Dhane; Kedar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dhane; Kedar.The latest application filed is for "magnetic mold material inductors for electronic packages".

Company Profile

3.4.8

Dhane; Kedar - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liquid Thermal Interface Material In Electronic Packaging App 20200203254 - Dhane; Kedar ; et al.	2020-06-25
Magnetic Mold Material Inductors For Electronic Packages App 20200203470 - Dhane; Kedar ; et al.	2020-06-25
Electronic package that includes multiple supports Grant 10,461,003 - Karhade , et al. Oc	2019-10-29
Thermal interfaces for integrated circuit packages Grant 10,290,561 - Cetegen , et al.	2019-05-14
Component stiffener architectures for microelectronic package structures Grant 10,157,860 - Karhade , et al. Dec	2018-12-18
Electronic Package That Includes Multiple Supports App 20180358274 - Karhade; Omkar ; et al.	2018-12-13
Component Stiffener Architectures For Microelectronic Package Structures App 20180182718 - Karhade; Omkar G. ; et al.	2018-06-28
Thermal Interfaces For Integrated Circuit Packages App 20180090411 - Cetegen; Edvin ; et al.	2018-03-29
Plurality of stiffeners with thickness variation Grant 9,799,610 - Xu , et al. October 24, 2	2017-10-24
Systems, Methods And Devices For Stiffener Construction For Use In Pick And Place Media App 20170179043 - Xu; Mingjie ; et al.	2017-06-22
Electronic Package That Includes Multiple Supports App 20170170087 - Karhade; Omkar ; et al.	2017-06-15
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI Risks App 20160268213 - JIANG; Hongjin ; et al.	2016-09-15

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