DiBene; Joseph Ted II

Patent Applications and Registrations

Patent applications and USPTO patent grants for DiBene; Joseph Ted II.The latest application filed is for "system and method for processor power delivery and thermal management".

Company Profile

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DiBene; Joseph Ted II - Oceanside CA
Dibene; Joseph Ted II - Oceaside CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
System And Method For Processor Power Delivery And Thermal Management App 20070268677 - DiBene; Joseph Ted II ; et al.	2007-11-22
System and method for processor power delivery and thermal management App 20070004240 - Dibene; Joseph Ted II ; et al.	2007-01-04
System and method for processor power delivery and thermal management App 20050277310 - Dibene, Joseph Ted II ; et al.	2005-12-15
System and method for processor power delivery and thermal management App 20030214800 - Dibene, Joseph Ted II ; et al.	2003-11-20
Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management App 20030156400 - Dibene, Joseph Ted II ; et al.	2003-08-21
Integrated power delivery and cooling system for high power microprocessors App 20030057548 - Hartke, David H. ; et al.	2003-03-27
Ultra-low impedance power interconnection system for electronic packages App 20030002268 - Dibene, Joseph Ted II ; et al.	2003-01-02
Vortex heatsink for high performance thermal applications App 20020174980 - DiBene, Joseph Ted II ; et al.	2002-11-28
Separable power delivery connector App 20020176229 - Derian, Edward J. ; et al.	2002-11-28
Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management App 20020172022 - DiBene, Joseph Ted II ; et al.	2002-11-21
Power interconnect method utilizing a flexible circuit between a voltage regulation module and an integrated circuit substrate App 20020151195 - DiBene, Joseph Ted II ; et al.	2002-10-17
Inter-circuit encapsulated packaging App 20010038527 - DiBene, Joseph Ted II ; et al.	2001-11-08
Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management App 20010032738 - Dibene, Joseph Ted II ; et al.	2001-10-25

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