Devasia; Cyriac
Patent Applications and Registrations
Patent applications and USPTO patent grants for Devasia; Cyriac.The latest application filed is for "die bonding system with heated automatic collet changer".
- Devasia; Cyriac - Nashua NH
| Patent | Date |
|---|---|
| Die Bonding System With Heated Automatic Collet Changer App 20220102187 - Celia, Jr.; Nicholas Samuel ; et al. | 2022-03-31 |
| Thermo-compression bonding system, subsystems, and methods of use Grant 9,911,710 - Celia, Jr. , et al. March 6, 2 | 2018-03-06 |
| Thermo-compression Bonding System, Subsystems, And Methods Of Use App 20160126213 - Celia, Jr.; Nicholas Samuel ; et al. | 2016-05-05 |
| System And Method For Thermo-compression Bonding Of High Bump Count Semiconductors App 20150380379 - Devasia; Cyriac ; et al. | 2015-12-31 |
| Apparatus for dispensing precise amounts of a non-compressible fluid App 20050072815 - Carew, Dennis ; et al. | 2005-04-07 |
| Flip chip device assembly machine App 20050045914 - Agranat, Edward ; et al. | 2005-03-03 |
| Method and apparatus for chip placement Grant 6,389,688 - Srivastava , et al. May 21, 2 | 2002-05-21 |
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