Desai; Kishor
Patent Applications and Registrations
Patent applications and USPTO patent grants for Desai; Kishor.The latest application filed is for "low cte interposer".
Company Profile
0.42.42
- Desai; Kishor - Fremont CA
Patent Activity
| Patent | Date |
|---|---|
| Low CTE interposer Grant 10,319,673 - Haba , et al. | 2019-06-11 |
| Low Cte Interposer App 20180082935 - Haba; Belgacem ; et al. | 2018-03-22 |
| Low cost hybrid high density package Grant 9,875,955 - Desai , et al. January 23, 2 | 2018-01-23 |
| Low CTE interposer Grant 9,837,344 - Haba , et al. December 5, 2 | 2017-12-05 |
| Low cost hybrid high density package App 20170077018 - DESAI; Kishor ; et al. | 2017-03-16 |
| Low Cte Interposer App 20170053857 - Haba; Belgacem ; et al. | 2017-02-23 |
| Molded glass lid for wafer level packaging of opto-electronic assemblies Grant 9,575,266 - Desai , et al. February 21, 2 | 2017-02-21 |
| Coupling light from a waveguide array to single mode fiber array Grant 9,557,499 - Kachru , et al. January 31, 2 | 2017-01-31 |
| Low cost hybrid high density package Grant 9,508,687 - Desai , et al. November 29, 2 | 2016-11-29 |
| Single mode fiber array connector for opto-electronic transceivers Grant 9,435,965 - Togami , et al. September 6, 2 | 2016-09-06 |
| Low-stress TSV design using conductive particles Grant 9,433,100 - Woychik , et al. August 30, 2 | 2016-08-30 |
| Arrangement for placement and alignment of opto-electronic components Grant 9,417,412 - Shastri , et al. August 16, 2 | 2016-08-16 |
| Low CTE interposer Grant 9,401,288 - Haba , et al. July 26, 2 | 2016-07-26 |
| Arrangement For Placement And Alignment Of Opto-electronic Components App 20160209606 - SHASTRI; Kalpendu ; et al. | 2016-07-21 |
| Coupling Light From A Waveguide Array To Single Mode Fiber Array App 20160161684 - KACHRU; Ravinder ; et al. | 2016-06-09 |
| Wafer scale packaging platform for transceivers Grant 9,343,450 - Shastri , et al. May 17, 2 | 2016-05-17 |
| Coupling light from a waveguide array to single mode fiber array Grant 9,274,290 - Kachru , et al. March 1, 2 | 2016-03-01 |
| Self-aligning optical connector assembly Grant 9,235,019 - Shastri , et al. January 12, 2 | 2016-01-12 |
| Releasable fiber connector for opto-electronic assemblies Grant 9,213,152 - Shastri , et al. December 15, 2 | 2015-12-15 |
| Flow underfill for microelectronic packages Grant 9,196,581 - Haba , et al. November 24, 2 | 2015-11-24 |
| Molded Glass Lid For Wafer Level Packaging Of Opto-electronic Assemblies App 20150277068 - DESAI; Kishor ; et al. | 2015-10-01 |
| Low Cost Hybrid High Density Package App 20150171058 - Desai; Kishor ; et al. | 2015-06-18 |
| Molded glass lid for wafer level packaging of opto-electronic assemblies Grant 9,052,445 - Desai , et al. June 9, 2 | 2015-06-09 |
| Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components Grant 9,031,107 - Shastri , et al. May 12, 2 | 2015-05-12 |
| Low cost hybrid high density package Grant 8,963,310 - Desai , et al. February 24, 2 | 2015-02-24 |
| Interposer Configuration With Thermally Isolated Regions For Temperature-sensitive Opto-electronic Components App 20150023377 - SHASTRI; Kalpendu ; et al. | 2015-01-22 |
| Self-aligning Connectorized Fiber Array Assembly App 20150016784 - SHASTRI; Kalpendu ; et al. | 2015-01-15 |
| Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components Grant 8,905,632 - Shastri , et al. December 9, 2 | 2014-12-09 |
| Self-aligning connectorized fiber array assembly Grant 8,876,410 - Shastri , et al. November 4, 2 | 2014-11-04 |
| Low Cte Interposer App 20140322864 - Haba; Belgacem ; et al. | 2014-10-30 |
| Arrangement for placement and alignment of opto-electronic components Grant 8,830,466 - Shastri , et al. September 9, 2 | 2014-09-09 |
| Wafer Scale Packaging Platform For Transceivers App 20140248723 - SHASTRI; Kalpendu ; et al. | 2014-09-04 |
| Wafer scale packaging platform for transceivers Grant 8,803,269 - Shastri , et al. August 12, 2 | 2014-08-12 |
