| Patent | Date |
|---|
Process for manufacturing assembly pads on a carrier for the self-assembly of an electronic circuit on the carrier
Grant 11,380,648 - Di Cioccio , et al. July 5, 2 | 2022-07-05 |
Method of assembly by direct bonding between two elements, each element comprising portions of metal and dielectric materials
Grant 11,305,372 - Di Cioccio , et al. April 19, 2 | 2022-04-19 |
Method for self-assembling microelectronic components
Grant 11,121,117 - Di Cioccio September 14, 2 | 2021-09-14 |
Treatment, before the bonding of a mixed Cu-oxide surface, by a plasma containing nitrogen and hydrogen
Grant 10,910,782 - Vandroux , et al. February 2, 2 | 2021-02-02 |
Method For Self-assembling Microelectronic Components
App 20200020665 - DI CIOCCIO; Lea | 2020-01-16 |
Process For Manufacturing Assembly Pads On A Carrier For The Self-assembly Of An Electronic Circuit On The Carrier
App 20190259729 - DI CIOCCIO; Lea ; et al. | 2019-08-22 |
Emissive Led Display Device Manufacturing Method
App 20180301433 - Robin; Ivan-Christophe ; et al. | 2018-10-18 |
Direct metal bonding method
Grant 10,020,283 - Baudin , et al. July 10, 2 | 2018-07-10 |
Method for modifying the crystalline structure of a copper element
Grant 9,620,412 - Di Cioccio , et al. April 11, 2 | 2017-04-11 |
Etching method for forming a carrier having inward side walls in particular for confining a droplet for capillary self-assembly
Grant 9,586,207 - Mermoz , et al. March 7, 2 | 2017-03-07 |
Support for capillary self-assembly with horizontal stabilisation, fabrication method and use
Grant 9,522,450 - Berthier , et al. December 20, 2 | 2016-12-20 |
Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure
Grant 9,431,373 - Taibi , et al. August 30, 2 | 2016-08-30 |
Etching Method For Forming A Carrier Having Inward Side Walls In Particular For Confining A Droplet For Capillary Self-assembly
App 20160144365 - MERMOZ; Sebastien ; et al. | 2016-05-26 |
Direct Metal Bonding Method
App 20160133598 - BAUDIN; Floriane ; et al. | 2016-05-12 |
Method for producing photosensitive infrared detectors
Grant 9,318,527 - Huet , et al. April 19, 2 | 2016-04-19 |
Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone
Grant 9,240,389 - Di Cioccio , et al. January 19, 2 | 2016-01-19 |
Method For Producing At Least One Pad Assembly On A Support For The Self-assembly Of An Integrated Circuit Chip On The Support By The Formation Of A Fluorinated Material Surrounding The Pad And Exposure Of The Pad And The Fluorinated Material To An Ultraviolet Treatment In The Presence Of Ozone
App 20150287695 - Di Cioccio; Lea ; et al. | 2015-10-08 |
Method for the direct bonding of a silicon oxide layer
Grant 9,064,783 - Sabbione , et al. June 23, 2 | 2015-06-23 |
Method for directly adhering two plates together, including a step of forming a temporary protective nitrogen
Grant 9,064,863 - Di Cioccio , et al. June 23, 2 | 2015-06-23 |
Method For Estimating The Diffusion Length Of Metallic Species Within A Three-dimensional Integrated Structure, And Corresponding Three-dimensional Integrated Structure
App 20150137330 - TAIBI; Rachid ; et al. | 2015-05-21 |
Process for direct bonding two elements comprising copper portions and portions of dielectric materials
Grant 9,027,821 - Di Cioccio , et al. May 12, 2 | 2015-05-12 |
Method For Producing Photosensitive Infrared Detectors
App 20150102447 - Huet; Stephanie ; et al. | 2015-04-16 |
Process For Direct Bonding Of Two Elements Comprising Metallic Portions And Dielectric Materials
App 20150097022 - DI CIOCCIO; Lea ; et al. | 2015-04-09 |
Method of transfer by means of a ferroelectric substrate
Grant 8,951,809 - Moulet , et al. February 10, 2 | 2015-02-10 |
Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure
Grant 8,916,393 - Taibi , et al. December 23, 2 | 2014-12-23 |
Method For The Direct Bonding Of A Silicon Oxide Layer
App 20140342528 - Sabbione; Chiara ; et al. | 2014-11-20 |
Support For Capillary Self-assembly With Horizontal Stabilisation, Fabrication Method And Use
App 20140283367 - Berthier; Jean ; et al. | 2014-09-25 |
Simplified copper-copper bonding
Grant 8,647,983 - Di Cioccio , et al. February 11, 2 | 2014-02-11 |
Self-assembly of chips on a substrate
Grant 8,642,391 - Di Cioccio , et al. February 4, 2 | 2014-02-04 |
Process For Direct Bonding Two Elements Comprising Copper Portions And Portions Of Dielectric Materials
App 20130270328 - Di Cioccio; Lea ; et al. | 2013-10-17 |
