Deniz; Derya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Deniz; Derya.The latest application filed is for "piezoelectric bulk layers with tilted c-axis orientation and methods for making the same".

Company Profile

3.12.13

Deniz; Derya - McKinney TX
Deniz; Derya - Watervliet NY
Deniz; Derya - Troy NY
Deniz; Derya - Delmar NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Piezoelectric Bulk Layers With Tilted C-axis Orientation And Methods For Making The Same App 20220271726 - Deniz; Derya ; et al.	2022-08-25
Piezoelectric bulk layers with tilted c-axis orientation and methods for making the same Grant 11,401,601 - Deniz , et al. August 2, 2	2022-08-02
Piezoelectric bulk layers with tilted c-axis orientation and methods for making the same Grant 11,381,212 - Deniz , et al. July 5, 2	2022-07-05
Piezoelectric Bulk Layers With Tilted C-axis Orientation And Methods For Making The Same App 20210079515 - Deniz; Derya ; et al.	2021-03-18
Piezoelectric Bulk Layers With Tilted C-axis Orientation And Methods For Making The Same App 20190296707 - Deniz; Derya ; et al.	2019-09-26
Piezoelectric Bulk Layers With Tilted C-axis Orientation And Methods For Making The Same App 20190296710 - Deniz; Derya ; et al.	2019-09-26
Source/drain terminal contact and method of forming same Grant 9,583,397 - Deniz , et al. February 28, 2	2017-02-28
Methods of forming stressed fin channel structures for FinFET semiconductor devices Grant 9,117,930 - Kamineni , et al. August 25, 2	2015-08-25
Fabrication of nickel free silicide for semiconductor contact metallization Grant 9,076,787 - Deniz July 7, 2	2015-07-07
FinFET channel stress using tungsten contacts in raised epitaxial source and drain Grant 8,975,142 - Paul , et al. March 10, 2	2015-03-10
Fabrication Of Nickel Free Silicide For Semiconductor Contact Metallization App 20150061032 - DENIZ; Derya	2015-03-05
Methods Of Forming Stressed Fin Channel Structures For Finfet Semiconductor Devices App 20150041906 - Kamineni; Vimal K. ; et al.	2015-02-12
Fabrication of nickel free silicide for semiconductor contact metallization Grant 8,912,057 - Deniz December 16, 2	2014-12-16
Semiconductor Device Incorporating A Multi-function Layer Into The Gate Stacks App 20140361379 - Deniz; Derya	2014-12-11
Fabrication Of Nickel Free Silicide For Semiconductor Contact Metallization App 20140361375 - DENIZ; Derya	2014-12-11
Methods of forming stressed fin channel structures for FinFET semiconductor devices Grant 8,889,500 - Kamineni , et al. November 18, 2	2014-11-18
Finfet Channel Stress Using Tungsten Contacts In Raised Epitaxial Source And Drain App 20140319614 - PAUL; Abhijeet ; et al.	2014-10-30
Semiconductor device incorporating a multi-function layer into gate stacks Grant 8,859,368 - Deniz October 14, 2	2014-10-14
Semiconductor Device Incorporating A Multi-function Layer Into Gate Stacks App 20140061812 - Deniz; Derya	2014-03-06
Silicidation and/or germanidation on SiGe or Ge by cosputtering Ni and Ge and using an intralayer for thermal stability Grant 8,580,686 - Deniz November 12, 2	2013-11-12
Silicidation And/or Germanidation On Sige Or Ge By Cosputtering Ni And Ge And Using An Intralayer For Thermal Stability App 20130280907 - DENIZ; Derya	2013-10-24

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