| Flow Underfill For Microelectronic Packages App 20140217584 - Haba; Belgacem ; et al. | 2014-08-07 |
| Low-stress Tsv Design Using Conductive Particles App 20140201994 - Woychik; Charles G. ; et al. | 2014-07-24 |
| Low CTE interposer Grant 8,780,576 - Haba , et al. July 15, 2 | 2014-07-15 |
| Coupling Light From A Waveguide Array To Single Mode Fiber Array App 20140169734 - KACHRU; Ravinder ; et al. | 2014-06-19 |
| Low-stress TSV design using conductive particles Grant 8,723,049 - Woychik , et al. May 13, 2 | 2014-05-13 |
| No flow underfill Grant 8,697,492 - Haba , et al. April 15, 2 | 2014-04-15 |
| Interposer Configuration With Thermally Isolated Regions For Temperature-Sensitive Opto-Electronic Components App 20140003457 - Shastri; Kalpendu ; et al. | 2014-01-02 |
| Arrangement For Placement And Alignment Of Opto-Electronic Components App 20130314707 - Shastri; Kalpendu ; et al. | 2013-11-28 |
| Area array quad flat no-lead (QFN) package Grant 8,525,312 - Low , et al. September 3, 2 | 2013-09-03 |
| Flip-chip QFN structure using etched lead frame Grant 8,525,309 - Chia , et al. September 3, 2 | 2013-09-03 |
| Single Mode Fiber Array Connector For Opto-Electronic Transceivers App 20130202255 - Togami; Chris Kiyoshi ; et al. | 2013-08-08 |
| Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors App 20130188970 - Shastri; Kalpendu ; et al. | 2013-07-25 |
| Releasable Fiber Connector For Opto-Electronic Assemblies App 20130182996 - Shastri; Kalpendu ; et al. | 2013-07-18 |
| Self-Aligning Connectorized Fiber Array Assembly App 20130183008 - Shastri; Kalpendu ; et al. | 2013-07-18 |
| Molded Glass Lid For Wafer Level Packaging Of Opto-Electronic Assemblies App 20130101250 - Desai; Kishor ; et al. | 2013-04-25 |
| Low Cte Interposer App 20130063918 - Haba; Belgacem ; et al. | 2013-03-14 |
| Low Cost Hybrid High Density Package App 20130049179 - Desai; Kishor ; et al. | 2013-02-28 |
| Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts Grant 8,378,478 - Desai , et al. February 19, 2 | 2013-02-19 |
| Area Array Qfn App 20130037925 - Low; Qwai H. ; et al. | 2013-02-14 |
| Flip-chip Qfn Structure Using Etched Lead Frame App 20130001757 - Chia; Chok ; et al. | 2013-01-03 |
| Low-stress Tsv Design Using Conductive Particles App 20120314384 - Woychik; Charles G. ; et al. | 2012-12-13 |
| Wafer Scale Packaging Platform For Transceivers App 20120280344 - Shastri; Kalpendu ; et al. | 2012-11-08 |
| Enhanced Stacked Microelectronic Assemblies With Central Contacts And Vias Connected To The Central Contacts App 20120126389 - Desai; Kishor ; et al. | 2012-05-24 |
| No Flow Underfill App 20120104595 - Haba; Belgacem ; et al. | 2012-05-03 |
| Method of protecting fuses in an integrated circuit die App 20060128072 - Rajagopalan; Sarathy ; et al. | 2006-06-15 |
| Multi chip module assembly Grant 7,041,516 - Rajagopalan , et al. May 9, 2 | 2006-05-09 |
| Multi chip module Grant 6,858,930 - Miller , et al. February 22, 2 | 2005-02-22 |
| Novel solution for low cost, speedy probe cards App 20040239350 - Nagar, Mohan R. ; et al. | 2004-12-02 |
| Method of forming electrolytic contact pads including layers of copper, nickel, and gold Grant 6,777,314 - Desai , et al. August 17, 2 | 2004-08-17 |
| Multi chip module assembly App 20040072377 - Rajagopalan, Sarathy ; et al. | 2004-04-15 |
| Multi chip module App 20040065951 - Miller, Leah M. ; et al. | 2004-04-08 |
| Electrolytic contact pads App 20040023481 - Desai, Kishor ; et al. | 2004-02-05 |
| Multi chip module Grant 6,680,532 - Miller , et al. January 20, 2 | 2004-01-20 |
| Dual chip in package with a wire bonded die mounted to a substrate Grant 6,586,825 - Rajagopalan , et al. July 1, 2 | 2003-07-01 |
| Flip chip ball grid array package with laminated substrate Grant 6,133,064 - Nagarajan , et al. October 17, 2 | 2000-10-17 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 