DEPPISCH; Carl

Patent Applications and Registrations

Patent applications and USPTO patent grants for DEPPISCH; Carl.The latest application filed is for "varied ball ball-grid-array (bga) packages".

Company Profile

1.15.15

DEPPISCH; Carl - Tempe AZ
Deppisch; Carl - Chandler AZ US
Deppisch; Carl - Phoeniz AZ
Deppisch; Carl - Phoenix AZ
DEPPISCH, CARL - HAMDEN CT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Varied Ball Ball-grid-array (bga) Packages App 20210082798 - LU; Xiao ; et al.	2021-03-18
Forming a semiconductor package including a thermal interface material Grant 8,409,929 - Renavikar , et al. April 2, 2	2013-04-02
Composite solder TIM for electronic package Grant 8,242,602 - Fitzgerald , et al. August 14, 2	2012-08-14
Methods of fabricating robust integrated heat spreader designs and structures formed thereby Grant 8,174,113 - Gupta , et al. May 8, 2	2012-05-08
Forming A Semiconductor Package Including A Thermal Interface Material App 20110312131 - Renavikar; Mukul ; et al.	2011-12-22
Forming a semiconductor package including a thermal interface material Grant 8,030,757 - Renavikar , et al. October 4, 2	2011-10-04
Coated thermal interface in integrated circuit die Grant 7,955,900 - Jadhav , et al. June 7, 2	2011-06-07
Heat sink with preattached thermal interface material and method of making same Grant 7,821,126 - Houle , et al. October 26, 2	2010-10-26
Composite solder TIM for electronic package Grant 7,816,250 - Fitzgerald , et al. October 19, 2	2010-10-19
Composite Solder Tim For Electronic Package App 20100259890 - Fitzgerald; Tom ; et al.	2010-10-14
Reactive gettering in phase change solders to inhibit oxidation at contact surfaces Grant 7,727,815 - Kumaus , et al. June 1, 2	2010-06-01
Methods of fabricating robust integrated heat spreader designs and structures formed thereby App 20100065246 - Gupta; Abhishek ; et al.	2010-03-18
In-situ alloyed solders, articles made thereby, and processes of making same Grant 7,494,041 - Martin , et al. February 24, 2	2009-02-24
Forming a semiconductor package including a thermal interface material App 20090001557 - Renavikar; Mukul ; et al.	2009-01-01
Capillary underflow integral heat spreader Grant 7,439,617 - Deppisch , et al. October 21, 2	2008-10-21
Flux precoated solder preform for thermal interface material App 20080239660 - Mustapha; Lateef ; et al.	2008-10-02
Heat sink with preattached thermal interface material and method of making same Grant 7,416,922 - Houle , et al. August 26, 2	2008-08-26
Heat Sink With Preattached Thermal Interface Material And Method Of Making Same App 20080174007 - Houle; Sabina J. ; et al.	2008-07-24
Composite solder TIM for electronic package App 20080090405 - Fitzgerald; Tom ; et al.	2008-04-17
Capillary underflow integral heat spreader App 20080017975 - Deppisch; Carl ; et al.	2008-01-24
Coated Thermal Interface In Integrated Circuit Die App 20070231967 - Jadhav; Susheel G. ; et al.	2007-10-04
Thermal interface apparatus, systems, and methods Grant 7,164,585 - Jadhav , et al. January 16, 2	2007-01-16
Device and system for heat spreader with controlled thermal expansion Grant 7,081,669 - Fitzgerald , et al. July 25, 2	2006-07-25
In-situ alloyed solders, articles made thereby, and processes of making same App 20050284918 - Martin, Edward L. ; et al.	2005-12-29
Device And System For Heat Spreader With Controlled Thermal Expansion App 20050121775 - Fitzgerald, Thomas J. ; et al.	2005-06-09
Heat sink with preattached thermal interface material and method of making same App 20040188814 - Houle, Sabina J. ; et al.	2004-09-30
Thermal interface apparatus, systems, and methods App 20040190263 - Jadhav, Susheel G. ; et al.	2004-09-30
Grain Refined Tin Brass App 20010001400 - BRAUER, DENNIS R. ; et al.	2001-05-24
Iron modified tin brass Grant 6,132,528 - Brauer , et al. October 17, 2	2000-10-17

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