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Patent applications and USPTO patent grants for Dev; Prakash Chimanlal.The latest application filed is for "carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates".
Patent | Date |
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Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates Grant 6,740,539 - Conti , et al. May 25, 2 | 2004-05-25 |
Process for forming a damascene structure Grant 6,649,531 - Cote , et al. November 18, 2 | 2003-11-18 |
Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates App 20030153198 - Conti, Richard A. ;   et al. | 2003-08-14 |
Process for forming a damascene structure App 20030100190 - Cote, William J. ;   et al. | 2003-05-29 |
Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates App 20030017642 - Conti, Richard A. ;   et al. | 2003-01-23 |
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