Den Dekker; Arnoldus

Patent Applications and Registrations

Patent applications and USPTO patent grants for Den Dekker; Arnoldus.The latest application filed is for "microelectronic package and method of manufacturing a microelectronic package".

Company Profile

1.7.5

Den Dekker; Arnoldus - Beuningen NL
DEN DEKKER; Arnoldus - CP Beuningen NL
Den Dekker; Arnoldus - Nijmegen N/A NL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaging structure of a microelectronic device having a hermeticity improved by a diffusion barrier layer Grant 10,532,924 - Saint-Patrice , et al. Ja	2020-01-14
Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole Grant 9,908,773 - Saint-Patrice , et al. March 6, 2	2018-03-06
Microelectronic Package And Method Of Manufacturing A Microelectronic Package App 20170144883 - HENN; Gudrun ; et al.	2017-05-25
Packaging Structure Of A Microelectronic Device Having A Hermeticity Improved By A Diffusion Barrier Layer App 20170057809 - SAINT-PATRICE; Damien ; et al.	2017-03-02
Method For Packaging A Microelectronic Device In A Hermetically Sealed Cavity And Managing The Atmosphere Of The Cavity With A Dedicated Hole App 20160304338 - SAINT-PATRICE; Damiel ; et al.	2016-10-20
Method of hermetically sealing a hole with a fuse material Grant 9,199,839 - Pornin , et al. December 1, 2	2015-12-01
Electronic device Grant 8,901,703 - Den Dekker , et al. December 2, 2	2014-12-02
Etching with improved control of critical feature dimensions at the bottom of thick layers Grant 8,282,845 - Knotter , et al. October 9, 2	2012-10-09
Method of manufacturing an integrated circuit Grant 8,138,087 - Morel , et al. March 20, 2	2012-03-20
Method Of Manufacturing An Integrated Circuit App 20090267232 - Morel; Stephane ; et al.	2009-10-29
Electronic Device App 20070228514 - Den Dekker; Arnoldus ; et al.	2007-10-04

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