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name:-0.01036810874939
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Devoe; Alan D. Patent Filings

Devoe; Alan D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Devoe; Alan D..The latest application filed is for "laminate thin-wall ceramic tubes, including with integral stress wrappings, thickened ends and/or internal baffles, particularly for solid oxide fuel cells".

Company Profile
0.8.1
  • Devoe; Alan D. - La Jolla CA
  • DeVoe; Alan D. - Cambridge MA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Single layer capacitor with dissimilar metallizations
Grant 6,917,509 - Devoe , et al. July 12, 2
2005-07-12
Laminate thin-wall ceramic tubes, including with integral stress wrappings, thickened ends and/or internal baffles, particularly for solid oxide fuel cells
Grant 6,695,940 - Devoe , et al. February 24, 2
2004-02-24
Laminate thin-wall ceramic tubes, including with integral stress wrappings, thickened ends and/or internal baffles, particularly for solid oxide fuel cells
App 20020146523 - Devoe, Alan D. ;   et al.
2002-10-10
Ceramic Chip Capacitor Of Conventional Volume And External Form Having Increased Capacitance From Use Of Closely-spaced Interior Conductive Planes Reliably Connecting To Positionally-tolerant Exterior Pads Through Multiple Redundant Vias
Grant 6,366,443 - Devoe , et al. April 2, 2
2002-04-02
Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic
Grant 6,081,416 - Trinh , et al. June 27, 2
2000-06-27
Monolithic integrated multiple electronic components internally interconnected and externally connected by conductive side castellations to the monolith that are of varying width particularly monolithic multiple capacitors
Grant 6,011,684 - Devoe , et al. January 4, 2
2000-01-04
Printing and adhering patterned metal on laid-up multi-layer green wafer before firing so as to later form precise integral co-fired conductive traces and pads on top and bottom surfaces of monolithic, buried-substrate, capacitors
Grant 5,740,010 - Devoe , et al. April 14, 1
1998-04-14
Close physical mounting of leaded amplifier/receivers to through holes in monolithic, buried-substrate, multiple capacitors simultaneous with electrical connection to dual capacitors otherwise transpiring, particularly for hearing aid filters
Grant 5,657,199 - Devoe , et al. August 12, 1
1997-08-12
Monolithic multiple capacitor
Grant 5,367,430 - DeVoe , et al. November 22, 1
1994-11-22

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