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Patent applications and USPTO patent grants for Demm; Ernst H..The latest application filed is for "generation of metal holes by via mutation".
Patent | Date |
---|---|
Generation of metal holes by via mutation Grant 8,378,493 - Wong , et al. February 19, 2 | 2013-02-19 |
Generation Of Metal Holes By Via Mutation App 20110079921 - Wong; Robert C. ;   et al. | 2011-04-07 |
Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutation Grant 7,875,544 - Wong , et al. January 25, 2 | 2011-01-25 |
Generation of metal holes by via mutation App 20070118828 - Wong; Robert C. ;   et al. | 2007-05-24 |
Generation of metal holes by via mutation Grant 7,188,321 - Wong , et al. March 6, 2 | 2007-03-06 |
Generation of metal holes by via mutation App 20050098898 - Wong, Robert C. ;   et al. | 2005-05-12 |
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