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name:-0.0071961879730225
name:-0.0078070163726807
name:-0.00074195861816406
Desai; Mukesh Patent Filings

Desai; Mukesh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Desai; Mukesh.The latest application filed is for "compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates".

Company Profile
0.6.6
  • Desai; Mukesh - Naperville IL
  • Desai; Mukesh - Milpitas CA
  • Desai; Mukesh - Phoenix AZ
  • Desai; Mukesh - Fishkill NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Silicon carbide polishing method utilizing water-soluble oxidizers
Grant 7,678,700 - Desai , et al. March 16, 2
2010-03-16
Compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates
App 20080283502 - Moeggenborg; Kevin ;   et al.
2008-11-20
Silicon Carbide Polishing Method Utilizing Water-soluble Oxidizers
App 20080153293 - Desai; Mukesh ;   et al.
2008-06-26
Silicon carbide polishing method utilizing water-soluble oxidizers
App 20080057713 - Desai; Mukesh ;   et al.
2008-03-06
Composition and method for polishing a sapphire surface
App 20060196849 - Moeggenborg; Kevin ;   et al.
2006-09-07
Endpoint detection for non-transparent polishing member
Grant 6,942,546 - Desai , et al. September 13, 2
2005-09-13
Advanced chemical mechanical polishing system with smart endpoint detection
Grant 6,857,947 - Wang , et al. February 22, 2
2005-02-22
Advanced chemical mechanical polishing system with smart endpoint detection
App 20040023606 - Wang, Yuchun ;   et al.
2004-02-05
In-situ endpoint detect for non-transparent polishing member
App 20030153246 - Desai, Mukesh ;   et al.
2003-08-14
Semiconductor chip reclamation technique involving multiple planarization processes
Grant 5,656,554 - Desai , et al. August 12, 1
1997-08-12
Direct negative from resistive ribbon
Grant 4,915,519 - Afzali-Ardakani , et al. April 10, 1
1990-04-10
Metal transfer to form printing master plate or printed circuit board
Grant 4,800,397 - Afzali-Ardakani , et al. January 24, 1
1989-01-24

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