| Patent | Date |
|---|
Enabling Passive Alignment For Lens Attach
App 20220308293 - LI; Xiaoqian ; et al. | 2022-09-29 |
Package Expanded Beam Connector For On-package Optics
App 20220308294 - MORGAN; Wesley ; et al. | 2022-09-29 |
Patch On Interposer Architecture For Low Cost Optical Co-packaging
App 20220196943 - LI; Xiaoqian ; et al. | 2022-06-23 |
Micro-lens Array Optically Coupled With A Photonics Die
App 20220196931 - LI; Xiaoqian ; et al. | 2022-06-23 |
Silicon Groove Architectures And Manufacturing Processes For Passive Alignment In A Photonics Die
App 20220196940 - KARHADE; Omkar ; et al. | 2022-06-23 |
Novel Connector Designs For Photonics Packaging Integration
App 20220196935 - LI; Xiaoqian ; et al. | 2022-06-23 |
Faraday Rotator Interconnect As A Through-via Configuration In A Patch Architecture
App 20220187548 - MARIN; Brandon C. ; et al. | 2022-06-16 |
High Bandwidth Optical Interconnection Architectures
App 20220155539 - PIETAMBARAM; Srinivas V. ; et al. | 2022-05-19 |
Optical Fiber Connector Attach To Die In Wafer Or Panel Level To Enable Known Good Die
App 20210405311 - LI; Xiaoqian ; et al. | 2021-12-30 |
Open Cavity Bridge Power Delivery Architectures And Processes
App 20210305133 - KARHADE; Omkar ; et al. | 2021-09-30 |
Open Cavity Bridge Co-planar Placement Architectures And Processes
App 20210305132 - KARHADE; Omkar ; et al. | 2021-09-30 |
Package on package thermal transfer systems and methods
Grant 11,056,466 - Karhade , et al. July 6, 2 | 2021-07-06 |
Coupled Cooling Fins In Ultra-small Systems
App 20200273772 - Uppal; Aastha ; et al. | 2020-08-27 |
Crystalline Carbon Heat Spreading Materials For Ic Die Hot Spot Reduction
App 20200273768 - Karhade; Omkar ; et al. | 2020-08-27 |
Thermal Management Solutions For Integrated Circuit Packages
App 20200227332 - Singh; Kumar Abhishek ; et al. | 2020-07-16 |
Fine Pitch Z Connections For Flip Chip Memory Architectures With Interposer
App 20200051956 - KARHADE; Omkar ; et al. | 2020-02-13 |
Package On Package Thermal Transfer Systems And Methods
App 20190385983 - KARHADE; OMKAR ; et al. | 2019-12-19 |
Package on package thermal transfer systems and methods
Grant 10,438,930 - Karhade , et al. O | 2019-10-08 |
Substrate Architecture For Solder Joint Reliabilty In Microelectronic Package Structures And Methods Of Forming The Same
App 20190104610 - Nickerson; Robert ; et al. | 2019-04-04 |
Package On Package Thermal Transfer Systems And Methods
App 20190006319 - KARHADE; OMKAR ; et al. | 2019-01-03 |
Rigid Adhesive Package-on-package Semiconductors
App 20190006342 - KARHADE; OMKAR ; et al. | 2019-01-03 |
Electronic Assembly That Includes A Bridge
App 20180358296 - LI; Eric J. ; et al. | 2018-12-13 |
Integrated circuit assembly that includes stacked dice
Grant 9,991,243 - Karhade , et al. June 5, 2 | 2018-06-05 |
Electronic assembly that includes stacked electronic devices
Grant 9,941,246 - Deshpande , et al. April 10, 2 | 2018-04-10 |
Integrated Circuit Assembly That Includes Stacked Dice
App 20170323874 - Karhade; Omkar ; et al. | 2017-11-09 |
Electronic package design that facilitates shipping the electronic package
Grant 9,795,038 - Karhade , et al. October 17, 2 | 2017-10-17 |
Methods for high precision microelectronic die integration
Grant 9,685,421 - Aleksov , et al. June 20, 2 | 2017-06-20 |
Electronic device with solder pads including projections
Grant 9,583,470 - Karhade , et al. February 28, 2 | 2017-02-28 |
Integrated circuit assembly that includes stacked dice
Grant 9,576,942 - Karhade , et al. February 21, 2 | 2017-02-21 |
Electronic Assembly That Includes Stacked Electronic Devices
App 20160260688 - Deshpande; Nitin ; et al. | 2016-09-08 |
Electronic Package Design That Facilitates Shipping The Electronic Package
App 20160095220 - Karhade; Omkar ; et al. | 2016-03-31 |
Rotational-flow spray nozzle and process of using same
Grant 9,180,541 - Ramanan , et al. November 10, 2 | 2015-11-10 |
Methods For High Precision Microelectronic Die Integration
App 20150262968 - Aleksov; Aleksandar ; et al. | 2015-09-17 |
Methods for high precision microelectronic die integration
Grant 9,076,882 - Aleksov , et al. July 7, 2 | 2015-07-07 |
Flexible Microelectronic Assembly And Method
App 20150187681 - Mahajan; Ravi V. ; et al. | 2015-07-02 |
Solder Pad Device And Method
App 20150179622 - Karhade; Omkar ; et al. | 2015-06-25 |
Methods For High Precision Microelectronic Die Integration
App 20140357020 - Aleksov; Aleksandar ; et al. | 2014-12-04 |
Rotational-flow Spray Nozzle And Process Of Using Same
App 20120266972 - RAMANAN; Harikrishnan ; et al. | 2012-10-25 |
Rotational-flow spray nozzle and process of using same
Grant 8,215,536 - Ramanan , et al. July 10, 2 | 2012-07-10 |
Flux spray atomization and splash control
Grant 7,644,871 - Ramanan , et al. January 12, 2 | 2010-01-12 |
Methods including fluxless chip attach processes
Grant 7,534,715 - Jadhav , et al. May 19, 2 | 2009-05-19 |
Flux air cap and spray nozzle designs
App 20080237364 - Deshpande; Nitin ; et al. | 2008-10-02 |
Flux spray atomization and splash control
App 20080156851 - Ramanan; Harikrishnan ; et al. | 2008-07-03 |
Rotational-flow Spray Nozzle And Process Of Using Same
App 20080149692 - Ramanan; Harikrishnan ; et al. | 2008-06-26 |
Low temperature phase change thermal interface material dam
Grant 7,312,527 - Sane , et al. December 25, 2 | 2007-12-25 |
Fluxless chip attached processes and devices
App 20070152328 - Jadhav; Susheel ; et al. | 2007-07-05 |
Low temperature phase change thermal interface material dam
App 20070138621 - Sane; Sandeep B. ; et al. | 2007-06-21 |
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