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name:-0.0080618858337402
name:-0.0058560371398926
name:-0.00055909156799316
Desai; Nitin B. Patent Filings

Desai; Nitin B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Desai; Nitin B..The latest application filed is for "multilayer circuit board with embedded components and method of manufacture".

Company Profile
0.4.6
  • Desai; Nitin B. - Coral Springs FL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multilayer circuit board with embedded components and method of manufacture
Grant 7,594,318 - Zollo , et al. September 29, 2
2009-09-29
Multilayer Circuit Board With Embedded Components And Method Of Manufacture
App 20080040921 - ZOLLO; JAMES A. ;   et al.
2008-02-21
Multilayer circuit board with embedded components and method of manufacture
Grant 7,286,366 - Zollo , et al. October 23, 2
2007-10-23
Multilayer circuit board with embedded components and method of manufacture
App 20060215379 - Zollo; James A. ;   et al.
2006-09-28
System and method for testing dynamic resistance during thermal shock cycling
App 20060103404 - Desai; Nitin B. ;   et al.
2006-05-18
Method and apparatus for solder-less attachment of an electronic device to a textile circuit
Grant 7,025,596 - Zollo , et al. April 11, 2
2006-04-11
Method and apparatus for solder-less attachment of an electronic device to a textile circuit
App 20050277307 - Zollo, James A. ;   et al.
2005-12-15
Inverted microvia structure and method of manufacture
Grant 6,972,382 - Zollo , et al. December 6, 2
2005-12-06
Combined packaging and storage apparatus having added functionality
App 20050243522 - Nilsen, Ryan M. ;   et al.
2005-11-03
Inverted microvia structure and method of manufacture
App 20050016768 - Zollo, James A. ;   et al.
2005-01-27

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