DeWitt; Barbara S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for DeWitt; Barbara S..The latest application filed is for "3d-microstrip branchline coupler".

Company Profile

3.7.7

DeWitt; Barbara S. - Essex Junction VT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
3D-microstrip branchline coupler Grant 10,832,989 - DeWitt , et al. November 10, 2	2020-11-10
3D-microstrip branchline coupler Grant 10,586,752 - DeWitt , et al.	2020-03-10
3d-microstrip Branchline Coupler App 20200020612 - DeWITT; Barbara S. ; et al.	2020-01-16
3d-microstrip Branchline Coupler App 20180286785 - DeWITT; Barbara S. ; et al.	2018-10-04
3D-microstrip branchline coupler Grant 10,037,931 - DeWitt , et al. July 31, 2	2018-07-31
3d-microstrip Branchline Coupler App 20170330821 - DeWITT; Barbara S. ; et al.	2017-11-16
3D-microstrip branchline coupler Grant 9,780,429 - DeWitt , et al. October 3, 2	2017-10-03
3d-microstrip Branchline Coupler App 20170110778 - DeWITT; Barbara S. ; et al.	2017-04-20
On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures Grant 9,553,348 - Dewitt , et al. January 24, 2	2017-01-24
On-chip Vertical Three Dimensional Microstrip Line With Characteristic Impedance Tuning Technique And Design Structures App 20160226123 - DEWITT; Barbara S. ; et al.	2016-08-04
On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures Grant 9,362,606 - Dewitt , et al. June 7, 2	2016-06-07
Three dimensional branchline coupler using through silicon vias and design structures Grant 9,035,719 - Dewitt , et al. May 19, 2	2015-05-19
On-chip Vertical Three Dimensional Microstrip Line With Characteristic Impedance Tuning Technique And Design Structures App 20150054592 - DEWITT; Barbara S. ; et al.	2015-02-26
Three Dimensional Branchline Coupler Using Through Silicon Vias And Design Structures App 20150054595 - DEWITT; Barbara S. ; et al.	2015-02-26

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