Dias; Rajen C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dias; Rajen C..The latest application filed is for "laser die backside film removal for integrated circuit (ic) packaging".

Company Profile

0.5.9

Dias; Rajen C. - Phoenix AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laser die backside film removal for integrated circuit (IC) packaging Grant 9,859,248 - Faruqui , et al. January 2, 2	2018-01-02
Laser Die Backside Film Removal For Integrated Circuit (ic) Packaging App 20160307869 - Faruqui; Danish ; et al.	2016-10-20
Laser Die Backside Film Removal For Integrated Circuit (ic) Packaging App 20140264951 - Faruqui; Danish ; et al.	2014-09-18
Thermal Interface Apparatus, Systems, And Fabrication Methods App 20080005886 - Dias; Rajen C. ; et al.	2008-01-10
Thermal interface apparatus, systems, and fabrication methods Grant 7,317,258 - Dias , et al. January 8, 2	2008-01-08
Thermal interface apparatus, systems, and fabrication methods App 20060146501 - Dias; Rajen C. ; et al.	2006-07-06
Thermal interface apparatus, systems, and fabrication methods Grant 7,042,729 - Dias , et al. May 9, 2	2006-05-09
Flip chip underfill process Grant 6,861,285 - Dias March 1, 2	2005-03-01
Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same App 20050017371 - Wang, Zhiyong ; et al.	2005-01-27
Thermal Interface Apparatus, Systems, and Fabrication methods App 20040264138 - Dias, Rajen C. ; et al.	2004-12-30
Flip-chip device with multi-layered underfill having graded coefficient of thermal expansion Grant 6,815,831 - Dias November 9, 2	2004-11-09
Flip chip underfill process App 20030203536 - Dias, Rajen C.	2003-10-30
Flip chip underfill process App 20030109080 - Dias, Rajen C.	2003-06-12

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