Derakhshandeh; Jaber
Patent Applications and Registrations
Patent applications and USPTO patent grants for Derakhshandeh; Jaber.The latest application filed is for "method for bonding semiconductor components".
- Derakhshandeh; Jaber - Tienen BE
- Derakhshandeh; Jaber - Leuven BE
- Derakhshandeh; Jaber - Tlenen BE
| Patent | Date |
|---|---|
| Method for the electrical bonding of semiconductor components Grant 11,362,061 - Hou , et al. June 14, 2 | 2022-06-14 |
| Method For Bonding Semiconductor Components App 20210159207 - Derakhshandeh; Jaber ; et al. | 2021-05-27 |
| Method For The Electrical Bonding Of Semiconductor Components App 20200402950 - Hou; Lin ; et al. | 2020-12-24 |
| Thin NiB or CoB capping layer for non-noble metallic bonding landing pads Grant 10,066,303 - Beyne , et al. September 4, 2 | 2018-09-04 |
| Method for self-aligned solder reflow bonding and devices obtained thereof Grant 9,978,710 - Dubey , et al. May 22, 2 | 2018-05-22 |
| Method For Self-aligned Solder Reflow Bonding And Devices Obtained Thereof App 20170194283 - Dubey; Vikas ; et al. | 2017-07-06 |
| Thin Nib Or Cob Capping Layer For Non-noble Metallic Bonding Landing Pads App 20150247244 - Beyne; Eric ; et al. | 2015-09-03 |
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