Deshpande; Nitin A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Deshpande; Nitin A..The latest application filed is for "microelectronic structures including bridges".
Company Profile
13.30.55
- Deshpande; Nitin A. - Chandler AZ
Patent Activity
| Patent | Date |
|---|---|
| Microelectronic Structures Including Bridges App 20220270998 - Karhade; Omkar G. ; et al. | 2022-08-25 |
| Low Cost Package Warpage Solution App 20220230892 - KARHADE; Omkar G. ; et al. | 2022-07-21 |
| Microelectronic structures including bridges Grant 11,373,972 - Karhade , et al. June 28, 2 | 2022-06-28 |
| Microelectronic Structures Including Bridges App 20220199536 - Karhade; Omkar G. ; et al. | 2022-06-23 |
| Microelectronic Structures Including Bridges App 20220199574 - Karhade; Omkar G. ; et al. | 2022-06-23 |
| Microelectronic Structures Including Bridges App 20220199539 - Karhade; Omkar G. ; et al. | 2022-06-23 |
| Microelectronic Structures Including Bridges App 20220199480 - Karhade; Omkar G. ; et al. | 2022-06-23 |
| Microelectronic Structures Including Bridges App 20220199535 - Karhade; Omkar G. ; et al. | 2022-06-23 |
| Low cost package warpage solution Grant 11,328,937 - Karhade , et al. May 10, 2 | 2022-05-10 |
| Mold material architecture for package device structures Grant 11,254,563 - Karhade , et al. February 22, 2 | 2022-02-22 |
| Thermally coupled package-on-package semiconductor packages Grant 11,222,877 - Karhade , et al. January 11, 2 | 2022-01-11 |
| Microelectronic Structures Including Bridges App 20210391266 - Gamba; Jason M. ; et al. | 2021-12-16 |
| Microelectronic Structures Including Bridges App 20210391264 - Nie; Bai ; et al. | 2021-12-16 |
| Warpage Control For Microelectronics Packages App 20210391281 - LI; ERIC J. ; et al. | 2021-12-16 |
| Microelectronic Structures Including Bridges App 20210391294 - Karhade; Omkar G. ; et al. | 2021-12-16 |
| Microelectronic Structures Including Bridges App 20210391273 - Dubey; Manish ; et al. | 2021-12-16 |
| Microelectronic Structures Including Bridges App 20210391295 - Karhade; Omkar G. ; et al. | 2021-12-16 |
| Microelectronic Structures Including Bridges App 20210391263 - Nie; Bai ; et al. | 2021-12-16 |
| Microelectronic Structures Including Bridges App 20210391268 - Karhade; Omkar G. ; et al. | 2021-12-16 |
| Active Bridge Enabled Co-packaged Photonic Transceiver App 20210288035 - Liljeberg; Thomas ; et al. | 2021-09-16 |
| Warpage control for microelectronics packages Grant 11,114,388 - Li , et al. September 7, 2 | 2021-09-07 |
| Microelectronic Package With Substrate Cavity For Bridge-attach App 20210272905 - Karhade; Omkar G. ; et al. | 2021-09-02 |
| Tunable Capacitor Arrangements In Integrated Circuit Package Substrates App 20210066265 - Eid; Feras ; et al. | 2021-03-04 |
| Low Cost Package Warpage Solution App 20200350181 - KARHADE; Omkar G. ; et al. | 2020-11-05 |
| Embedded multi-device bridge with through-bridge conductive via signal connection Grant 10,797,000 - Deshpande , et al. October 6, 2 | 2020-10-06 |
| Low cost package warpage solution Grant 10,741,419 - Karhade , et al. A | 2020-08-11 |
| Antenna Boards And Communication Devices App 20200203839 - Karhade; Omkar G. ; et al. | 2020-06-25 |
| Method and materials for warpage thermal and interconnect solutions Grant 10,672,626 - Karhade , et al. | 2020-06-02 |
| Electro-magnetic interference (EMI) shielding techniques and configurations Grant 10,595,409 - Elsherbini , et al. | 2020-03-17 |
| Low Cost Package Warpage Solution App 20190341271 - KARHADE; Omkar G. ; et al. | 2019-11-07 |
| Mold Material Architecture For Package Device Structures App 20190330051 - Karhade; Omkar G. ; et al. | 2019-10-31 |
| Low cost package warpage solution Grant 10,403,512 - Karhade , et al. Sep | 2019-09-03 |
| Warpage Control For Microelectronics Packages App 20190259713 - LI; ERIC J. ; et al. | 2019-08-22 |
| Embedded Multi-device Bridge With Through-bridge Conductive Via Signal Connection App 20190157205 - Deshpande; Nitin A. ; et al. | 2019-05-23 |
| Underfill Material Flow Control For Reduced Die-to-die Spacing In Semiconductor Packages App 20190148268 - KARHADE; Omkar G. ; et al. | 2019-05-16 |
| Warpage control for microelectronics packages Grant 10,256,198 - Li , et al. | 2019-04-09 |
| Thermally Coupled Package-on-package Semiconductor App 20190103385 - KARHADE; OMKAR ; et al. | 2019-04-04 |
| Embedded multi-device bridge with through-bridge conductive via signal connection Grant 10,229,882 - Deshpande , et al. | 2019-03-12 |
| Underfill material flow control for reduced die-to-die spacing in semiconductor packages Grant 10,192,810 - Karhade , et al. Ja | 2019-01-29 |
