Deng; Jiang Wen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Deng; Jiang Wen.The latest application filed is for "atomization mechanism for cooling a bond head".
- Deng; Jiang Wen - Kwai Chung HK
- Deng; Jiang Wen - Hong Kong CN
| Patent | Date |
|---|---|
| Atomization mechanism for cooling a bond head Grant 10,312,214 - Law , et al. | 2019-06-04 |
| Atomization Mechanism For Cooling A Bond Head App 20180068973 - LAW; Yi Kei ; et al. | 2018-03-08 |
| 3D display alignment method Grant 9,519,152 - Wong , et al. December 13, 2 | 2016-12-13 |
| 3d Display Alignment Method And Apparatus App 20150162362 - WONG; Chi Shing ; et al. | 2015-06-11 |
| Image-assisted system for adjusting a bonding tool Grant 8,777,086 - Deng , et al. July 15, 2 | 2014-07-15 |
| Image-assisted System For Adjusting A Bonding Tool App 20130277413 - DENG; Jiang Wen ; et al. | 2013-10-24 |
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