26
Semiconductor package including stacked semiconductor dies and bond wires Grant 6,472,758 - Glenn , et al. October 29, 2	2002-10-29
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages Grant 6,462,274 - Shim , et al. October 8, 2	2002-10-08
Low profile package for plural semiconductor dies Grant 6,452,278 - DiCaprio , et al. September 17, 2	2002-09-17
Methods Of Attaching A Sheet Of An Adhesive Film To A Substrate In The Course Of Making Integrated Circuit Packages App 20020096253 - Shim , Il Kwon ; et al.	2002-07-25
Package for stacked integrated circuits Grant 6,414,396 - Shim , et al. July 2, 2	2002-07-02
Wafer level production of chip size semiconductor packages Grant 6,406,934 - Glenn , et al. June 18, 2	2002-06-18
Semiconductor package and method for fabricating the same Grant 6,395,578 - Shin , et al. May 28, 2	2002-05-28
Making semiconductor packages with stacked dies and reinforced wire bonds Grant 6,340,846 - LoBianco , et al. January 22, 2	2002-01-22
Semiconductor Package Having Semiconductor Chip Within Central Aperture Of Substrate App 20010005601 - Shin, WonSun ; et al.	2001-06-28