DENG; Zilong

Patent Applications and Registrations

Patent applications and USPTO patent grants for DENG; Zilong.The latest application filed is for "photosensitive component, and camera module and manufacturing method therefor".

Company Profile

4.17.21

DENG; Zilong - Ningbo CN
Deng; Zilong - Zhejiang CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Photosensitive Component, And Camera Module And Manufacturing Method Therefor App 20220303437 - WANG; Mingzhu ; et al.	2022-09-22
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly And Manufacturing Method Thereof App 20220286592 - WANG; Mingzhu ; et al.	2022-09-08
Photosensitive component, and camera module and manufacturing method therefor Grant 11,388,320 - Wang , et al. July 12, 2	2022-07-12
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof Grant 11,363,184 - Wang , et al. June 14, 2	2022-06-14
Photosensitive Assembly And Camera Module And Manufacturing Method Thereof App 20220094822 - WANG; Mingzhu ; et al.	2022-03-24
Photosensitive assembly and camera module and manufacturing method thereof Grant 11,223,751 - Wang , et al. January 11, 2	2022-01-11
Photosensitive Component, And Camera Module And Manufacturing Method Therefor App 20210306530 - WANG; Mingzhu ; et al.	2021-09-30
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof App 20210203819 - WANG; Mingzhu ; et al.	2021-07-01
Photosensitive Assembly and Camera Module and Manufacturing Method Thereof App 20210127040 - WANG; Mingzhu ; et al.	2021-04-29
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof Grant 10,986,258 - Wang , et al. April 20, 2	2021-04-20
Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof App 20200336627 - WANG; Mingzhu ; et al.	2020-10-22
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof Grant 10,708,480 - Wang , et al.	2020-07-07
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof Grant 10,666,847 - Wang , et al.	2020-05-26
Camera module and molded circuit board assembly and manufacturing method thereof Grant 10,659,664 - Wang , et al.	2020-05-19
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof App 20200077002 - WANG; Mingzhu ; et al.	2020-03-05
Photosensitive assembly and camera module and manufacturing method thereof Grant 10,582,097 - Wang , et al.	2020-03-03
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof Grant 10,498,942 - Wang , et al. De	2019-12-03
Photosensitive Assembly and Camera Module and Manufacturing Method Thereof App 20190253585 - WANG; Mingzhu ; et al.	2019-08-15
Photosensitive assembly and camera module and manufacturing method thereof Grant 10,321,028 - Wang , et al.	2019-06-11
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof Grant 10,230,879 - Wang , et al.	2019-03-12
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof App 20190045097 - WANG; Mingzhu ; et al.	2019-02-07
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof Grant 10,171,716 - Wang , et al. J	2019-01-01
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof App 20180352128 - WANG; Mingzhu ; et al.	2018-12-06
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof Grant 10,136,041 - Wang , et al. November 20, 2	2018-11-20
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof Grant 10,129,451 - Wang , et al. November 13, 2	2018-11-13
Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof Grant 10,051,167 - Wang , et al. August 14, 2	2018-08-14
Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof App 20180167538 - WANG; Mingzhu ; et al.	2018-06-14
Camera module and molded circuit board assembly and manufacturing method thereof Grant 9,998,644 - Wang , et al. June 12, 2	2018-06-12
Camera module and molded circuit board assembly and manufacturing method thereof Grant 9,992,397 - Wang , et al. June 5, 2	2018-06-05
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof App 20180097978 - WANG; Mingzhu ; et al.	2018-04-05
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof App 20180091713 - WANG; Mingzhu ; et al.	2018-03-29
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof App 20180035032 - WANG; Mingzhu ; et al.	2018-02-01
Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof App 20180035029 - WANG; Mingzhu ; et al.	2018-02-01
Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof App 20180035021 - WANG; Mingzhu ; et al.	2018-02-01
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof App 20180035028 - WANG; Mingzhu ; et al.	2018-02-01
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof App 20180035022 - WANG; Mingzhu ; et al.	2018-02-01
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method Thereof App 20180035030 - WANG; Mingzhu ; et al.	2018-02-01
Photosensitive Assembly and Camera Module and Manufacturing Method Thereof App 20180007244 - WANG; Mingzhu ; et al.	2018-01-04

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