Detzel; Thomas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Detzel; Thomas.The latest application filed is for "high electron mobility transistor with doped semiconductor region in gate structure".

Company Profile

2.15.11

Detzel; Thomas - Villach AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High Electron Mobility Transistor with Doped Semiconductor Region in Gate Structure App 20220123138 - Detzel; Thomas ; et al.	2022-04-21
High electron mobility transistor with doped semiconductor region in gate structure Grant 11,257,941 - Detzel , et al. February 22, 2	2022-02-22
High Electron Mobility Transistor with Doped Semiconductor Region in Gate Structure App 20210234028 - Detzel; Thomas ; et al.	2021-07-29
Semiconductor device having a copper element and method of forming a semiconductor device having a copper element Grant 10,446,469 - Detzel , et al. Oc	2019-10-15
Semiconductor Device Having a Copper Element and Method of Forming a Semiconductor Device Having a Copper Element App 20160329263 - Detzel; Thomas ; et al.	2016-11-10
Integrated circuit and method of forming an integrated circuit Grant 9,418,937 - Detzel , et al. August 16, 2	2016-08-16
Method for producing bonding connection of semiconductor device Grant 9,059,182 - Maier , et al. June 16, 2	2015-06-16
Power semiconductor component and method for the production thereof Grant 8,603,912 - Maynollo , et al. December 10, 2	2013-12-10
Integrated circuit including power transistor cells and a connecting line Grant 8,502,274 - Matoy , et al. August 6, 2	2013-08-06
Integrated Circuit and Method of Forming an Integrated Circuit App 20130147047 - Detzel; Thomas ; et al.	2013-06-13
Power Semiconductor Component And Method For The Production Thereof App 20110318883 - Maynollo; Josef ; et al.	2011-12-29
Power semiconductor component having a topmost metallization layer Grant 8,039,931 - Maynollo , et al. October 18, 2	2011-10-18
Integrated circuit having a semiconductor arrangement Grant 7,834,427 - Detzel , et al. November 16, 2	2010-11-16
Method for forming an integrated semiconductor circuit arrangement Grant 7,531,439 - Rieger , et al. May 12, 2	2009-05-12
Integrated Circuit Having A Semiconductor Arrangement App 20080179669 - Detzel; Thomas ; et al.	2008-07-31
Semiconductor device for bonding connection App 20070063318 - Maier; Hubert ; et al.	2007-03-22
Integrated semiconductor circuit having a logic and power metallization without intermetal dielectric Grant 7,132,726 - Rueb , et al. November 7, 2	2006-11-07
Power semiconductor component and method for the production thereof App 20060145342 - Maynollo; Josef ; et al.	2006-07-06
Method for forming an integrated semiconductor circuit arrangement App 20060014371 - Rieger; Johann ; et al.	2006-01-19
Integrated semiconductor circuit having a logic and power metallization without intermetal dielectric App 20050179068 - Rueb, Michael ; et al.	2005-08-18
Polishing pad and method of use thereof Grant 6,287,174 - Detzel , et al. September 11, 2	2001-09-11

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