loadpatents
Patent applications and USPTO patent grants for Denny; Ronald R..The latest application filed is for "method and apparatus for improved data transfer in big data graph analytics".
Patent | Date |
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Method And Apparatus For Improved Data Transfer In Big Data Graph Analytics App 20210112019 - Reed; Coke S. ;   et al. | 2021-04-15 |
Method and apparatus for improved data transfer between processor cores Grant 10,893,003 - Reed , et al. January 12, 2 | 2021-01-12 |
Method And Apparatus For Improved Data Transfer Between Processor Cores App 20200195584 - Reed; Coke S. ;   et al. | 2020-06-18 |
Matrix vector multiply techniques Grant 9,930,117 - Reed , et al. March 27, 2 | 2018-03-27 |
Fast Fourier Transform Using a Distributed Computing System App 20160105494 - Reed; Coke S. ;   et al. | 2016-04-14 |
Matrix Vector Multiply Techniques App 20160094660 - Reed; Coke S. ;   et al. | 2016-03-31 |
Expandable fluid cooling structure Grant 8,534,347 - Denny , et al. September 17, 2 | 2013-09-17 |
System and method for managing addresses in a computing system Grant 8,037,259 - Leinberger , et al. October 11, 2 | 2011-10-11 |
Method for forming laminated multiple substrates Grant 8,028,403 - Pai , et al. October 4, 2 | 2011-10-04 |
Expandable fluid cooling structure App 20110168375 - Kowalski; Bobby Jim ;   et al. | 2011-07-14 |
System and method for interconnecting circuit boards Grant 7,819,667 - Kowalski , et al. October 26, 2 | 2010-10-26 |
Method and apparatus for a federation control plane in an orthogonal system Grant 7,802,046 - Kowalski , et al. September 21, 2 | 2010-09-21 |
Technique for laminating multiple substrates App 20090151158 - Pai; Deepak K. ;   et al. | 2009-06-18 |
System and method for interconnecting circuit boards App 20090149039 - Kowalski; Bobby Jim ;   et al. | 2009-06-11 |
Technique for laminating multiple substrates Grant 7,490,402 - Pai , et al. February 17, 2 | 2009-02-17 |
System and method for managing addresses in a computing system App 20080301390 - Leinberger; William J. ;   et al. | 2008-12-04 |
Method and apparatus for a federation control plane in an orthogonal system App 20080276031 - Kowalski; Bobby Jim ;   et al. | 2008-11-06 |
Technique for laminating multiple substrates App 20080066304 - Pai; Deepak K. ;   et al. | 2008-03-20 |
Laminated multiple substrates Grant 7,282,787 - Pai , et al. October 16, 2 | 2007-10-16 |
Laminated multilayer package Grant 6,856,008 - Pai , et al. February 15, 2 | 2005-02-15 |
Technique for laminating multiple substrates App 20040246688 - Pai, Deepak K. ;   et al. | 2004-12-09 |
Process for manufacturing laminated high layer count printed circuit boards Grant 6,742,247 - Pai , et al. June 1, 2 | 2004-06-01 |
Laminated multilayer package App 20040032028 - Pai, Deepak K. ;   et al. | 2004-02-19 |
Lamination of high-layer-count substrates App 20030174484 - Pai, Deepak K. ;   et al. | 2003-09-18 |
Method and apparatus for adjusting the clock delay in systems with multiple integrated circuits Grant 6,621,882 - Denny , et al. September 16, 2 | 2003-09-16 |
Method and apparatus for adjusting the clock delay in systems with multiple integrated circuits App 20030026367 - Denny, Ronald R. ;   et al. | 2003-02-06 |
Laminated multilayer substrates Grant 5,986,339 - Pai , et al. November 16, 1 | 1999-11-16 |
Laminated multilayer substrates Grant 5,786,238 - Pai , et al. July 28, 1 | 1998-07-28 |
Connector for orthogonally mounting circuit boards Grant 4,708,660 - Claeys , et al. November 24, 1 | 1987-11-24 |
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