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name:-0.012422800064087
name:-0.011934041976929
name:-0.00050187110900879
Denning; Dean J. Patent Filings

Denning; Dean J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Denning; Dean J..The latest application filed is for "method of making a die with recessed aluminum die pads".

Company Profile
0.11.10
  • Denning; Dean J. - Del Valle TX
  • Denning; Dean J. - Austin TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of making a die with recessed aluminum die pads
Grant 9,209,078 - Spencer , et al. December 8, 2
2015-12-08
Method Of Making A Die With Recessed Aluminum Die Pads
App 20140213050 - SPENCER; GREGORY S. ;   et al.
2014-07-31
Method of making a die with recessed aluminum die pads
Grant 8,722,530 - Spencer , et al. May 13, 2
2014-05-13
Method Of Making A Die With Recessed Alumium Die Pads
App 20130029485 - Spencer; Gregory S. ;   et al.
2013-01-31
Method For Forming A Semiconductor Device Having A Photodetector
App 20110027950 - Jones; Robert E. ;   et al.
2011-02-03
Method for plasma deposition of a substrate barrier layer
App 20040211661 - Zhang, Da ;   et al.
2004-10-28
Method for depositing barrier layers in an opening
App 20030203615 - Denning, Dean J. ;   et al.
2003-10-30
Method for processing semiconductor wafers in an enclosure with a treated interior surface
Grant 6,632,689 - Martin , et al. October 14, 2
2003-10-14
Method for processing semiconductor wafers in an enclosure with a treated interior surface
App 20030143820 - Martin, Richard E. ;   et al.
2003-07-31
Method of making an inlaid structure in a semiconductor device
App 20030134504 - Denning, Dean J. ;   et al.
2003-07-17
Method for forming a barrier layer for use in a copper interconnect
App 20020092763 - Denning, Dean J. ;   et al.
2002-07-18
Semiconductor device adhesive layer structure and process for forming structure
Grant 6,294,458 - Zhang , et al. September 25, 2
2001-09-25
Method for forming a semiconductor device
Grant 6,218,302 - Braeckelmann , et al. April 17, 2
2001-04-17
Inert plasma gas surface cleaning process performed insitu with physical vapor deposition (PVD) of a layer of material
Grant 6,187,682 - Denning , et al. February 13, 2
2001-02-13
Method for forming a conductive structure having a composite or amorphous barrier layer
Grant 6,136,682 - Hegde , et al. October 24, 2
2000-10-24
Process for forming a semiconductor device
Grant 5,893,752 - Zhang , et al. April 13, 1
1999-04-13
Temperature controlled process for the epitaxial growth of a film of material
Grant 5,308,788 - Fitch , et al. May 3, 1
1994-05-03

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