Method For Directly Adhering Two Plates Together, Including A Step Of Forming A Temporary Protective Nitrogen Layer
App 20130217207 - Di Cioccio; Lea ; et al. | 2013-08-22 |
Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods
Grant 8,501,537 - Sadaka , et al. August 6, 2 | 2013-08-06 |
Method For Estimating The Diffusion Length Of Metallic Species Within A Three-dimensional Integrated Structure, And Corresponding Three-dimensional Integrated Structure
App 20130181220 - Taibi; Rachid ; et al. | 2013-07-18 |
Treatment, Before The Bonding Of A Mixed Cu-oxide Surface, By A Plasma Containing Nitrogen And Hydrogen
App 20130153093 - Vandroux; Laurent ; et al. | 2013-06-20 |
Method and device for separating a structure
Grant 8,302,278 - Zussy , et al. November 6, 2 | 2012-11-06 |
Methods For Bonding Semiconductor Structures Involving Annealing Processes, And Bonded Semiconductor Structures Formed Using Such Methods
App 20120252162 - Sadaka; Mariam ; et al. | 2012-10-04 |
Simplified Copper-copper Bonding
App 20120100657 - Di Cioccio; Lea ; et al. | 2012-04-26 |
Method For Modifying The Crystalline Structure Of A Copper Element
App 20120097296 - Di Cioccio; Lea ; et al. | 2012-04-26 |
Method of fabricating an epitaxially grown layer
Grant 8,093,138 - Faure , et al. January 10, 2 | 2012-01-10 |
Method of transferring a layer onto a liquid material
Grant 8,039,370 - Bordel , et al. October 18, 2 | 2011-10-18 |
Method Of Transferring A Layer Onto A Liquid Material
App 20110177676 - Bordel; Damien ; et al. | 2011-07-21 |
Method for relaxing a stressed thin film
Grant 7,981,238 - Di Cioccio , et al. July 19, 2 | 2011-07-19 |
Method for transfer of a thin layer
Grant 7,960,248 - Di Cioccio June 14, 2 | 2011-06-14 |
Method Of Transfer By Means Of A Ferroelectric Substrate
App 20110104829 - Moulet; Jean-Sebastien ; et al. | 2011-05-05 |
Self-assembly Of Chips On A Substrate
App 20110033976 - Di Cioccio; Lea ; et al. | 2011-02-10 |
Process For Fabricating A Flexible Electronic Device Of The Screen Type, Including A Plurality Of Thin-film Components
App 20090262294 - TEMPLIER; Francois ; et al. | 2009-10-22 |
Method Of Fabricating An Epitaxially Grown Layer
App 20090229743 - Faure; Bruce ; et al. | 2009-09-17 |
Method And Device For Separating A Structure
App 20090165277 - Zussy; Marc ; et al. | 2009-07-02 |
Method For Transfer Of A Thin Layer
App 20090156016 - Di Cioccio; Lea | 2009-06-18 |
Method of fabricating an epitaxially grown layer
Grant 7,538,010 - Faure , et al. May 26, 2 | 2009-05-26 |
Manufacture of a layer of optical interconnection on an electronic circuit
Grant 7,482,184 - Fedeli , et al. January 27, 2 | 2009-01-27 |
Method for the molecular bonding of microelectronic components to a polymer film
Grant 7,476,595 - Moriceau , et al. January 13, 2 | 2009-01-13 |
Method For Assembling Substrates By Depositing An Oxide Or Nitride Thin Bonding Layer
App 20080311725 - Di Cioccio; Lea ; et al. | 2008-12-18 |
Method for Relaxing a Stressed Thin Film
App 20080271835 - Di Cioccio; Lea ; et al. | 2008-11-06 |
Method Of Transferring At Least One Object Of Micrometric Or Millimetric Size By Means Of A Polymer Handle
App 20080020547 - Kostrzewa; Marek ; et al. | 2008-01-24 |
Method for Bonding Two Free Surfaces, Respectively of First and Second Different Substrates
App 20080009123 - Kostrzewa; Marek ; et al. | 2008-01-10 |
Method for the molecular bonding of microelectronic components to a polymer film
App 20070117258 - Moriceau; Hubert ; et al. | 2007-05-24 |
Method for the production of a composite sicoi-type substrate comprising an epitaxy stage
App 20060125057 - Di Cioccio; Lea ; et al. | 2006-06-15 |
Method of fabricating an epitaxially grown layer
App 20060118513 - Faure; Bruce ; et al. | 2006-06-08 |
Manufacture of a layer of optical interconnection on an electronic circuit
App 20060001038 - Fedeli; Jean-Marc ; et al. | 2006-01-05 |
Method for transferring an electrically active thin layer
App 20050282358 - Di Cioccio, Lea ; et al. | 2005-12-22 |
Quasi-vertical power semiconductor device on a composite substrate
App 20050258483 - Templier, Francois ; et al. | 2005-11-24 |
Process for fabricating a structure of semiconductor-on-insulator type in particular SiCOI
Grant 6,391,799 - Di Cioccio May 21, 2 | 2002-05-21 |
Process for the separation of at least two elements of a structure in contact with one another by ion implantation
Grant 6,225,190 - Bruel , et al. May 1, 2 | 2001-05-01 |
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