| Patent | Date |
|---|
LED based optical source coupled with plasma source
Grant 9,721,802 - Deshmukh , et al. August 1, 2 | 2017-08-01 |
Process for etching metal using a combination of plasma and solid state sources
Grant 9,576,810 - Deshmukh , et al. February 21, 2 | 2017-02-21 |
Uv-assisted Reactive Ion Etch For Copper
App 20170011887 - Deshmukh; Subhash ; et al. | 2017-01-12 |
Resist Hardening And Development Processes For Semiconductor Device Manufacturing
App 20160329222 - Xie; Peng ; et al. | 2016-11-10 |
Resist hardening and development processes for semiconductor device manufacturing
Grant 9,411,237 - Xie , et al. August 9, 2 | 2016-08-09 |
Interface treatment of semiconductor surfaces with high density low energy plasma
Grant 9,378,941 - Nainani , et al. June 28, 2 | 2016-06-28 |
Process For Etching Metal Using A Combination Of Plasma And Solid State Sources
App 20150099369 - Deshmukh; Subhash ; et al. | 2015-04-09 |
Led Based Optical Source Coupled With Plasma Source
App 20150096683 - Deshmukh; Subhash ; et al. | 2015-04-09 |
Interface Treatment Of Semiconductor Surfaces With High Density Low Energy Plasma
App 20150093862 - Nainani; Aneesh ; et al. | 2015-04-02 |
Pulsed Dc Plasma Etching Process And Apparatus
App 20140273487 - Deshmukh; Subhash ; et al. | 2014-09-18 |
Resist Hardening And Development Processes For Semiconductor Device Manufacturing
App 20140263172 - Xie; Peng ; et al. | 2014-09-18 |
Uv-assisted Reactive Ion Etch For Copper
App 20140262755 - Deshmukh; Subhash ; et al. | 2014-09-18 |
Apparatus for etching high aspect ratio features
Grant 8,475,625 - Pamarthy , et al. July 2, 2 | 2013-07-02 |
Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator
Grant 8,080,479 - Collins , et al. December 20, 2 | 2011-12-20 |
Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes
Grant 8,076,247 - Collins , et al. December 13, 2 | 2011-12-13 |
Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity
Grant 7,968,469 - Collins , et al. June 28, 2 | 2011-06-28 |
Plasma process uniformity across a wafer by apportioning ground return path impedances among plural VHF sources
Grant 7,884,025 - Collins , et al. February 8, 2 | 2011-02-08 |
Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources
Grant 7,879,731 - Collins , et al. February 1, 2 | 2011-02-01 |
Methods For Forming High Aspect Ratio Features On A Substrate
App 20100330805 - DOAN; KENNY LINH ; et al. | 2010-12-30 |
Method of preventing etch profile bending and bowing in high aspect ratio openings by treating a polymer formed on the opening sidewalls
Grant 7,846,846 - Bera , et al. December 7, 2 | 2010-12-07 |
Method For Fabricating Low K Dielectric Dual Damascene Structures
App 20090156012 - HSIEH; CHANG-LIN ; et al. | 2009-06-18 |
Method Of Preventing Etch Profile Bending And Bowing In High Aspect Ratio Openings By Treating A Polymer Formed On The Opening Sidewalls
App 20090081876 - BERA; Kallol ; et al. | 2009-03-26 |
Plasma Process Uniformity Across A Wafer By Controlling Rf Phase Between Opposing Electrodes
App 20080180028 - Collins; Kenneth S. ; et al. | 2008-07-31 |
Method Of Processing A Workpiece In A Plasma Reactor With Variable Height Ground Return Path To Control Plasma Ion Density Uniformity
App 20080179181 - COLLINS; KENNETH S. ; et al. | 2008-07-31 |
Plasma Reactor With Ion Distribution Uniformity Controller Employing Plural Vhf Sources
App 20080178803 - COLLINS; KENNETH S. ; et al. | 2008-07-31 |
Plasma Process Uniformity Across A Wafer By Apportioning Ground Return Path Impedances Among Plural Vhf Sources
App 20080182417 - Collins; Kenneth S. ; et al. | 2008-07-31 |
Plasma Reactor With Wide Process Window Employing Plural Vhf Sources
App 20080179011 - COLLINS; KENNETH S. ; et al. | 2008-07-31 |
Plasma Process Uniformity Across A Wafer By Controlling A Variable Frequency Coupled To A Harmonic Resonator
App 20080182418 - Collins; Kenneth S. ; et al. | 2008-07-31 |
Plasma Process Uniformity Across A Wafer By Apportioning Power Among Plural Vhf Sources
App 20080182416 - Collins; Kenneth S. ; et al. | 2008-07-31 |
Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage
Grant 7,323,116 - Guiney , et al. January 29, 2 | 2008-01-29 |
Apparatus For Etching High Aspect Ratio Features
App 20070256785 - Pamarthy; Sharma ; et al. | 2007-11-08 |
Treatment for corrosion in substrate processing
Grant 7,084,070 - Lee , et al. August 1, 2 | 2006-08-01 |
Methods and apparatus for monitoring a process in a plasma processing system by measuring impedance
App 20060065631 - Cheng; Chia-Cheng ; et al. | 2006-03-30 |
Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage
App 20060065623 - Guiney; Timothy J. ; et al. | 2006-03-30 |
Methods and apparatus for monitoring a process in a plasma processing system by measuring a plasma frequency
App 20060065632 - Cheng; Chia-Cheng ; et al. | 2006-03-30 |
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