Dias; Rajen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dias; Rajen.The latest application filed is for "variable depth microchannels".

Company Profile

0.6.7

Dias; Rajen - Phoenix AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Variable depth microchannels App 20080073061 - Dias; Rajen ; et al.	2008-03-27
Microelectronic device interconnects Grant 7,314,817 - Dias , et al. January 1, 2	2008-01-01
Microelectronic device interconnects Grant 7,078,822 - Dias , et al. July 18, 2	2006-07-18
Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices Grant 7,064,014 - Dias , et al. June 20, 2	2006-06-20
Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices Grant 6,955,947 - Dias , et al. October 18, 2	2005-10-18
Microelectronic device interconnects App 20050208280 - Dias, Rajen ; et al.	2005-09-22
Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices App 20050040498 - Dias, Rajen ; et al.	2005-02-24
Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices App 20050012205 - Dias, Rajen ; et al.	2005-01-20
Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices Grant 6,812,548 - Dias , et al. November 2, 2	2004-11-02
Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices Grant 6,790,709 - Dias , et al. September 14, 2	2004-09-14
Microelectronic device interconnects App 20030234277 - Dias, Rajen ; et al.	2003-12-25
Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices App 20030102526 - Dias, Rajen ; et al.	2003-06-05
Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices App 20030104679 - Dias, Rajen ; et al.	2003-06-05

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