| Patent | Date |
|---|
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20220013434 - Vadhavkar; Sameer S. ; et al. | 2022-01-13 |
Systems For Thermally Treating Conductive Elements On Semiconductor And Wafer Structures
App 20210335741 - Derderian; James M. | 2021-10-28 |
Bonding pads with thermal pathways
Grant 11,139,258 - Gandhi , et al. October 5, 2 | 2021-10-05 |
Methods and apparatuses for reflowing conductive elements of semiconductor devices
Grant 11,081,458 - Derderian August 3, 2 | 2021-08-03 |
Carrier removal by use of multilayer foil
Grant 10,861,765 - Derderian , et al. December 8, 2 | 2020-12-08 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material
Grant 10,748,878 - Vadhavkar , et al. A | 2020-08-18 |
Bonding Pads With Thermal Pathways
App 20200176404 - GANDHI; JASPREET S. ; et al. | 2020-06-04 |
Bonding pads with thermal pathways
Grant 10,580,746 - Gandhi , et al. | 2020-03-03 |
Bonding pads with thermal pathways
Grant 10,573,612 - Gandhi , et al. Feb | 2020-02-25 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material
Grant 10,559,551 - Vadhavkar , et al. Feb | 2020-02-11 |
Methods for processing semiconductor dice and fabricating assemblies incorporating same
Grant 10,559,495 - Bayless , et al. Feb | 2020-02-11 |
Semiconductor device test apparatuses comprising at least one test site having an array of pockets
Grant 10,481,200 - Gandhi , et al. Nov | 2019-11-19 |
Semiconductor Device Assembly With Heat Transfer Structure Formed From Semiconductor Material
App 20190348401 - Vadhavkar; Sameer S. ; et al. | 2019-11-14 |
Carrier Removal By Use of Multilayer Foil
App 20190341325 - Derderian; James M. ; et al. | 2019-11-07 |
Carrier removal by use of multilayer foil
Grant 10,431,519 - Derderian , et al. O | 2019-10-01 |
Methods And Apparatuses For Reflowing Conductive Elements Of Semiconductor Devices
App 20190252337 - Derderian; James M. | 2019-08-15 |
Semiconductor Device Assembly With Heat Transfer Structure Formed From Semiconductor Material
App 20190229096 - Vadhavkar; Sameer S. ; et al. | 2019-07-25 |
Methods For Processing Semiconductor Dice And Fabricating Assemblies Incorporating Same
App 20190198388 - Bayless; Andrew M. ; et al. | 2019-06-27 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material
Grant 10,297,577 - Vadhavkar , et al. | 2019-05-21 |
Semiconductor Device Test Apparatuses
App 20190072608 - Gandhi; Jaspreet S. ; et al. | 2019-03-07 |
Bonding Pads With Thermal Pathways
App 20180374810 - Gandhi; Jaspreet S. ; et al. | 2018-12-27 |
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
Grant 10,163,755 - Vadhavkar , et al. Dec | 2018-12-25 |
Bonding pads with thermal pathways
Grant 10,163,830 - Gandhi , et al. Dec | 2018-12-25 |
Methods for processing semiconductor dice and fabricating assemblies incorporating same
Grant 10,163,693 - Bayless , et al. Dec | 2018-12-25 |
Bonding Pads With Thermal Pathways
App 20180358314 - Gandhi; Jaspreet S. ; et al. | 2018-12-13 |
Methods of testing semiconductor devices comprising a die stack having protruding conductive elements
Grant 10,126,357 - Gandhi , et al. November 13, 2 | 2018-11-13 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20180308785 - Vadhavkar; Sameer S. ; et al. | 2018-10-25 |
Method for mount tape die release system for thin die ejection
Grant 10,043,688 - Minnich , et al. August 7, 2 | 2018-08-07 |
Interconnect Structure With Improved Conductive Properties And Associated Systems And Methods
App 20180040592 - Gandhi; Jaspreet S. ; et al. | 2018-02-08 |
Semiconductor Device Assembly With Heat Transfer Structure Formed From Semiconductor Material
App 20170365584 - Vadhavkar; Sameer S. ; et al. | 2017-12-21 |
Interconnect structure with improved conductive properties and associated systems and methods
Grant 9,837,383 - Gandhi , et al. December 5, 2 | 2017-12-05 |
Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
Grant 9,837,396 - Vadhavkar , et al. December 5, 2 | 2017-12-05 |
Methods Of Testing Semiconductor Devices
App 20170336470 - Gandhi; Jaspreet S. ; et al. | 2017-11-23 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material
Grant 9,768,149 - Vadhavkar , et al. September 19, 2 | 2017-09-19 |
Semiconductor device test apparatuses
Grant 9,733,304 - Gandhi , et al. August 15, 2 | 2017-08-15 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20170229439 - Vadhavkar; Sameer S. ; et al. | 2017-08-10 |
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
Grant 9,691,746 - Vadhavkar , et al. June 27, 2 | 2017-06-27 |
Bonding Pads With Thermal Pathways