| Warpage Control For Microelectronics Packages App 20180277492 - LI; ERIC J. ; et al. | 2018-09-27 |
| Integrated circuit package with embedded bridge Grant 10,068,852 - Mahajan , et al. September 4, 2 | 2018-09-04 |
| Low Cost Package Warpage Solution App 20180190510 - Karhade; Omkar G. ; et al. | 2018-07-05 |
| Low cost package warpage solution Grant 9,899,238 - Karhade , et al. February 20, 2 | 2018-02-20 |
| High density interconnection of microelectronic devices Grant 9,842,832 - Karhade , et al. December 12, 2 | 2017-12-12 |
| Embedded Multi-device Bridge With Through-bridge Conductive Via Signal Connection App 20170330835 - Deshpande; Nitin A. ; et al. | 2017-11-16 |
| Integrated Circuit Package With Embedded Bridge App 20170301625 - Mahajan; Ravindranath V. ; et al. | 2017-10-19 |
| Electro-magnetic Interference (emi) Shielding Techniques And Configurations App 20170290155 - Elsherbini; Adel A. ; et al. | 2017-10-05 |
| Embedded multi-device bridge with through-bridge conductive via signal connection Grant 9,754,890 - Deshpande , et al. September 5, 2 | 2017-09-05 |
| Methods to form high density through-mold interconnections Grant 9,741,692 - Karhade , et al. August 22, 2 | 2017-08-22 |
| Integrated circuit package with embedded bridge Grant 9,716,067 - Mahajan , et al. July 25, 2 | 2017-07-25 |
| Electro-magnetic interference (EMI) shielding techniques and configurations Grant 9,713,255 - Elsherbini , et al. July 18, 2 | 2017-07-18 |
| Picture frame stiffeners for microelectronic packages Grant 9,685,388 - Tomita , et al. June 20, 2 | 2017-06-20 |
| Die warpage control for thin die assembly Grant 9,659,899 - Sane , et al. May 23, 2 | 2017-05-23 |
| Picture Frame Stiffeners For Microelectronic Packages App 20170040238 - Tomita; Yoshihiro ; et al. | 2017-02-09 |
| Embedded Multi-device Bridge With Through-bridge Conductive Via Signal Connection App 20160343666 - Deshpande; Nitin A. ; et al. | 2016-11-24 |
| Picture frame stiffeners for microelectronic packages Grant 9,502,368 - Tomita , et al. November 22, 2 | 2016-11-22 |
| High Density Interconnection Of Microelectronic Devices App 20160300824 - Karhade; Omkar G. ; et al. | 2016-10-13 |
| Methods To Form High Density Through-mold Interconnections App 20160268231 - Karhade; Omkar G. ; et al. | 2016-09-15 |
| High density interconnection of microelectronic devices Grant 9,397,071 - Karhade , et al. July 19, 2 | 2016-07-19 |
| Low Cost Package Warpage Solution App 20160181218 - Karhade; Omkar G. ; et al. | 2016-06-23 |
| Picture Frame Stiffeners For Microelectronic Packages App 20160172323 - TOMITA; YOSHIHIRO ; et al. | 2016-06-16 |
| Integrated Circuit Package With Embedded Bridge App 20160155705 - Mahajan; Ravindranath V. ; et al. | 2016-06-02 |
| Integrated circuit package with embedded bridge Grant 9,275,955 - Mahajan , et al. March 1, 2 | 2016-03-01 |
| Ultrathin Microelectronic Die Packages And Methods Of Fabricating The Same App 20150318255 - KARHADE; OMKAR G. ; et al. | 2015-11-05 |
| Die Warpage Control For Thin Die Assembly App 20150318258 - SANE; SANDEEP B. ; et al. | 2015-11-05 |
| Die warpage control for thin die assembly Grant 9,123,732 - Sane , et al. September 1, 2 | 2015-09-01 |
| Electro-magnetic Interference (emi) Shielding Techniques And Configurations App 20150237713 - Elsherbini; Adel A. ; et al. | 2015-08-20 |
| Integrated Circuit Package With Embedded Bridge App 20150171015 - Mahajan; Ravindranath V. ; et al. | 2015-06-18 |
| High Density Interconnection Of Microelectronic Devices App 20150163904 - Karhade; Omkar G. ; et al. | 2015-06-11 |
| Underfill Material Flow Control For Reduced Die-to-die Spacing In Semiconductor Packages App 20150001717 - Karhade; Omkar G. ; et al. | 2015-01-01 |
| Die Warpage Control For Thin Die Assembly App 20140091470 - Sane; Sandeep B. ; et al. | 2014-04-03 |
| Method, system, and apparatus for gravity assisted chip attachment Grant 7,411,296 - Sahasrabudhe , et al. August 12, 2 | 2008-08-12 |
| Method, system, and apparatus for gravity assisted chip attachment App 20070212868 - Sahasrabudhe; Shubhada H. ; et al. | 2007-09-13 |
| Method for reducing assembly-induced stress in a semiconductor die Grant 7,166,540 - Deshpande , et al. January 23, 2 | 2007-01-23 |
| Method for reducing assembly-induced stress in a semiconductor die App 20060199299 - Deshpande; Nitin A. ; et al. | 2006-09-07 |
| Securing lids to semiconductor packages App 20060042054 - Kippes; Kyle W. ; et al. | 2006-03-02 |
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