loadpatents
Patent applications and USPTO patent grants for Derakhshandeh; Jaber.The latest application filed is for "method for bonding semiconductor components".
Patent | Date |
---|---|
Method for the electrical bonding of semiconductor components Grant 11,362,061 - Hou , et al. June 14, 2 | 2022-06-14 |
Method For Bonding Semiconductor Components App 20210159207 - Derakhshandeh; Jaber ;   et al. | 2021-05-27 |
Method For The Electrical Bonding Of Semiconductor Components App 20200402950 - Hou; Lin ;   et al. | 2020-12-24 |
Thin NiB or CoB capping layer for non-noble metallic bonding landing pads Grant 10,066,303 - Beyne , et al. September 4, 2 | 2018-09-04 |
Method for self-aligned solder reflow bonding and devices obtained thereof Grant 9,978,710 - Dubey , et al. May 22, 2 | 2018-05-22 |
Method For Self-aligned Solder Reflow Bonding And Devices Obtained Thereof App 20170194283 - Dubey; Vikas ;   et al. | 2017-07-06 |
Thin Nib Or Cob Capping Layer For Non-noble Metallic Bonding Landing Pads App 20150247244 - Beyne; Eric ;   et al. | 2015-09-03 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.