Demura; Akihiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Demura; Akihiro.The latest application filed is for "substrate for mounting electronic part".
- Demura; Akihiro - Ohgaki JP
- Demura; Akihiro - Ogaki JP
| Patent | Date |
|---|---|
| Substrate for mounting electronic part Grant 6,011,222 - Sekiya , et al. January 4, 2 | 2000-01-04 |
| Laminating type molded coil Grant 5,652,561 - Inoh , et al. July 29, 1 | 1997-07-29 |
| Printed wiring board having indications thereon covered by insulation Grant 5,512,712 - Iwata , et al. April 30, 1 | 1996-04-30 |
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