App 20170053881 - GANDHI; JASPREET S. ; et al. | 2017-02-23 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Associated Methods
App 20160372452 - Vadhavkar; Sameer S. ; et al. | 2016-12-22 |
Bonding pads with thermal pathways
Grant 9,515,002 - Gandhi , et al. December 6, 2 | 2016-12-06 |
Interconnect Structure With Improved Conductive Properties And Associated Systems And Methods
App 20160343689 - Gandhi; Jaspreet S. ; et al. | 2016-11-24 |
Semiconductor Device Assembly With Heat Transfer Structure Formed From Semiconductor Material
App 20160343687 - Vadhavkar; Sameer S. ; et al. | 2016-11-24 |
Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
Grant 9,443,744 - Vadhavkar , et al. September 13, 2 | 2016-09-13 |
Bonding Pads With Thermal Pathways
App 20160233139 - GANDHI; JASPREET S. ; et al. | 2016-08-11 |
Interconnect structure with improved conductive properties and associated systems and methods
Grant 9,412,675 - Gandhi , et al. August 9, 2 | 2016-08-09 |
Apparatus For Testing Stacked Die Assemblies, And Related Methods
App 20160084905 - Gandhi; Jaspreet S. ; et al. | 2016-03-24 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20160013173 - Vadhavkar; Sameer S. ; et al. | 2016-01-14 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Associated Methods
App 20160013115 - Vadhavkar; Sameer S. ; et al. | 2016-01-14 |
Interconnect Structure With Improved Conductive Properties And Associated Systems And Methods
App 20150333026 - Gandhi; Jaspreet S. ; et al. | 2015-11-19 |
Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween
Grant 8,101,459 - Derderian January 24, 2 | 2012-01-24 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
Grant 7,858,420 - Derderian , et al. December 28, 2 | 2010-12-28 |
Microelectronic imaging units
Grant 7,786,574 - Derderian , et al. August 31, 2 | 2010-08-31 |
Methods Of Manufacturing Imaging Device Packages
App 20100167451 - Derderian; James M. | 2010-07-01 |
Methods of manufacturing microelectronic imaging units on a microfeature workpiece
Grant 7,691,660 - Derderian , et al. April 6, 2 | 2010-04-06 |
Flip-chip image sensor packages and methods of fabricating the same
Grant 7,675,131 - Derderian March 9, 2 | 2010-03-09 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
Grant 7,655,507 - Derderian , et al. February 2, 2 | 2010-02-02 |
Electromagnetic Interference Shield Structures For Semiconductor Components
App 20090243012 - Vanam; Kiran Kumar ; et al. | 2009-10-01 |
Integrated Conductive Shield For Microelectronic Device Assemblies And Associated Methods
App 20090243051 - Vanam; Kiran Kumar ; et al. | 2009-10-01 |
Microelectronic Imaging Units
App 20090148969 - Derderian; James M. ; et al. | 2009-06-11 |
Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer
Grant 7,518,223 - Derderian April 14, 2 | 2009-04-14 |
Microelectronic imaging units having covered image sensors
Grant 7,511,374 - Derderian , et al. March 31, 2 | 2009-03-31 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
Grant 7,498,606 - Street , et al. March 3, 2 | 2009-03-03 |
Die package having an adhesive flow restriction area
Grant 7,491,570 - Street , et al. February 17, 2 | 2009-02-17 |
Die package having an adhesive flow restriction area
Grant 7,476,955 - Street , et al. January 13, 2 | 2009-01-13 |
Microelectronic Imaging Units and Methods of Manufacturing Microelectronic Imaging Units
App 20080268563 - Derderian; James M. ; et al. | 2008-10-30 |
Microelectronic imaging units
Grant 7,439,598 - Derderian , et al. October 21, 2 | 2008-10-21 |
Flip-chip image sensor packages and methods of fabricating the same
App 20080246133 - Derderian; James M. | 2008-10-09 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
App 20080241985 - Derderian; James M. ; et al. | 2008-10-02 |
Semiconductor substrate
Grant 7,427,811 - Derderian , et al. September 23, 2 | 2008-09-23 |
Methods of manufacturing microelectronic imaging units with discrete standoffs
Grant 7,416,913 - Hall , et al. August 26, 2 | 2008-08-26 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
Grant 7,417,294 - Hall , et al. August 26, 2 | 2008-08-26 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
Grant 7,402,453 - Derderian , et al. July 22, 2 | 2008-07-22 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
Grant 7,364,934 - Street , et al. April 29, 2 | 2008-04-29 |
Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another
Grant 7,335,533 - Derderian February 26, 2 | 2008-02-26 |
Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween
Grant 7,332,372 - Derderian February 19, 2 | 2008-02-19 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
