Diao; Jie

Patent Applications and Registrations

Patent applications and USPTO patent grants for Diao; Jie.The latest application filed is for "retaining ring for cmp".

Company Profile

3.14.27

Diao; Jie - Fremont CA
Diao; Jie - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Retaining Ring For Cmp App 20190291238 - Nagengast; Andrew J. ; et al.	2019-09-26
System and process for in situ byproduct removal and platen cooling during CMP Grant 10,350,728 - Diao , et al. July 16, 2	2019-07-16
Retaining ring for CMP Grant 10,322,492 - Nagengast , et al.	2019-06-18
Method And System To Accommodate Concurrent Private Sessions In A Virtual Conference App 20180139413 - DIAO; Jie	2018-05-17
Retaining Ring For Cmp App 20180021918 - Nagengast; Andrew J. ; et al.	2018-01-25
Conveying attention information in virtual conference Grant 9,800,831 - Diao October 24, 2	2017-10-24
Conveying gaze information in virtual conference Grant 9,538,133 - Diao January 3, 2	2017-01-03
Conveying Attention Information In Virtual Conference App 20160373691 - DIAO; Jie	2016-12-22
System And Process For In Situ Byproduct Removal And Platen Cooling During Cmp App 20160167195 - DIAO; Jie ; et al.	2016-06-16
Conveying gaze information in virtual conference Grant 9,369,667 - Diao June 14, 2	2016-06-14
Conveying Gaze Information In Virtual Conference App 20130271560 - DIAO; Jie	2013-10-17
Chemical mechanical polisher with heater and method Grant 8,439,723 - Marks , et al. May 14, 2	2013-05-14
Conveying Gaze Information In Virtual Conference App 20130076853 - DIAO; Jie	2013-03-28
Process sequence to achieve global planarity using a combination of fixed abrasive and high selectivity slurry for pre-metal dielectric CMP applications Grant 8,211,325 - Diao , et al. July 3, 2	2012-07-03
Process Sequence To Achieve Global Planarity Using A Combination Of Fixed Abrasive And High Selectivity Slurry For Pre-metal Dielectric Cmp Applications App 20100285666 - DIAO; JIE ; et al.	2010-11-11
Chemical Mechanical Polisher With Heater And Method App 20100035515 - Marks; Robert ; et al.	2010-02-11
Electrochemical method for Ecmp polishing pad conditioning Grant 7,504,018 - Wang , et al. March 17, 2	2009-03-17
Method and apparatus for electroprocessing a substrate with edge profile control Grant 7,422,982 - Wang , et al. September 9, 2	2008-09-09
Conductive pad with ion exchange membrane for electrochemical mechanical polishing Grant 7,344,432 - Chen , et al. March 18, 2	2008-03-18
Apparatus For Electroprocessing A Substrate With Edge Profile Control App 20080035474 - Wang; You ; et al.	2008-02-14
Method for conditioning a polishing pad App 20080020682 - Jia; Renhe ; et al.	2008-01-24
Method and apparatus for electroprocessing a substrate with edge profile control App 20080014709 - Wang; You ; et al.	2008-01-17
Abrasive Composition For Electrochemical Mechanical Polishing App 20070254485 - Mao; Daxin ; et al.	2007-11-01
Process for high copper removal rate with good planarization and surface finish App 20070235344 - Jia; Renhe ; et al.	2007-10-11
Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process App 20070181442 - Jia; Renhe ; et al.	2007-08-09
Methods for electrochemical processing with pre-biased cells App 20070158207 - Diao; Jie ; et al.	2007-07-12
Fully conductive pad for electrochemical mechanical processing App 20070153453 - Wang; You ; et al.	2007-07-05
Electrochemical Method For Ecmp Polishing Pad Conditioning App 20070095677 - Wang; You ; et al.	2007-05-03
Conductive Pad With Ion Exchange Membrane For Electrochemical Mechanical Polishing App 20070099552 - Chen; Liang-Yuh ; et al.	2007-05-03
Method For Stabilized Polishing Process App 20070062815 - Jia; Renhe ; et al.	2007-03-22
Process and composition for electrochemical mechanical polishing App 20060249395 - Wang; You ; et al.	2006-11-09
Process and composition for electrochemical mechanical polishing App 20060249394 - Jia; Renhe ; et al.	2006-11-09

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