App 20070287216 - Derderian; James M. ; et al. | 2007-12-13 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
Grant 7,276,393 - Derderian , et al. October 2, 2 | 2007-10-02 |
Substrate with enhanced properties for planarization
Grant 7,262,488 - Draney , et al. August 28, 2 | 2007-08-28 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
App 20070117249 - Hall; Frank L. ; et al. | 2007-05-24 |
Die package having an adhesive flow restriction area
App 20070114646 - Street; Bret K. ; et al. | 2007-05-24 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
App 20070034979 - Derderian; James M. ; et al. | 2007-02-15 |
Semiconductor substrate
App 20060237822 - Derderian; James M. ; et al. | 2006-10-26 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
App 20060223207 - Derderian; James M. ; et al. | 2006-10-05 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
App 20060216850 - Street; Bret K. ; et al. | 2006-09-28 |
Substrate thinning including planarization
Grant 7,064,069 - Draney , et al. June 20, 2 | 2006-06-20 |
Process for strengthening semiconductor substrates following thinning
Grant 7,056,812 - Derderian , et al. June 6, 2 | 2006-06-06 |
Microelectronic Imaging units and methods of manufacturing microelectronic imaging units
App 20060046332 - Derderian; James M. ; et al. | 2006-03-02 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
App 20060035402 - Street; Bret K. ; et al. | 2006-02-16 |
Methods for designing spacers for use in stacking semiconductor devices or semiconductor device components
App 20060035408 - Derderian; James M. | 2006-02-16 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
App 20060024856 - Derderian; James M. ; et al. | 2006-02-02 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
App 20060014313 - Hall; Frank L. ; et al. | 2006-01-19 |
Thinned, strengthened semiconductor substrates and packages including same
Grant 6,940,181 - Derderian , et al. September 6, 2 | 2005-09-06 |
Die package having an adhesive flow restriction area
App 20050156266 - Street, Bret K. ; et al. | 2005-07-21 |
Die package having an adhesive flow restriction area
App 20050151272 - Street, Bret K. ; et al. | 2005-07-14 |
Process for strengthening semiconductor substrates following thinning
App 20050095812 - Derderian, James M. ; et al. | 2005-05-05 |
Substrate with enhanced properties for planarization
App 20050090107 - Draney, Nathan R. ; et al. | 2005-04-28 |
Substrate thinning including planarization
App 20050085050 - Draney, Nathan R. ; et al. | 2005-04-21 |
Process for strengthening semiconductor substrates following thinning
App 20050085008 - Derderian, James M. ; et al. | 2005-04-21 |
Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another
App 20050067684 - Derderian, James M. | 2005-03-31 |
Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
Grant 6,870,269 - Derderian March 22, 2 | 2005-03-22 |
Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
Grant 6,869,828 - Derderian March 22, 2 | 2005-03-22 |
Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween
App 20040200885 - Derderian, James M. | 2004-10-14 |
Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween
App 20040157375 - Derderian, James M. | 2004-08-12 |
Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
App 20030176018 - Derderian, James M. | 2003-09-18 |
Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
Grant 6,569,709 - Derderian May 27, 2 | 2003-05-27 |
Assemblies Including Stacked Semiconductor Devices Separated A Distance Defined By Adhesive Material Interposed Therebetween, Packages Including The Assemblies, And Methods
App 20030071340 - Derderian, James M. | 2003-04-17 |
Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
App 20030071362 - Derderian, James M. | 2003-04-17 |
Spacer for semiconductor devices, semiconductor devices and assemblies including the spacer, and methods
App 20030038357 - Derderian, James M. | 2003-02-27 |
Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer
App 20030038355 - Derderian, James M. | 2003-02-27 |
Assemblies including stacked semiconductor devices separated by discrete conductive elements therebetween, packages including the assemblies, and methods
App 20030038353 - Derderian, James M. | 2003-02-27 |
Semiconductor devices including stacking spacers thereon, assemblies including the semiconductor devices, and methods
App 20030038356 - Derderian, James M. | 2003-02-27 |
Assemblies including stacked semiconductor devices separated by discrete conductive elements therebetween, packages including the assemblies, and methods
App 20030038354 - Derderian, James M. | 2003-02-27 |
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